CN1385884A - 一种新的底部抗反射薄膜结构 - Google Patents
一种新的底部抗反射薄膜结构 Download PDFInfo
- Publication number
- CN1385884A CN1385884A CN 02112149 CN02112149A CN1385884A CN 1385884 A CN1385884 A CN 1385884A CN 02112149 CN02112149 CN 02112149 CN 02112149 A CN02112149 A CN 02112149A CN 1385884 A CN1385884 A CN 1385884A
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- Prior art keywords
- barc
- inorganic
- organic
- reflection film
- film structure
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- 229920002120 photoresistant polymer Polymers 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 16
- 238000005530 etching Methods 0.000 abstract description 13
- 239000010408 film Substances 0.000 description 25
- 230000003667 anti-reflective effect Effects 0.000 description 11
- 238000001259 photo etching Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 8
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010849 ion bombardment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Images
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- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02112149 CN1200450C (zh) | 2002-06-20 | 2002-06-20 | 一种新的底部抗反射薄膜结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02112149 CN1200450C (zh) | 2002-06-20 | 2002-06-20 | 一种新的底部抗反射薄膜结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1385884A true CN1385884A (zh) | 2002-12-18 |
CN1200450C CN1200450C (zh) | 2005-05-04 |
Family
ID=4741911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02112149 Expired - Lifetime CN1200450C (zh) | 2002-06-20 | 2002-06-20 | 一种新的底部抗反射薄膜结构 |
Country Status (1)
Country | Link |
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CN (1) | CN1200450C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1855516B (zh) * | 2005-04-20 | 2010-05-12 | 上海集成电路研发中心有限公司 | 利用有机涂层制造半导体图象传感器的方法 |
CN101770940B (zh) * | 2008-12-31 | 2012-04-18 | 中芯国际集成电路制造(上海)有限公司 | 叠层底部抗反射结构及刻蚀方法 |
CN103094072A (zh) * | 2011-11-01 | 2013-05-08 | 无锡华润上华科技有限公司 | 改善晶圆上栅极光刻关键尺寸均匀性的方法 |
CN104064450A (zh) * | 2013-03-19 | 2014-09-24 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件的制造方法 |
-
2002
- 2002-06-20 CN CN 02112149 patent/CN1200450C/zh not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1855516B (zh) * | 2005-04-20 | 2010-05-12 | 上海集成电路研发中心有限公司 | 利用有机涂层制造半导体图象传感器的方法 |
CN101770940B (zh) * | 2008-12-31 | 2012-04-18 | 中芯国际集成电路制造(上海)有限公司 | 叠层底部抗反射结构及刻蚀方法 |
CN103094072A (zh) * | 2011-11-01 | 2013-05-08 | 无锡华润上华科技有限公司 | 改善晶圆上栅极光刻关键尺寸均匀性的方法 |
WO2013064025A1 (zh) * | 2011-11-01 | 2013-05-10 | 无锡华润上华科技有限公司 | 改善晶圆上栅极光刻关键尺寸均匀性的方法 |
CN103094072B (zh) * | 2011-11-01 | 2016-03-30 | 无锡华润上华科技有限公司 | 改善晶圆上栅极光刻关键尺寸均匀性的方法 |
CN104064450A (zh) * | 2013-03-19 | 2014-09-24 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1200450C (zh) | 2005-05-04 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG (GROUP) CO., LTD.; SHANGHAI IC R Free format text: FORMER OWNER: SHANGHAI HUAHONG (GROUP) CO., LTD. Effective date: 20060901 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20060901 Address after: 201203 No. 177 blue wave road, Zhangjiang hi tech park, Shanghai, Pudong New Area Patentee after: SHANGHAI HUA HONG (Group) Co.,Ltd. Address before: 18, Huaihai Road, Shanghai, No. 200020, building 918 Co-patentee before: SHANGHAI IC R & D CENTER Co.,Ltd. Patentee before: SHANGHAI HUA HONG (Group) Co.,Ltd. |
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CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20050504 |