CN1335809A - 自扫描型发光元件阵列芯片的布置方法 - Google Patents
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Abstract
提供一种可完全除去不良芯片的发光元件阵列芯片的布置方法。把多个具有在一端的面上直线状排列的多个发光元件构成的发光元件阵列、和在另一端设置的多个焊盘的长方形自扫描型发光元件阵列芯片,在基板上布置成锯齿状。此时,以使芯片一端沿着与芯片布置方向垂直的方向上不重叠,且各发光元件的布置间距恒定的方式布置芯片,并以使芯片另一端沿着与芯片布置方向垂直的方向上重叠,且各发光元件的布置间距恒定的方式布置芯片。
Description
本发明涉及一种自扫描型发光元件阵列芯片的布置方法,尤其涉及一种可除去不良芯片的自扫描型发光元件阵列芯片的布置方法。更进一步,还涉及用这种方法布置而成的由多芯片构成的自扫描型发光装置,以及从布置的芯片中除去不良芯片的方法。
和普通的发光元件阵列芯片相比,自扫描型发光元件阵列芯片的特点是焊盘少。因此,其优点就是芯片的尺寸可以小一些。例如:若在长方形芯片两端配置焊盘,则即使考虑到焊盘自身的必要宽度在內,芯片宽度也能做小。但是,把许多芯片成列配置地构成自扫描型发光装置且把它用于光打印头时,如果把许多芯片都按直线状排列,则位于芯片端的发光元件之间的布置间距就难于保持恒定。为了避免这种情况,有在芯片端部重叠布置即锯齿状配置的方法(参见日本专利特开平8-216448号公报)。
图1是这种锯齿形布置方法的示意图。为说明方便起见,其XY坐标轴如图所示地确定。即X轴方向是芯片布置方向,Y轴方向是与芯片布置方向垂直的方向。
自扫描型发光元件阵列芯片10,两端设有焊盘12,在焊盘间以直线状设置着发光元件14。把这种发光元件阵列芯片10置于基板(图中未示)上,在Y轴方向芯片两端是重叠的,在X轴方向则呈锯齿状排列,用粘接剂固定在基板(图中未示)上。根据这种布置方法,多个芯片从头到尾其发光元件的配置间距都是相同的。
把多个芯片配置在基板上,经过模片键合、引线键合工艺后,总会有少数芯片原因不明地发生动作不良的现象。这时,安装着芯片的基板就要整体报废,成本就无端地增加了。为此,可采取用好的芯片把不良芯片换下的方法。实际做法是从芯片外侧用金属制的工具加力把芯片除去。但是在以往这种锯齿状排列的情况下,由于相邻芯片在Y方向是重叠排列的,为了只除去一片芯片,就要如图1所示,不得不用一种细而窄的金属工具16只向这一片芯片加力。但是,由于发光元件阵列芯片是用物理上很脆的砷化镓等化合物半导体制成的,在向用粘结剂固定在基板上的芯片的一部分加力时,通常芯片就会破碎,在Y方向重叠的部分就会大部分残留在基板上。要在不损伤与其相邻芯片的条件下把它们除去是非常困难的。
本发明的目的在于提供一种可完全除去不良芯片的自扫描型发光元件阵列芯片的布置方法。
本发明的另一目的在于提供一种用上述方法布置的多个自扫描型发光元件阵列芯片构成的自扫描型发光装置。
本发明的再一个目的在于提供一种除去不良芯片的方法。
本发明所述的第一种形态是把长方形自扫描型发光元件阵列芯片在基板上以锯齿状布置的方法,该自扫描型发光元件阵列芯片在一端的面上有用多个发光元件呈直线状排列而成的发光元件阵列,而另一端则有多个焊盘。按照该布置方法,以使芯片的一端沿着垂直于芯片布置的方向彼此不重叠、且各发光元件的布置间距恒定的方式配置芯片,并以使芯片的另一端沿着垂直于芯片配置的方向彼此重叠、且各发光元件的布置间距也恒定的方式布置芯片。
自扫描型发光元件优选含有布置有多个三端子传送元件的三端子传送元件阵列、和布置有三端子发光元件的所述发光元件阵列,前者的用于控制阈值电压或阈值电流的各控制电极端通过第一电气装置相互连接,并通过第二电气装置和电源线相连,且其余两端子中有一端和时钟线相连;后者的各控制电极端用于控制阈值电压或阈值电流。
本发明第二种形态是具有按上述布置方法布置的多个自扫描型发光元件阵列芯片的自扫描型发光装置。
本发明第三种形态是一种可同时除去按上述布置方法布置的多个芯片中所含的不良芯片以及在垂直于芯片布置方向的方向上与不良芯片重叠的芯片的方法,在除去时,从不良芯片的或与不良芯片重叠设置的芯片的侧面沿着垂直于芯片布置方向的方向施加力。
图1:现有的锯齿状布置方法示意图;
图2:本发明所述自扫描型发光装置的等效电路图;
图3:本发明所述发光元件阵列芯片的尤其是焊盘的布置示意图;
图4:本发明的芯片布置方法示意图。
图2所示的是本发明的自扫描型发光元件阵列的等效电路图。该自扫描型发光元件阵列,具有其传送元件阵列部分和发光元件阵列部分相分离的结构。传送元件阵列部分有开关元件T1,T2,T3……等,发光元件阵列部分有写入用的发光元件L1,L2,L3……等。这些传送元件或发光元件都是由三端子半导体开关元件(thyristor)构成的。传送元件部分的结构采用与传送元件栅极相互电连接的二级管D1、D2、D3……等等。VGK是电源(一般为5V),通过负载电阻RL和各开关元件的栅极G1、G2、G3……等相连。而开关元件的各栅极G1、G2、G3……又与写入用的发光元件的栅极相连。开关元件T1的栅极上加有起动脉冲φs,开关元件的正极上交互地加有传送用时钟脉冲φ1,φ2,写入电路用的发光元件正极上加有写入信号φI。
现对其动作简要说明。首先,当传送用时钟脉冲φ1的电压处于高电位时,开关元件T2处于导通状态。此时,栅极G2的电位从VGK的5V几乎降到零。受其影响,二极管D2导通,栅极G3的电位设定为约1V(二极管D2的正向电压(等于扩散电位))。而且由于二极管D1处于反偏置状态,控制电极G1不导通,栅极G1的电位约为5V。由于发光半导体开关元件的导通电位近似为控制电极电位+PN结的扩散电位(约1V),若设定下一次传送用时钟脉冲φ2的高电位在约2V(开关元件T3的导通电压)以上、约4V(开关元件T5的导通电压)以下,则只有开关元件T3导通,其他开关元件都处于截止状态。因而使用两次传送用时钟脉冲就可使导通状态传送。
起动脉冲φs是一种用以表示上述传送动作开始的脉冲,若起动脉冲φs为低电位(约0V)而传送用时钟脉冲φ2为高电位(约2V~约4V)时,则开关元件T(1)导通。此后不久,起动脉冲φs便回复到高电位。
若开关元件T2处于导通状态,栅极G2接近零伏。而若写入信号φI的电压大于PN结的扩散电位(约1V),则发光元件L2处于发光状态。
此时,栅极G1约为5V,栅极G3约为1V。而发光元件L1的写入电压约需为6V,发光元件L3的写入电压约需为2V。因此,只有发光元件L2的写入用写入信号φI的电压在1~2V范围內。发光元件L2导通即处于发光状态,其发光强度取决于流过写入信号φI的电流值,用任意强度都能把图像写进去。另外,为了使发光状态传送到下一个发光元件,待写入信号φI线的电压一降到零,就必须使正在发光的发光元件立即截止。
本发明的自扫描型发光装置,可以用例如多个有600dpi/128发光点的自扫描型发光元件阵列的芯片(宽度很小、长约5.4mm的矩形芯片)布置而成。
图3是本发明的自扫描型发光元件阵列芯片20的尤其是焊盘的布置示意图。图中,φ1、φ2、φs和VGK分别表示用于时钟脉冲、起动脉冲、写入信号和电源VGK的焊盘。这些焊盘全都集中布置在芯片20的一侧。传送元件阵列22和发光元件阵列24布置在芯片20另一侧的表面上。
这种芯片布置方法示于图4。在图4中,为了图面简单起见,芯片只用发光元件14和焊盘(形状简化且放大地示出)26表示。
和图1相同地,芯片也在基板上布置成锯齿形,但是使有发光元件14的端部彼此在一起,发光元件14的布置间距不仅连续而且恒定(如图4中的芯片20-1和20-2所示),而且,使有焊盘26的端部彼此在一起,且发光元件14的布置间距也是连续而且恒定的,并且在Y轴方向上重叠布置(如图4中的芯片20-2和20-3所示)。
以下,同样地,在基板上以锯齿状连续地布置并固定,从而制成自扫描型发光装置。
在如上所述布置在基板上的芯片中,假如芯片20-2是不良芯片。在这种情况下,以不良芯片20-2和在Y轴方向重叠的芯片20-3这两个芯片为单位,如图4所示,用金属工具28贴在芯片20-3的侧面,在Y轴方向加力便可把这两片芯片同时除去。芯片20-2和芯片20-1在Y轴方向不重叠,同样,芯片20-2和芯片20-4在Y轴方向也不重叠。因此,在除去这两个芯片时,在相邻的芯片20-1和20-4上没有受力,因而可以只除去两个芯片。
根据本发明的自扫描型发光元件阵列芯片的布置方法,由于可以只除去不良芯片而不会损伤其他芯片,从而可以降低自扫描型发光装置的制造成本。
Claims (6)
1.一种自扫描型发光元件阵列芯片的布置方法,其中多个具有在一端的面上布置的由多个发光元件直线状排列构成的发光元件阵列、和在另一端设置的多个焊盘的长方形的自扫描型发光元件阵列芯片,在基板上以锯齿状布置,其特征在于:
以各发光元件的布置间距恒定、且在与芯片布置方向垂直的方向上使芯片的所述一端不重叠的方式布置芯片,并且以发光元件的布置间距恒定、且在与芯片布置方向垂直的方向上使芯片的所述另一端相重叠的方式布置芯片。
2.根据权利要求1所述的自扫描型发光元件阵列芯片的布置方法,其特征在于所述自扫描型发光元件阵列芯片包括:
自扫描型传送元件阵列,它是通过把布置着多个三端子传送元件的三端子传送元件阵列的各传送元件的控制电极借助于第一电气装置相互连接,并借助于第二电气装置将各传送元件的控制电极与电源线相连,且各传送元件的剩余两端中的一端与时钟线相连而形成的,上述三端子传送元件具有用于控制阈值电压或阈值电流的控制电极;以及
由多个三端子发光元件布置而成的所述发光元件阵列,上述三端子发光元件具有用于控制阈值电压或阈值电流的控制电极。
3.一种自扫描型发光装置,其特征在于:具有用根据权利要求1或2所述的布置方法布置的多个自扫描型发光元件阵列芯片。
4.一种不良芯片的除去方法,其特征在于:将用根据权利要求1或2所述的布置方法布置在基板上的多个芯片中的不良芯片,和在与芯片布置方向垂直的方向上与该不良芯片相重叠的芯片同时除去。
5.根据权利要求4所述的不良芯片的除去方法,其特征在于:在除去所述不良芯片以及与该不良芯片重叠的所述芯片时,从所述不良芯片的或与该不良芯片重叠的所述芯片的侧面沿与芯片布置方向垂直的方向施加力,予以除去。
6.根据权利要求4所述的不良芯片除去方法,其特征在于:所述的力是通过把金属工具顶着所述芯片的侧面施加的。
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JP266872/1999 | 1999-09-21 | ||
JP26687299A JP4092824B2 (ja) | 1999-09-21 | 1999-09-21 | 自己走査型発光素子アレイチップの配列方法 |
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CN1335809A true CN1335809A (zh) | 2002-02-13 |
CN1171735C CN1171735C (zh) | 2004-10-20 |
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US (1) | US6485994B1 (zh) |
EP (1) | EP1142720A4 (zh) |
JP (1) | JP4092824B2 (zh) |
KR (1) | KR20010093101A (zh) |
CN (1) | CN1171735C (zh) |
CA (1) | CA2351462A1 (zh) |
TW (1) | TW465126B (zh) |
WO (1) | WO2001021410A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103779345A (zh) * | 2014-01-13 | 2014-05-07 | 福建永德吉灯业股份有限公司 | Led组件的芯片电极连接结构 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4182727B2 (ja) * | 2002-11-15 | 2008-11-19 | 富士ゼロックス株式会社 | 自己走査型発光素子アレイ、光プリンタヘッド、光プリンタ |
JP2007136720A (ja) * | 2005-11-15 | 2007-06-07 | Fuji Xerox Co Ltd | Ledアレイヘッド及び画像記録装置 |
CN101443925B (zh) * | 2006-04-04 | 2012-02-22 | 富士施乐株式会社 | 带有微透镜的发光元件阵列以及光写入头 |
US9508618B2 (en) * | 2014-04-11 | 2016-11-29 | Globalfoundries Inc. | Staggered electrical frame structures for frame area reduction |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5942511B2 (ja) * | 1982-04-13 | 1984-10-15 | 株式会社東芝 | 密着センサ |
US4857801A (en) * | 1983-04-18 | 1989-08-15 | Litton Systems Canada Limited | Dense LED matrix for high resolution full color video |
EP0629507B1 (en) * | 1993-06-18 | 1997-12-03 | Xeikon Nv | Led recording head |
JP3224337B2 (ja) | 1994-12-13 | 2001-10-29 | 日本板硝子株式会社 | 発光チップおよびこれを用いた発光装置 |
JP3595044B2 (ja) * | 1995-10-05 | 2004-12-02 | 日本板硝子株式会社 | 自己走査型発光装置およびこれを用いた光プリンタ装置 |
JPH09283807A (ja) * | 1996-04-18 | 1997-10-31 | Oki Electric Ind Co Ltd | 受発光素子モジュール |
JPH09283808A (ja) * | 1996-04-19 | 1997-10-31 | Oki Electric Ind Co Ltd | 受発光素子モジュール及びチップ |
JP3581213B2 (ja) | 1996-04-26 | 2004-10-27 | ヤンマー農機株式会社 | 移植機 |
JPH10290025A (ja) * | 1997-04-15 | 1998-10-27 | Oki Electric Ind Co Ltd | Ledアレイ |
US5997152A (en) * | 1997-09-15 | 1999-12-07 | Oki Electric Industry Co., Ltd. | Light emitting element module and printer head using the same |
JP2000168126A (ja) * | 1998-12-03 | 2000-06-20 | Stanley Electric Co Ltd | Ledプリントヘッド及びその作製方法 |
-
1999
- 1999-09-21 JP JP26687299A patent/JP4092824B2/ja not_active Expired - Lifetime
-
2000
- 2000-09-18 WO PCT/JP2000/006345 patent/WO2001021410A1/ja not_active Application Discontinuation
- 2000-09-18 CN CNB008017530A patent/CN1171735C/zh not_active Expired - Lifetime
- 2000-09-18 CA CA002351462A patent/CA2351462A1/en not_active Abandoned
- 2000-09-18 US US09/856,084 patent/US6485994B1/en not_active Expired - Lifetime
- 2000-09-18 EP EP00961048A patent/EP1142720A4/en not_active Withdrawn
- 2000-09-18 KR KR1020017006384A patent/KR20010093101A/ko not_active Application Discontinuation
- 2000-09-20 TW TW089119324A patent/TW465126B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103779345A (zh) * | 2014-01-13 | 2014-05-07 | 福建永德吉灯业股份有限公司 | Led组件的芯片电极连接结构 |
CN103779345B (zh) * | 2014-01-13 | 2016-10-05 | 福建永德吉灯业股份有限公司 | Led组件的芯片电极连接结构 |
Also Published As
Publication number | Publication date |
---|---|
JP4092824B2 (ja) | 2008-05-28 |
WO2001021410A1 (fr) | 2001-03-29 |
JP2001088343A (ja) | 2001-04-03 |
EP1142720A1 (en) | 2001-10-10 |
KR20010093101A (ko) | 2001-10-27 |
US6485994B1 (en) | 2002-11-26 |
CN1171735C (zh) | 2004-10-20 |
TW465126B (en) | 2001-11-21 |
CA2351462A1 (en) | 2001-03-29 |
EP1142720A4 (en) | 2003-06-11 |
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