CN1317667C - 用于存储器连接处理的飞击射束路径误差校正 - Google Patents

用于存储器连接处理的飞击射束路径误差校正 Download PDF

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Publication number
CN1317667C
CN1317667C CNB028046862A CN02804686A CN1317667C CN 1317667 C CN1317667 C CN 1317667C CN B028046862 A CNB028046862 A CN B028046862A CN 02804686 A CN02804686 A CN 02804686A CN 1317667 C CN1317667 C CN 1317667C
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CN
China
Prior art keywords
axis
laser beam
mirror
workpiece
coordinate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB028046862A
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English (en)
Chinese (zh)
Other versions
CN1491398A (zh
Inventor
M·温拉斯
K·布吕朗
H·W·罗
S·斯瓦伦戈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
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Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of CN1491398A publication Critical patent/CN1491398A/zh
Application granted granted Critical
Publication of CN1317667C publication Critical patent/CN1317667C/zh
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lasers (AREA)
CNB028046862A 2001-02-16 2002-02-15 用于存储器连接处理的飞击射束路径误差校正 Expired - Lifetime CN1317667C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26964601P 2001-02-16 2001-02-16
US60/269,646 2001-02-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNA2007100915231A Division CN101172319A (zh) 2001-02-16 2002-02-15 用于存储器连接处理的飞击射束路径误差校正

Publications (2)

Publication Number Publication Date
CN1491398A CN1491398A (zh) 2004-04-21
CN1317667C true CN1317667C (zh) 2007-05-23

Family

ID=23028100

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA2007100915231A Pending CN101172319A (zh) 2001-02-16 2002-02-15 用于存储器连接处理的飞击射束路径误差校正
CNB028046862A Expired - Lifetime CN1317667C (zh) 2001-02-16 2002-02-15 用于存储器连接处理的飞击射束路径误差校正

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CNA2007100915231A Pending CN101172319A (zh) 2001-02-16 2002-02-15 用于存储器连接处理的飞击射束路径误差校正

Country Status (8)

Country Link
JP (3) JP4397163B2 (enExample)
KR (1) KR100821115B1 (enExample)
CN (2) CN101172319A (enExample)
CA (1) CA2438566A1 (enExample)
DE (1) DE10296339T5 (enExample)
GB (1) GB2390699B (enExample)
TW (1) TW535199B (enExample)
WO (1) WO2002067180A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US7363180B2 (en) * 2005-02-15 2008-04-22 Electro Scientific Industries, Inc. Method for correcting systematic errors in a laser processing system
US7297972B2 (en) * 2005-08-26 2007-11-20 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
US8026158B2 (en) * 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US8378259B2 (en) * 2008-06-17 2013-02-19 Electro Scientific Industries, Inc. Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
KR102143502B1 (ko) * 2010-10-22 2020-08-13 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법
WO2014152526A1 (en) * 2013-03-15 2014-09-25 Electro Scientific Industries, Inc. Laser systems and methods for aod tool settling for aod travel reduction
CN105102174B (zh) * 2013-03-15 2017-05-31 伊雷克托科学工业股份有限公司 基于激光放射所控制的射束定位器
CN111266741A (zh) * 2018-11-19 2020-06-12 深圳市圭华智能科技有限公司 激光加工系统及激光加工方法
JP7442351B2 (ja) * 2020-03-12 2024-03-04 株式会社ディスコ レーザー加工装置
JPWO2022038682A1 (enExample) * 2020-08-18 2022-02-24

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85101856A (zh) * 1985-04-01 1987-01-17 索尼公司 光信息再现设备
CN1053299A (zh) * 1990-01-05 1991-07-24 鲁道夫·赫尔工学博士股份公司 用于校正偏转光束位置误差的方法和装置
US5673110A (en) * 1993-01-26 1997-09-30 Phase Metrics, Inc. Multiplexed laser interferometer for non-dispersed spectrum detection in a dynamic flying height tester
CN1180221A (zh) * 1996-09-30 1998-04-29 大宇电子株式会社 控制光盘播放机的跟踪平衡装置和方法
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US6088107A (en) * 1998-10-20 2000-07-11 Trw Inc. High resolution positioner

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH089110B2 (ja) * 1988-03-03 1996-01-31 株式会社ニコン レーザ加工装置のレーザビーム制御方法
JP2942804B2 (ja) * 1988-03-03 1999-08-30 株式会社ニコン レーザ加工装置及びレーザ加工装置のレーザビーム制御方法
JPH08195461A (ja) * 1995-01-18 1996-07-30 Hitachi Constr Mach Co Ltd ダムバー加工方法及びダムバー加工装置
JPH08316396A (ja) * 1995-05-16 1996-11-29 Hitachi Constr Mach Co Ltd ダムバー切断方法及びダムバー切断装置
JPH0970679A (ja) * 1995-09-07 1997-03-18 Nikon Corp レーザ加工装置の制御方法
JP3769942B2 (ja) * 1997-09-02 2006-04-26 セイコーエプソン株式会社 レーザー加工方法及び装置、並びに非導電性透明基板の回路形成方法及び装置
JPH11267873A (ja) * 1998-03-23 1999-10-05 Seiko Epson Corp レーザ光の走査光学系及びレーザ加工装置
JPH11245061A (ja) * 1998-12-15 1999-09-14 Nikon Corp レーザ加工装置のレーザビーム制御方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85101856A (zh) * 1985-04-01 1987-01-17 索尼公司 光信息再现设备
CN1053299A (zh) * 1990-01-05 1991-07-24 鲁道夫·赫尔工学博士股份公司 用于校正偏转光束位置误差的方法和装置
US5673110A (en) * 1993-01-26 1997-09-30 Phase Metrics, Inc. Multiplexed laser interferometer for non-dispersed spectrum detection in a dynamic flying height tester
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5798927A (en) * 1995-03-20 1998-08-25 Electro Scientific Industries, Inc. Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
CN1180221A (zh) * 1996-09-30 1998-04-29 大宇电子株式会社 控制光盘播放机的跟踪平衡装置和方法
US6088107A (en) * 1998-10-20 2000-07-11 Trw Inc. High resolution positioner

Also Published As

Publication number Publication date
GB0318352D0 (en) 2003-09-10
DE10296339T5 (de) 2004-04-15
JP2004527376A (ja) 2004-09-09
JP4397163B2 (ja) 2010-01-13
GB2390699B (en) 2004-10-13
TW535199B (en) 2003-06-01
JP2007203375A (ja) 2007-08-16
GB2390699A (en) 2004-01-14
CN1491398A (zh) 2004-04-21
KR20030091990A (ko) 2003-12-03
CN101172319A (zh) 2008-05-07
JP2011098394A (ja) 2011-05-19
WO2002067180A1 (en) 2002-08-29
JP5055443B2 (ja) 2012-10-24
KR100821115B1 (ko) 2008-04-11
JP4833909B2 (ja) 2011-12-07
CA2438566A1 (en) 2002-08-29

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Granted publication date: 20070523