CN1312767C - 电源电路装置 - Google Patents
电源电路装置 Download PDFInfo
- Publication number
- CN1312767C CN1312767C CNB028016270A CN02801627A CN1312767C CN 1312767 C CN1312767 C CN 1312767C CN B028016270 A CNB028016270 A CN B028016270A CN 02801627 A CN02801627 A CN 02801627A CN 1312767 C CN1312767 C CN 1312767C
- Authority
- CN
- China
- Prior art keywords
- pin
- circuit device
- mosfet
- interval
- power circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP149636/01 | 2001-05-18 | ||
JP2001149636 | 2001-05-18 | ||
JP149636/2001 | 2001-05-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1462476A CN1462476A (zh) | 2003-12-17 |
CN1312767C true CN1312767C (zh) | 2007-04-25 |
Family
ID=18994775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028016270A Expired - Fee Related CN1312767C (zh) | 2001-05-18 | 2002-05-17 | 电源电路装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6861732B2 (zh) |
JP (1) | JP4118143B2 (zh) |
KR (1) | KR100612165B1 (zh) |
CN (1) | CN1312767C (zh) |
WO (1) | WO2002095824A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6842877B2 (en) * | 1998-12-18 | 2005-01-11 | Tangis Corporation | Contextual responses based on automated learning techniques |
US7814155B2 (en) * | 2004-03-31 | 2010-10-12 | Google Inc. | Email conversation management system |
US7496563B2 (en) * | 2004-08-04 | 2009-02-24 | International Business Machines Corporation | Method for locating documents a user has previously accessed |
US7493303B2 (en) * | 2004-08-04 | 2009-02-17 | International Business Machines Corporation | Method for remotely searching a local user index |
CN100464405C (zh) * | 2005-10-31 | 2009-02-25 | 台达电子工业股份有限公司 | 电源模块的封装方法及其结构 |
US8253225B2 (en) * | 2008-02-22 | 2012-08-28 | Infineon Technologies Ag | Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof |
DE112010006032B4 (de) * | 2010-11-29 | 2018-10-04 | Toyota Jidosha Kabushiki Kaisha | Leistungsmodul, aufweisend eine Halbleitervorrichtung |
US9035437B2 (en) * | 2013-03-12 | 2015-05-19 | Infineon Technologies Austria Ag | Packaged device comprising non-integer lead pitches and method of manufacturing the same |
CN104779234B (zh) * | 2014-01-10 | 2018-03-20 | 万国半导体股份有限公司 | 抑制爬电现象的半导体器件及制备方法 |
DE102017209904B4 (de) * | 2017-06-13 | 2023-09-21 | Infineon Technologies Ag | Elektronisches Bauelement, Leadframe für ein elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements und eines Leadframes |
CN112086409B (zh) * | 2020-09-02 | 2022-07-22 | 东莞市柏尔电子科技有限公司 | 一种塑封型三极管及制作工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4947234A (en) * | 1986-09-23 | 1990-08-07 | Siemens Aktiengesellschaft | Semiconductor component with power MOSFET and control circuit |
US5031024A (en) * | 1989-09-05 | 1991-07-09 | Kabushiki Kaisha Toshiba | Resin sealing type semiconductor device having outer leads designed for multi-functions |
US5814884A (en) * | 1996-10-24 | 1998-09-29 | International Rectifier Corporation | Commonly housed diverse semiconductor die |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6459147B1 (en) * | 2000-03-27 | 2002-10-01 | Amkor Technology, Inc. | Attaching semiconductor dies to substrates with conductive straps |
JP3602453B2 (ja) * | 2000-08-31 | 2004-12-15 | Necエレクトロニクス株式会社 | 半導体装置 |
TW529145B (en) * | 2001-11-19 | 2003-04-21 | Chino Excel Technology Corp | Semiconductor device free of bonding wire and method for encapsulating the same |
-
2002
- 2002-05-17 KR KR1020037000701A patent/KR100612165B1/ko not_active IP Right Cessation
- 2002-05-17 WO PCT/JP2002/004774 patent/WO2002095824A1/ja active Application Filing
- 2002-05-17 JP JP2002592190A patent/JP4118143B2/ja not_active Expired - Fee Related
- 2002-05-17 CN CNB028016270A patent/CN1312767C/zh not_active Expired - Fee Related
- 2002-05-17 US US10/333,133 patent/US6861732B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4947234A (en) * | 1986-09-23 | 1990-08-07 | Siemens Aktiengesellschaft | Semiconductor component with power MOSFET and control circuit |
US5031024A (en) * | 1989-09-05 | 1991-07-09 | Kabushiki Kaisha Toshiba | Resin sealing type semiconductor device having outer leads designed for multi-functions |
US5814884A (en) * | 1996-10-24 | 1998-09-29 | International Rectifier Corporation | Commonly housed diverse semiconductor die |
US5814884C1 (en) * | 1996-10-24 | 2002-01-29 | Int Rectifier Corp | Commonly housed diverse semiconductor die |
Also Published As
Publication number | Publication date |
---|---|
US6861732B2 (en) | 2005-03-01 |
WO2002095824A1 (fr) | 2002-11-28 |
KR100612165B1 (ko) | 2006-08-14 |
JP4118143B2 (ja) | 2008-07-16 |
JPWO2002095824A1 (ja) | 2004-09-09 |
KR20030060870A (ko) | 2003-07-16 |
US20040026770A1 (en) | 2004-02-12 |
CN1462476A (zh) | 2003-12-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161010 Address after: Arizona, USA Patentee after: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Address before: Fribourg Patentee before: Semiconductor component industry LLC Effective date of registration: 20161010 Address after: Fribourg Patentee after: Semiconductor component industry LLC Address before: Osaka Japan Patentee before: Sanyo Electric Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070425 Termination date: 20210517 |
|
CF01 | Termination of patent right due to non-payment of annual fee |