CN1302256A - 布置多层无源电子元件的方法 - Google Patents
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Abstract
本发明提供了布置多层无源电子元件的方法,该方法能够在支撑部件上简单布置辊上辊压的薄箔以制备叠加层,其中具有薄箔(63)的塑料支撑箔从退卷机构(67)导出来使箔退卷,经过横向刀具(66)和两个旋转的边刀具(68),通过压制工具(65),再经过分隔闩(610)和引出机构(612)到卷取机构(611)来卷取支撑箔,在那里薄箔已经被剥离了,其中支撑部件(57)被安置于压制工具(65)下面。该发明也提供了支撑部件。
Description
本发明属于电子元件的制造领域。更具体地说,本发明属于布置由相对薄的层组成或排列的多层无源电子元件如陶瓷电容器、变阻器、电感器等的领域。
正常情况下,要改进多层电子元件性能需要减少层的厚度和增加层的数目。通常,将陶瓷或其它材料的薄层放在支撑底层上,支撑底层通常为塑料箔。将这样的薄层从支撑底层剥离并布置成叠加层是一个实际问题,当应用的层越薄该问题就越明显。另一个问题是每个电极层相对于其它电极层的准确布置,特别是当层的数目很大时。
本发明根据下列附图进一步描述,这些附图表示:
附图1:组成多层陶瓷电容器的一个实例
附图2:叠加层布置过程
附图3:较薄的支撑部件定心凹槽的形状
附图4:较厚的支撑部件定心凹槽的形状
附图5:支撑部件定心方法
附图6:将成卷的薄箔压到带有叠加层的支撑部件上
附图7:切割支撑箔上箔的边缘以制成叠加层
附图8:制备叠加层的步骤
附图9:薄箔的纵向切割
附图10:薄箔的横向切割
本发明提供了多层电子元件薄层的布置或组成问题的解决方法,而且进一步还提供了每个电极层相对于其它电极层的准确布置,当电极层的数目很大时也一样。
附图2表示了根据本发明组成叠加层的典型过程。每层箔被压制在支撑部件上,之后将金属层置于其上,并且将该金属层干燥。然后重复这些步骤,直到达到所要求的层数。
附图3用图表示了以垂直形式的金属板作支撑部件(a)。支撑部件的尺寸等于或大于叠加层的尺寸。支撑部件具有两个对称的楔形定心凹槽(b),它们位于两个相对边上,每个楔形凹槽的顶部可制成圆形。
当进行各种操作如印刷、箔的布置、制品压制等时,所述定心凹槽(b)通过定位元件或所说的定心螺栓来实现支撑部件可能的定位。所述楔形定心凹槽(b)的夹角(c)在15°到120°之间,该角度提供了定心螺栓对定心凹槽(b)的可靠调节。当支撑部件(a)的厚度(d)较小时,定心凹槽贯穿支撑部件(a)的整个厚度(d)。如果支撑部件(a)的厚度(d)较大时,定心凹槽(b)只成型在支撑部件(a)的底部边上,如附图4所示。
附图5表示支撑部件的定心方法,在每个制造工位上,该支撑部件被放置在固定盘(56)上,其上的支撑部件通过下述方法来实现定位和紧固。
两个定位螺栓(51,52)通过两个引导元件(53,54)精确地导向。定心螺栓(51)朝向支撑部件(57)移动,直至位于相应的定心凹槽中。限位元件(55),在这个实施例中是一个螺杆,限制了定心螺栓(51)的移动距离。当定位螺栓(51)移动结束时,定位螺栓(52)开始向支撑部件(57)移动。当两个定位螺栓(51,52)都位于相应的定心凹槽中时,支撑部件(57)就位于中心了。
支撑部件(57)可以通过吸力方式固定在固定盘(56)上,此时至少提供一个垂直贯穿固定盘(56)的吸力出口(58),这个出口可以通过真空使支撑部件(57)紧固在固定盘(56)上。在固定盘(56)上固定较大的支撑部件时,所说的出口数目可以多一些。
附图6表示了将叠加层中的成卷的薄箔简单地布置在支撑部件上的方法。带有薄箔(63)的支撑箔从退卷机构(67)中退卷,经过横向刀具(66)和两个边刀具(68),通过压制工具(65),再经过分隔闩(610)和引出机构(612)到卷取机构(611)来将支撑箔卷起。支撑部件(57)以此方式置于压制工具(65)之下,薄箔(63)上设有缺口(69),如附图6所示。
如附图7所示,薄箔通过横向刀具(66)切断,通过旋转的边刀具(68)来纵向切边。
根据上述附图5和6的叙述,如附图8中所示,将薄箔布置到叠加层中去包括下列步骤:步骤1:在支撑部件上压制薄箔
压制工具将薄箔连同支撑箔压制在支撑部件上。由于薄箔是相对可塑的并因此具有些微的粘性,它将粘接到支撑部件上。如果该箔缺少粘性,在所述压制操作之前,可以在支撑部件上涂布粘合剂或蜡状物的薄层。适当的压力是通过气动、液压或机械动力实现的。压力和压制时间是可调的,这样不同机械和/或其它性能的箔就可以应用了。步骤2:压制工具开始工作
在预布置压制时间之后,压制工具启动,薄箔保持粘在支撑部件上。步骤3:从支撑箔上剥离薄箔
如附图6所示,将用于从支撑箔上剥离薄箔的分隔闩(610)移动到左边,如此即从薄箔上分离支撑箔,该薄箔保持粘在支撑部件上。步骤4:一段一段地引出支撑箔
在薄箔已经从支撑箔上分离后,引出机构(612)朝着卷边机构一段一段地引出支撑箔。在引出操作中,旋转边刀具(68)纵向切割薄箔边缘。当引出操作完成时,横向刀具(66)在横向上切割薄箔。
切边和横向切割的实施在下面进一步描述和表示。
当将薄箔一个布置在另一个之上,或在支撑部件上时,在每个新的薄箔层被传送到工位后,在该工位处的薄箔上放上金属层,干燥并且传送回压制工具中,如附图2所示。压制步骤(步骤1)可以重复多次。
压制工具表面用这样的方法来成型以便在整个表面上提供相同压力,它可以是平面或另外的可允许制造不规则形状叠加层的表面。
附图9用图表示薄箔的切边。这项操作的目的是:
-薄箔的切边,以提供所需的宽度
-如附图7所示,由于箔的边缘厚度不均,因此需切去薄箔的边缘。
附图9表示带有薄箔(92)的塑料支撑箔(91),绕在辊(99)上和拉紧压铁(98)之下、旋转边刀具(68)之上,导向引出机构(612),如附图6所示。引出机构(612)沿附图9所示的箭头(Y)方向将两层箔一起引出。旋转切割刀具(68)的锋利边缘接触到薄箔上,并且利用位于罩(97)中的推板(94)所提供的力,刀具(68)的锋利边切割薄箔(92)。
附图10表示薄箔的横向切割,如果需要的话,它也可以与纵向切割(即切边)联合使用。
在箔的两次移动之间进行薄箔的横向切割,这样当箔处于停顿静止状态时,从薄箔上切去垂直部分并且提供叠加层的垂直外形。
在较低面上具有薄箔(92)的塑料支撑箔(91)在横向刀具(66)的上方展开,该刀具带有紧固在机器罩上的刀具把柄(104)。薄箔(92)和横向刀具(66)之间的距离为(x),使该箔能够平稳地移动。当箔不移动时,横向推板(105)向下移动,使箔弯曲并且将其压向横向刀具(66)的切割边缘上。横向刀具(66)切入并切透薄箔(92),同时支撑箔(91)保持未切割。
如附图7所示,在纵向切割之间的横向切割的长度等于横向切割的宽度。
有关本发明上述描述的目的在于以最佳的方式来阐明本发明,并且决不是限制本发明的范围。本领域的技术人员可以找到本发明不同的改进。所有这些变化均在本发明的范围和宗旨之中。本发明的范围由公开的权利要求书确定。
Claims (7)
1、布置多层无源电子元件的方法,该方法能够在支撑部件上简单布置辊上辊压的薄箔以制备叠加层,其中具有薄箔(63)的塑料支撑箔从退卷机构(67)导出来使箔退卷,经过横向刀具(66)和两个旋转的边刀具(68),通过压制工具(65),再经过分隔闩(610)和引出机构(612)到卷取机构(611)来卷取支撑箔,在那里薄箔已经被剥离了,其中支撑部件(57)安置于压制工具(65)下面。
2、支撑部件定心的方法,该方法提供了层的准确布置,其特征在于,在每个工位上所述支撑部件(57)被放在固定盘(56)上,在那里通过两个定心螺栓(51,52)的方式将支撑部件定位并固定,两个定位螺栓通过相应的引导元件(53,54)导向,定心螺栓(51)首先朝向支撑部件(57)移动,直至位于相应的定心凹槽(b)中,所述定心螺栓(51)的移动由限位元件(55)限定,并且当定位螺栓(51)移动结束时,定位螺栓(52)也开始向支撑部件(57)移动,这样当两个定位螺栓(51,52)都位于它们相应的定心凹槽(b)中时,支撑部件(57)就可以通过吸力方式紧固到固定盘(56)上了,其中在该盘上至少有一个垂直贯穿固定盘(56)的吸力出口(58),这个出口可以通过真空使支撑部件(57)紧固在固定盘(56)上。
3、支撑部件定心的方法,该方法提供了如权利要求2所述的层的准确布置,其特征在于,当支撑部件(57)具有较大的尺寸时,需要有多于一个的吸力出口(58)垂直穿过固定盘(56),其中垂直吸力出口(58)的数目由支撑部件的尺寸而定。
4、纵向切割薄箔的方法,其特征在于,其上具有薄箔(92)的塑料支撑箔(91),绕在辊(99)上和拉紧压铁(98)之下、旋转边刀具(68)之上,导向引出机构(112),引出机构(112)沿箭头(Y)方向将两层箔一起引出,在那里旋转切割刀具(68)的锋利边缘接触到薄箔,并且利用位于罩(97)中的推板(94)所提供的力,刀具(68)的锋利边纵向切割薄箔(92)。
5、横向切割薄箔的方法,其特征在于,在较低面上具有薄箔(92)的塑料支撑箔(91)在横向刀具(66)的上方展开,该刀具紧固在机器罩上,薄箔(92)和横向刀具(66)之间的距离为(x),使该箔能够稳定地移动,并且在所述方法实施处,当箔没有以此方式移动时,横向推板(105)向下移动,使箔弯曲并且将其压向横向刀具(66)的切割边缘上,该横向刀具切入并切透薄箔(92),同时支撑箔(91)仍保持未切割。
6、支撑部件(a),其特征在于,它以垂直形式的金属板状态出现,其尺寸等于或大于叠加层的尺寸,具有两个位于两个相对边上的对称的楔形定心凹槽(b),可以使每个楔形凹槽的顶部制成圆形,所述凹槽(b)的夹角(c)在15°到120°之间,该角度提供了定心螺栓对相应定心凹槽(b)的可靠调节,所述两个凹槽(b)能够通过所述两个定心螺栓来定心支撑部件(a)。
7、如权利要求6所述的支撑部件(a),其特征在于当支撑部件(a)的厚度(d)较小时,定心凹槽贯穿支撑部件(a)的整个厚度(d),并且当支撑部件(a)的厚度(d)较大时,定心凹槽(b)只成型在支撑部件(a)的底部边上。
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SIP9800165 | 1998-06-05 | ||
SI9800165A SI20041B (sl) | 1998-06-05 | 1998-06-05 | Postopek zlaganja vecslojnih pasivnih elektronskih komponent |
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CNB998008915A Expired - Fee Related CN1214919C (zh) | 1998-06-05 | 1999-06-04 | 布置多层无源电子元件的方法 |
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US (2) | US6432250B1 (zh) |
EP (1) | EP1023160B1 (zh) |
JP (1) | JP2002517106A (zh) |
KR (1) | KR100451698B1 (zh) |
CN (2) | CN1550327A (zh) |
AT (1) | ATE261813T1 (zh) |
DE (1) | DE69915580T2 (zh) |
SI (1) | SI20041B (zh) |
TW (1) | TW439068B (zh) |
WO (1) | WO1999062703A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113351753A (zh) * | 2021-06-02 | 2021-09-07 | 广东嘉元科技股份有限公司 | 一种铜箔软连接自动加工装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SI20041B (sl) * | 1998-06-05 | 2006-10-31 | Keko Oprema D.O.O. | Postopek zlaganja vecslojnih pasivnih elektronskih komponent |
TWI233651B (en) * | 2001-02-01 | 2005-06-01 | Shibaura Mechatronics Corp | Electric component compression bonding machine and method |
DE10340733A1 (de) * | 2003-09-04 | 2005-03-31 | Zf Friedrichshafen Ag | Mehrstufengetriebe |
CN109366587B (zh) * | 2018-12-06 | 2024-03-12 | 闳诚科技有限公司 | 一种用于裁切机的进料预压缩装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1173784B (de) | 1961-04-28 | 1964-07-09 | Werner Helmert | Mit Schneidwalzen arbeitende Vorrichtung zur kontinuierlichen Herstellung von Haftetiketten |
GB1596777A (en) * | 1977-04-12 | 1981-08-26 | Lucas Industries Ltd | Method of locating a board on a support |
DE3345877A1 (de) | 1983-12-19 | 1985-06-27 | Friedrich Kessler & Co, 8032 Gräfelfing | Vorrichtung zum exakten positionieren eines werkstuecks |
FR2578484A1 (fr) | 1985-03-06 | 1986-09-12 | Leyval Jean Pierre | Machine pour la fabrication d'etiquettes adhesives |
FR2633549B1 (fr) | 1988-06-30 | 1992-12-31 | Centre Tech Ind Papier | Outil pour la decoupe de feuilles de papier ou de carton |
DE3838271A1 (de) * | 1988-11-11 | 1990-05-17 | Krupp Maschinentechnik | Verfahren zur herstellung von mattenstreifen aus breiteren klebrigen, mit deckfolien belegten werkstoffbahnen und vorrichtung zur durchfuehrung des verfahrens |
JPH0670941B2 (ja) | 1988-12-15 | 1994-09-07 | 株式会社村田製作所 | 積層コンデンサの製造方法 |
JP3064544B2 (ja) * | 1991-08-30 | 2000-07-12 | 株式会社村田製作所 | 積層電子部品の製造方法 |
US5470193A (en) | 1992-06-08 | 1995-11-28 | Canon Kabushiki Kaisha | Pallet supply apparatus and control method thereof |
JP3063577B2 (ja) * | 1995-07-05 | 2000-07-12 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法とその装置 |
JP3321513B2 (ja) | 1995-11-01 | 2002-09-03 | 太陽誘電株式会社 | 積層型電子部品の製造方法及びその装置 |
US5879500A (en) * | 1996-06-21 | 1999-03-09 | Herrin; Robert M. | Disposable undergarment forming apparatus and method of forming same |
JPH10284346A (ja) | 1997-04-02 | 1998-10-23 | New Create Kk | セラミック生シートの積層装置 |
SI20041B (sl) * | 1998-06-05 | 2006-10-31 | Keko Oprema D.O.O. | Postopek zlaganja vecslojnih pasivnih elektronskih komponent |
-
1998
- 1998-06-05 SI SI9800165A patent/SI20041B/sl not_active IP Right Cessation
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1999
- 1999-06-04 JP JP2000551944A patent/JP2002517106A/ja active Pending
- 1999-06-04 US US09/485,078 patent/US6432250B1/en not_active Expired - Fee Related
- 1999-06-04 DE DE69915580T patent/DE69915580T2/de not_active Expired - Fee Related
- 1999-06-04 CN CNA2004100594330A patent/CN1550327A/zh active Pending
- 1999-06-04 AT AT99924093T patent/ATE261813T1/de not_active IP Right Cessation
- 1999-06-04 WO PCT/SI1999/000016 patent/WO1999062703A2/en active IP Right Grant
- 1999-06-04 EP EP99924093A patent/EP1023160B1/en not_active Expired - Lifetime
- 1999-06-04 KR KR10-2000-7001155A patent/KR100451698B1/ko not_active IP Right Cessation
- 1999-06-04 CN CNB998008915A patent/CN1214919C/zh not_active Expired - Fee Related
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113351753A (zh) * | 2021-06-02 | 2021-09-07 | 广东嘉元科技股份有限公司 | 一种铜箔软连接自动加工装置 |
CN113351753B (zh) * | 2021-06-02 | 2022-02-25 | 广东嘉元科技股份有限公司 | 一种铜箔软连接自动加工装置 |
Also Published As
Publication number | Publication date |
---|---|
WO1999062703A3 (en) | 2000-06-08 |
SI20041A (sl) | 2000-02-29 |
DE69915580D1 (de) | 2004-04-22 |
US6432250B1 (en) | 2002-08-13 |
ATE261813T1 (de) | 2004-04-15 |
TW439068B (en) | 2001-06-07 |
DE69915580T2 (de) | 2005-02-03 |
KR20010022564A (ko) | 2001-03-26 |
EP1023160B1 (en) | 2004-03-17 |
JP2002517106A (ja) | 2002-06-11 |
KR100451698B1 (ko) | 2004-10-08 |
EP1023160A2 (en) | 2000-08-02 |
WO1999062703A2 (en) | 1999-12-09 |
CN1214919C (zh) | 2005-08-17 |
US20020162625A1 (en) | 2002-11-07 |
CN1550327A (zh) | 2004-12-01 |
US6613176B2 (en) | 2003-09-02 |
SI20041B (sl) | 2006-10-31 |
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