DE69915580D1 - Verfahren zum formen von mehrschichtigen passiven elektronischen komponenten - Google Patents

Verfahren zum formen von mehrschichtigen passiven elektronischen komponenten

Info

Publication number
DE69915580D1
DE69915580D1 DE69915580T DE69915580T DE69915580D1 DE 69915580 D1 DE69915580 D1 DE 69915580D1 DE 69915580 T DE69915580 T DE 69915580T DE 69915580 T DE69915580 T DE 69915580T DE 69915580 D1 DE69915580 D1 DE 69915580D1
Authority
DE
Germany
Prior art keywords
foil
electronic components
over
passive electronic
supporting block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69915580T
Other languages
English (en)
Other versions
DE69915580T2 (de
Inventor
Joze Stupar
Anton Konda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keko Oprema doo
Original Assignee
Keko Oprema doo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keko Oprema doo filed Critical Keko Oprema doo
Application granted granted Critical
Publication of DE69915580D1 publication Critical patent/DE69915580D1/de
Publication of DE69915580T2 publication Critical patent/DE69915580T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1067—Continuous longitudinal slitting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1348—Work traversing type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Packages (AREA)
  • Details Of Cutting Devices (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Capacitors (AREA)
DE69915580T 1998-06-05 1999-06-04 Verfahren zum formen von mehrschichtigen passiven elektronischen komponenten Expired - Fee Related DE69915580T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SI9800165 1998-06-05
SI9800165A SI20041B (sl) 1998-06-05 1998-06-05 Postopek zlaganja vecslojnih pasivnih elektronskih komponent
PCT/SI1999/000016 WO1999062703A2 (en) 1998-06-05 1999-06-04 Method of arranging multilayer passive electronic components

Publications (2)

Publication Number Publication Date
DE69915580D1 true DE69915580D1 (de) 2004-04-22
DE69915580T2 DE69915580T2 (de) 2005-02-03

Family

ID=20432281

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69915580T Expired - Fee Related DE69915580T2 (de) 1998-06-05 1999-06-04 Verfahren zum formen von mehrschichtigen passiven elektronischen komponenten

Country Status (10)

Country Link
US (2) US6432250B1 (de)
EP (1) EP1023160B1 (de)
JP (1) JP2002517106A (de)
KR (1) KR100451698B1 (de)
CN (2) CN1214919C (de)
AT (1) ATE261813T1 (de)
DE (1) DE69915580T2 (de)
SI (1) SI20041B (de)
TW (1) TW439068B (de)
WO (1) WO1999062703A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SI20041B (sl) * 1998-06-05 2006-10-31 Keko Oprema D.O.O. Postopek zlaganja vecslojnih pasivnih elektronskih komponent
TWI233651B (en) * 2001-02-01 2005-06-01 Shibaura Mechatronics Corp Electric component compression bonding machine and method
DE10340733A1 (de) * 2003-09-04 2005-03-31 Zf Friedrichshafen Ag Mehrstufengetriebe
CN109366587B (zh) * 2018-12-06 2024-03-12 闳诚科技有限公司 一种用于裁切机的进料预压缩装置
CN113351753B (zh) * 2021-06-02 2022-02-25 广东嘉元科技股份有限公司 一种铜箔软连接自动加工装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1173784B (de) * 1961-04-28 1964-07-09 Werner Helmert Mit Schneidwalzen arbeitende Vorrichtung zur kontinuierlichen Herstellung von Haftetiketten
GB1596777A (en) * 1977-04-12 1981-08-26 Lucas Industries Ltd Method of locating a board on a support
DE3345877A1 (de) * 1983-12-19 1985-06-27 Friedrich Kessler & Co, 8032 Gräfelfing Vorrichtung zum exakten positionieren eines werkstuecks
FR2578484A1 (fr) * 1985-03-06 1986-09-12 Leyval Jean Pierre Machine pour la fabrication d'etiquettes adhesives
FR2633549B1 (fr) * 1988-06-30 1992-12-31 Centre Tech Ind Papier Outil pour la decoupe de feuilles de papier ou de carton
DE3838271A1 (de) * 1988-11-11 1990-05-17 Krupp Maschinentechnik Verfahren zur herstellung von mattenstreifen aus breiteren klebrigen, mit deckfolien belegten werkstoffbahnen und vorrichtung zur durchfuehrung des verfahrens
JPH0670941B2 (ja) * 1988-12-15 1994-09-07 株式会社村田製作所 積層コンデンサの製造方法
JP3064544B2 (ja) 1991-08-30 2000-07-12 株式会社村田製作所 積層電子部品の製造方法
US5470193A (en) * 1992-06-08 1995-11-28 Canon Kabushiki Kaisha Pallet supply apparatus and control method thereof
JP3063577B2 (ja) * 1995-07-05 2000-07-12 株式会社村田製作所 積層セラミックコンデンサの製造方法とその装置
JP3321513B2 (ja) * 1995-11-01 2002-09-03 太陽誘電株式会社 積層型電子部品の製造方法及びその装置
US5879500A (en) * 1996-06-21 1999-03-09 Herrin; Robert M. Disposable undergarment forming apparatus and method of forming same
JPH10284346A (ja) * 1997-04-02 1998-10-23 New Create Kk セラミック生シートの積層装置
SI20041B (sl) * 1998-06-05 2006-10-31 Keko Oprema D.O.O. Postopek zlaganja vecslojnih pasivnih elektronskih komponent

Also Published As

Publication number Publication date
KR20010022564A (ko) 2001-03-26
ATE261813T1 (de) 2004-04-15
US20020162625A1 (en) 2002-11-07
SI20041A (sl) 2000-02-29
JP2002517106A (ja) 2002-06-11
KR100451698B1 (ko) 2004-10-08
CN1302256A (zh) 2001-07-04
WO1999062703A2 (en) 1999-12-09
TW439068B (en) 2001-06-07
US6432250B1 (en) 2002-08-13
CN1214919C (zh) 2005-08-17
CN1550327A (zh) 2004-12-01
DE69915580T2 (de) 2005-02-03
US6613176B2 (en) 2003-09-02
WO1999062703A3 (en) 2000-06-08
EP1023160A2 (de) 2000-08-02
SI20041B (sl) 2006-10-31
EP1023160B1 (de) 2004-03-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee