ATE267506T1 - Vorrichtung und verfahren zur herstellung gedruckter leiterplatten - Google Patents
Vorrichtung und verfahren zur herstellung gedruckter leiterplattenInfo
- Publication number
- ATE267506T1 ATE267506T1 AT97907662T AT97907662T ATE267506T1 AT E267506 T1 ATE267506 T1 AT E267506T1 AT 97907662 T AT97907662 T AT 97907662T AT 97907662 T AT97907662 T AT 97907662T AT E267506 T1 ATE267506 T1 AT E267506T1
- Authority
- AT
- Austria
- Prior art keywords
- copper
- caul
- sheets
- section
- cutting
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 12
- 239000010949 copper Substances 0.000 abstract 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 10
- 210000000569 greater omentum Anatomy 0.000 abstract 6
- 239000000284 extract Substances 0.000 abstract 2
- 230000007246 mechanism Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/65—Dust free, e.g. clean room
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
- Y10T29/49829—Advancing work to successive stations [i.e., assembly line]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5102—Binding or covering and cutting
- Y10T29/5103—Cutting covering material only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/5317—Laminated device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Laminated Bodies (AREA)
- Insulated Conductors (AREA)
- Details Of Cutting Devices (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/609,774 US5987736A (en) | 1996-03-01 | 1996-03-01 | Printed circuit board fabrication apparatus |
PCT/US1997/002476 WO1997032455A2 (en) | 1996-03-01 | 1997-02-14 | Printed circuit board fabrication apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE267506T1 true ATE267506T1 (de) | 2004-06-15 |
Family
ID=24442269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT97907662T ATE267506T1 (de) | 1996-03-01 | 1997-02-14 | Vorrichtung und verfahren zur herstellung gedruckter leiterplatten |
Country Status (8)
Country | Link |
---|---|
US (1) | US5987736A (de) |
EP (1) | EP0885551B1 (de) |
JP (1) | JP2000511695A (de) |
CN (1) | CN1135913C (de) |
AT (1) | ATE267506T1 (de) |
AU (1) | AU1961097A (de) |
DE (1) | DE69729180T2 (de) |
WO (1) | WO1997032455A2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2804065B1 (fr) * | 2000-01-24 | 2002-10-11 | Haironville Sa | Procede de fabrication de produits multicouches comprenant des reservations et dispositif de mise en oeuvre de ce procede |
US20030047288A1 (en) | 2001-09-12 | 2003-03-13 | Thaddeus Soberay | Low profile vacuum press |
SE0501053L (sv) * | 2005-05-10 | 2006-05-16 | Kvaerner Power Ab | Insatstub samt ett system av insatstuber |
US9987729B2 (en) * | 2015-02-20 | 2018-06-05 | Peter Botten | Bar clamp with workpiece stabilization |
CN116095983B (zh) * | 2023-03-22 | 2023-06-09 | 广东樱井科技有限公司 | 一种智能马桶高度集成模块化的组装部件及其方法 |
CN116923975B (zh) * | 2023-09-14 | 2023-11-24 | 遂宁利和科技有限公司 | 一种覆铜板生产用输送上料装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3617613A (en) * | 1968-10-17 | 1971-11-02 | Spaulding Fibre Co | Punchable printed circuit board base |
DE2235141A1 (de) * | 1972-07-18 | 1974-02-28 | Basf Ag | Verfahren zum verkleben oder beschichten von metallen |
US3955264A (en) * | 1975-07-18 | 1976-05-11 | Willi Klappert | Core steel stacking machine |
SU772706A1 (ru) * | 1978-11-16 | 1980-10-23 | Предприятие П/Я В-8735 | Пресс-форма дл лить под давлением |
DE2932698C2 (de) * | 1979-08-11 | 1981-03-19 | G. Siempelkamp Gmbh & Co, 4150 Krefeld | Vorrichtung zum Zusammenlegen von Trägermatten und Metallfolienbahnabschnitten im Zuge der Herstellung von Laminatplatten |
SU1007221A1 (ru) * | 1981-03-17 | 1983-03-23 | Предприятие П/Я В-8145 | Устройство дл подогрева заготовок печатных плат |
US4505771A (en) * | 1982-06-09 | 1985-03-19 | Wean United, Inc. | Arrangement, apparatus, and method to form laminates, and the like such as copper clad |
US4488466A (en) * | 1982-09-07 | 1984-12-18 | Seal Tech Corp. | Apparatus for cutting sheet material |
US4857135A (en) * | 1986-02-24 | 1989-08-15 | Copp John B | Composite board press |
DE3775125D1 (de) * | 1986-05-22 | 1992-01-23 | Steinemann Ulrich Ag | Verfahren und vorrichtung zum schichten von blechpaketen, insbesondere von transformatoren-kernen. |
AT392949B (de) * | 1989-03-17 | 1991-07-10 | Gfm Holding Ag | Vorrichtung zum abnehmen eines flaechigen werkstueckes von einer anklebenden unterfolie |
US5315754A (en) * | 1990-06-11 | 1994-05-31 | General Electric Company | Method of making a transformer core comprising strips of amorphous steel wrapped around the core window |
EP0478320A3 (en) * | 1990-09-28 | 1993-06-30 | Kabushiki Kaisha Toshiba | Method for manufacturing printed circuit board |
US5160567A (en) * | 1991-04-15 | 1992-11-03 | Allied-Signal Inc. | System and method for manufacturing copper clad glass epoxy laminates |
GB2255451B (en) * | 1991-05-03 | 1995-01-25 | Marconi Gec Ltd | Ceramic three dimensional electronic structures |
US5249902A (en) * | 1992-06-25 | 1993-10-05 | The Holson Burnes Company | Loose-leaf binder assembly process and apparatus |
US5347706A (en) * | 1992-06-26 | 1994-09-20 | General Electric Company | Method for making packets of amorphous steel strip for transformer core manufacture |
JP3246018B2 (ja) * | 1992-12-04 | 2002-01-15 | 神鋼電機株式会社 | 薄板積層装置 |
US5403056A (en) * | 1993-06-30 | 1995-04-04 | Planet Products Corporation | Robotic hand for transferring articles |
-
1996
- 1996-03-01 US US08/609,774 patent/US5987736A/en not_active Expired - Fee Related
-
1997
- 1997-02-14 CN CNB971939497A patent/CN1135913C/zh not_active Expired - Fee Related
- 1997-02-14 AU AU19610/97A patent/AU1961097A/en not_active Abandoned
- 1997-02-14 DE DE69729180T patent/DE69729180T2/de not_active Expired - Lifetime
- 1997-02-14 EP EP97907662A patent/EP0885551B1/de not_active Expired - Lifetime
- 1997-02-14 AT AT97907662T patent/ATE267506T1/de not_active IP Right Cessation
- 1997-02-14 JP JP09530986A patent/JP2000511695A/ja active Pending
- 1997-02-14 WO PCT/US1997/002476 patent/WO1997032455A2/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE69729180D1 (de) | 2004-06-24 |
AU1961097A (en) | 1997-09-16 |
US5987736A (en) | 1999-11-23 |
JP2000511695A (ja) | 2000-09-05 |
EP0885551A4 (de) | 2002-01-02 |
EP0885551A2 (de) | 1998-12-23 |
EP0885551B1 (de) | 2004-05-19 |
WO1997032455A2 (en) | 1997-09-04 |
DE69729180T2 (de) | 2005-05-04 |
CN1216671A (zh) | 1999-05-12 |
WO1997032455A3 (en) | 1997-10-30 |
CN1135913C (zh) | 2004-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |