CN1299555C - 对由此包装的电子器件进行包装的方法和装置 - Google Patents

对由此包装的电子器件进行包装的方法和装置 Download PDF

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Publication number
CN1299555C
CN1299555C CNB028242106A CN02824210A CN1299555C CN 1299555 C CN1299555 C CN 1299555C CN B028242106 A CNB028242106 A CN B028242106A CN 02824210 A CN02824210 A CN 02824210A CN 1299555 C CN1299555 C CN 1299555C
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CN
China
Prior art keywords
paillon foil
foil
cavity
clamp
paillon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028242106A
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English (en)
Chinese (zh)
Other versions
CN1600052A (zh
Inventor
J·W·D·博斯奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sheng Investment Co Ltd
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN1600052A publication Critical patent/CN1600052A/zh
Application granted granted Critical
Publication of CN1299555C publication Critical patent/CN1299555C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
CNB028242106A 2001-12-05 2002-11-25 对由此包装的电子器件进行包装的方法和装置 Expired - Fee Related CN1299555C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01204684.3 2001-12-05
EP01204684 2001-12-05

Publications (2)

Publication Number Publication Date
CN1600052A CN1600052A (zh) 2005-03-23
CN1299555C true CN1299555C (zh) 2007-02-07

Family

ID=8181355

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028242106A Expired - Fee Related CN1299555C (zh) 2001-12-05 2002-11-25 对由此包装的电子器件进行包装的方法和装置

Country Status (6)

Country Link
US (2) US7340872B2 (https=)
EP (1) EP1459614A1 (https=)
JP (1) JP2005511426A (https=)
CN (1) CN1299555C (https=)
AU (1) AU2002348875A1 (https=)
WO (1) WO2003049522A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10217792A1 (de) * 2002-04-20 2003-11-13 Infineon Technologies Ag Verpackungsanlage mit einem Werkzeug zum Einschließen elektronischer Bauteile und Verfahren zum Bestücken eines Traggurtes
JP4466756B2 (ja) * 2008-04-02 2010-05-26 住友電気工業株式会社 化合物半導体基板の包装方法
JP6151925B2 (ja) * 2013-02-06 2017-06-21 ヤマハ発動機株式会社 基板固定装置、基板作業装置および基板固定方法
CN105513996B (zh) * 2014-09-23 2017-12-19 软控股份有限公司 一种全自动轮胎用rfid电子标签封装设备
CN105438524B (zh) * 2014-09-23 2017-11-07 软控股份有限公司 一种轮胎用rfid电子标签包装设备及包装方法
CN112607088B (zh) * 2020-11-30 2023-03-21 东莞领杰金属精密制造科技有限公司 包装方法及包装装置
CN113501159B (zh) * 2021-08-04 2022-07-29 深圳市辉悦科技有限公司 一种避免芯片损伤供料的芯片编带机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575995A (en) * 1980-04-03 1986-03-18 Murata Manufacturing Co., Ltd. Automatic producing apparatus of chip-form electronic parts aggregate
US5857572A (en) * 1995-12-21 1999-01-12 Bird; Gerald C. Component carrier tape

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4757895A (en) * 1984-09-20 1988-07-19 Gelzer John R Article packaging system
US4621486A (en) * 1984-11-15 1986-11-11 Molex Incorporated Apparatus for making a tape carrier
US4867308A (en) * 1987-05-14 1989-09-19 Crawford Richard J Storage tape for electronic components
US5150787A (en) * 1991-02-21 1992-09-29 Minnesota Mining And Manufacturing Company Component carrier tape
US5199564A (en) * 1992-03-13 1993-04-06 Minnesota Mining And Manufacturing Company Carrier tape for electronic through-hole components
US5203143A (en) 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
JPH0837395A (ja) 1994-07-21 1996-02-06 Matsushita Electric Ind Co Ltd 半導体チップ供給装置および供給方法
US5524765A (en) 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components
US5938038A (en) * 1996-08-02 1999-08-17 Dial Tool Industries, Inc. Parts carrier strip and apparatus for assembling parts in such a strip
US5966903A (en) * 1998-05-27 1999-10-19 Lucent Technologies Inc. High speed flip-chip dispensing
US6202292B1 (en) * 1998-08-26 2001-03-20 Micron Technology, Inc. Apparatus for removing carrier film from a semiconductor die
JP3838797B2 (ja) * 1998-10-27 2006-10-25 松下電器産業株式会社 部品の貼り着け方法とその装置
JP4275258B2 (ja) * 1999-07-23 2009-06-10 富士機械製造株式会社 物品供給装置
DE10032415A1 (de) * 2000-07-04 2001-10-18 Infineon Technologies Ag Vorrichtung zum Verpacken und zum Transport von elektrischen Bauteilen und Herstellungsverfahren

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575995A (en) * 1980-04-03 1986-03-18 Murata Manufacturing Co., Ltd. Automatic producing apparatus of chip-form electronic parts aggregate
US5857572A (en) * 1995-12-21 1999-01-12 Bird; Gerald C. Component carrier tape

Also Published As

Publication number Publication date
JP2005511426A (ja) 2005-04-28
EP1459614A1 (en) 2004-09-22
AU2002348875A1 (en) 2003-06-17
US20080127610A1 (en) 2008-06-05
US7340872B2 (en) 2008-03-11
US20050035025A1 (en) 2005-02-17
WO2003049522A1 (en) 2003-06-12
US7823369B2 (en) 2010-11-02
CN1600052A (zh) 2005-03-23

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C06 Publication
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C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: NXP CO., LTD.

Free format text: FORMER OWNER: KONINKLIJKE PHILIPS ELECTRONICS N.V.

Effective date: 20071102

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20071102

Address after: Holland Ian Deho Finn

Patentee after: Koninkl Philips Electronics NV

Address before: Holland Ian Deho Finn

Patentee before: Koninklijke Philips Electronics N.V.

ASS Succession or assignment of patent right

Owner name: SHENG INVESTMENT CO., LTD.

Free format text: FORMER OWNER: KONINKL PHILIPS ELECTRONICS NV

Effective date: 20120702

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120702

Address after: Delaware, USA

Patentee after: Sheng Investment Co., Ltd.

Address before: Holland Ian Deho Finn

Patentee before: Koninkl Philips Electronics NV

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070207

Termination date: 20131125