CN1296997C - 具自行钝化铜合金之铜垫\接合\铜线 - Google Patents

具自行钝化铜合金之铜垫\接合\铜线 Download PDF

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Publication number
CN1296997C
CN1296997C CNB018216528A CN01821652A CN1296997C CN 1296997 C CN1296997 C CN 1296997C CN B018216528 A CNB018216528 A CN B018216528A CN 01821652 A CN01821652 A CN 01821652A CN 1296997 C CN1296997 C CN 1296997C
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Prior art keywords
copper
alloy
pad
wire
layer
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Expired - Fee Related
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CNB018216528A
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Chinese (zh)
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CN1484857A (zh
Inventor
H·-J·巴斯
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Infineon Technologies North America Corp
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Infineon Technologies North America Corp
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
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  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CNB018216528A 2000-12-28 2001-11-14 具自行钝化铜合金之铜垫\接合\铜线 Expired - Fee Related CN1296997C (zh)

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US09/751,479 2000-12-28
US09/751,479 US6515373B2 (en) 2000-12-28 2000-12-28 Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys

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CN1484857A CN1484857A (zh) 2004-03-24
CN1296997C true CN1296997C (zh) 2007-01-24

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EP1348235A2 (en) 2003-10-01
US20020084311A1 (en) 2002-07-04
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CN1484857A (zh) 2004-03-24

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