CN1290169C - 具有利用激光方法成型的接触电极的接触器 - Google Patents
具有利用激光方法成型的接触电极的接触器 Download PDFInfo
- Publication number
- CN1290169C CN1290169C CNB031202233A CN03120223A CN1290169C CN 1290169 C CN1290169 C CN 1290169C CN B031202233 A CNB031202233 A CN B031202233A CN 03120223 A CN03120223 A CN 03120223A CN 1290169 C CN1290169 C CN 1290169C
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- Prior art keywords
- contact electrode
- laser beam
- described contact
- manufacture method
- laser
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/07—Non contact-making probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Manufacture Of Switches (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP236526/2002 | 2002-08-14 | ||
JP2002236526A JP4088121B2 (ja) | 2002-08-14 | 2002-08-14 | コンタクタの製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101267744A Division CN100555594C (zh) | 2002-08-14 | 2003-03-07 | 具有利用激光方法成型的接触电极的接触器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1476068A CN1476068A (zh) | 2004-02-18 |
CN1290169C true CN1290169C (zh) | 2006-12-13 |
Family
ID=31492472
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031202233A Expired - Fee Related CN1290169C (zh) | 2002-08-14 | 2003-03-07 | 具有利用激光方法成型的接触电极的接触器 |
CNB2006101267744A Expired - Fee Related CN100555594C (zh) | 2002-08-14 | 2003-03-07 | 具有利用激光方法成型的接触电极的接触器 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101267744A Expired - Fee Related CN100555594C (zh) | 2002-08-14 | 2003-03-07 | 具有利用激光方法成型的接触电极的接触器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6806723B2 (zh) |
JP (1) | JP4088121B2 (zh) |
KR (1) | KR20040016374A (zh) |
CN (2) | CN1290169C (zh) |
TW (1) | TWI257137B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4532058B2 (ja) * | 2002-08-26 | 2010-08-25 | 日本発條株式会社 | 修正方法、修正装置及び修正プログラム |
US7462800B2 (en) * | 2004-12-03 | 2008-12-09 | Sv Probe Pte Ltd. | Method of shaping lithographically-produced probe elements |
DE102005025367B4 (de) * | 2005-05-31 | 2011-02-03 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Verfahren zum Ausbilden einer Struktur mit optimierter Raumform |
JP4927391B2 (ja) | 2005-11-25 | 2012-05-09 | 東京エレクトロン株式会社 | 接合方法 |
US7583098B2 (en) * | 2006-02-08 | 2009-09-01 | Sv Probe Pte. Ltd. | Automated probe card planarization and alignment methods and tools |
WO2007092592A2 (en) * | 2006-02-08 | 2007-08-16 | Sv Probe Pte Ltd. | Automated probe card planarization and alignment methods and tools |
JP2008034569A (ja) * | 2006-07-28 | 2008-02-14 | Matsushita Electric Ind Co Ltd | 半導体集積回路検査用プローブカードとその製造方法 |
DE102006038457B4 (de) * | 2006-08-16 | 2014-05-22 | Cascade Microtech, Inc. | Verfahren und Vorrichtung zum Temperieren elektronischer Bauelemente |
US8461482B2 (en) * | 2008-06-18 | 2013-06-11 | Electro Scientific Industries, Inc. | Pre-process stress loading components for post-process warp control |
GB0815066D0 (en) * | 2008-08-18 | 2008-09-24 | Qinetiq Ltd | Eye safe lidar |
WO2013101240A1 (en) * | 2011-12-31 | 2013-07-04 | Intel Corporation | Manufacturing advanced test probes |
JP5870188B2 (ja) * | 2012-06-18 | 2016-02-24 | シャープ株式会社 | 検査装置 |
CN103824827B (zh) * | 2012-11-16 | 2017-02-08 | 台达电子企业管理(上海)有限公司 | 封装模块、封装终端及其制造方法 |
ITMI20122023A1 (it) * | 2012-11-28 | 2014-05-29 | Technoprobe Spa | Sonda di contatto a sbalzo [cantilever] per una testa di misura |
CN104332428B (zh) * | 2014-08-29 | 2017-04-05 | 中国科学院长春光学精密机械与物理研究所 | 基于激光热应力成形的芯片引脚整形装置及方法 |
DE102016100561A1 (de) * | 2016-01-14 | 2017-07-20 | Pac Tech - Packaging Technologies Gmbh | Verfahren zur Platzierung und Kontaktierung eines Prüfkontakts |
CN108878591B (zh) * | 2018-07-02 | 2020-01-07 | 通威太阳能(安徽)有限公司 | 一种晶硅太阳能电池金属电极的激光烧结方法 |
CN109633225A (zh) * | 2018-12-27 | 2019-04-16 | 深圳市海维光电科技有限公司 | 一种电路板检测用测试针的生产工艺 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63303237A (ja) | 1987-06-03 | 1988-12-09 | Fujitsu Ltd | レ−ザ光によるばね圧力調整方法 |
US5228324A (en) * | 1987-11-26 | 1993-07-20 | Polska Akademia Nauk-Instytut Podstawowych Problemow Techniki | Method of bending metal objects |
JP2623817B2 (ja) | 1989-02-20 | 1997-06-25 | 富士通株式会社 | レーザビームによる曲げ加工方法および曲げ加工装置 |
JPH05245543A (ja) | 1992-03-09 | 1993-09-24 | Matsushita Electric Ind Co Ltd | 板材の曲げ加工方法 |
JPH08501255A (ja) * | 1993-03-25 | 1996-02-13 | インスティテュート ポヅタウォウィック プロブレモウテクニキ | 金属物体の曲げ加工法 |
US6442831B1 (en) * | 1993-11-16 | 2002-09-03 | Formfactor, Inc. | Method for shaping spring elements |
US5495667A (en) * | 1994-11-07 | 1996-03-05 | Micron Technology, Inc. | Method for forming contact pins for semiconductor dice and interconnects |
JPH08222108A (ja) * | 1995-02-15 | 1996-08-30 | Omron Corp | 接触片の調整方法および調整システム |
KR100212169B1 (ko) | 1996-02-13 | 1999-08-02 | 오쿠보 마사오 | 프로브, 프로브의 제조, 그리고 프로브를 사용한 수직동작형 프로브 카드 어셈블리 |
US6245444B1 (en) * | 1997-10-02 | 2001-06-12 | New Jersey Institute Of Technology | Micromachined element and method of fabrication thereof |
JP4176968B2 (ja) * | 2001-02-14 | 2008-11-05 | 富士通株式会社 | レーザ曲げ加工方法及びレーザ曲げ加工装置 |
-
2002
- 2002-08-14 JP JP2002236526A patent/JP4088121B2/ja not_active Expired - Fee Related
-
2003
- 2003-02-20 TW TW092103540A patent/TWI257137B/zh not_active IP Right Cessation
- 2003-02-21 US US10/369,705 patent/US6806723B2/en not_active Expired - Lifetime
- 2003-03-06 KR KR1020030014040A patent/KR20040016374A/ko active IP Right Grant
- 2003-03-07 CN CNB031202233A patent/CN1290169C/zh not_active Expired - Fee Related
- 2003-03-07 CN CNB2006101267744A patent/CN100555594C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20040016374A (ko) | 2004-02-21 |
TWI257137B (en) | 2006-06-21 |
CN100555594C (zh) | 2009-10-28 |
TW200402815A (en) | 2004-02-16 |
CN1933119A (zh) | 2007-03-21 |
JP2004077242A (ja) | 2004-03-11 |
JP4088121B2 (ja) | 2008-05-21 |
US20040032272A1 (en) | 2004-02-19 |
US6806723B2 (en) | 2004-10-19 |
CN1476068A (zh) | 2004-02-18 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20081219 Address after: Tokyo, Japan Patentee after: Fujitsu Microelectronics Ltd. Address before: Kanagawa, Japan Patentee before: Fujitsu Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: FUJITSU MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: FUJITSU LIMITED Effective date: 20081219 |
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C56 | Change in the name or address of the patentee |
Owner name: FUJITSU SEMICONDUCTOR CO., LTD. Free format text: FORMER NAME: FUJITSU MICROELECTRON CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Kanagawa Patentee before: Fujitsu Microelectronics Ltd. |
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CP02 | Change in the address of a patent holder |
Address after: Kanagawa Patentee after: Fujitsu Microelectronics Ltd. Address before: Tokyo, Japan Patentee before: Fujitsu Microelectronics Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: SUOSI FUTURE CO., LTD. Free format text: FORMER OWNER: FUJITSU SEMICONDUCTOR CO., LTD. Effective date: 20150519 |
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Effective date of registration: 20150519 Address after: Kanagawa Patentee after: SOCIONEXT Inc. Address before: Kanagawa Patentee before: FUJITSU MICROELECTRONICS Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061213 Termination date: 20190307 |
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CF01 | Termination of patent right due to non-payment of annual fee |