CN1288449C - 保持弹簧探针的方法和设备 - Google Patents

保持弹簧探针的方法和设备 Download PDF

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Publication number
CN1288449C
CN1288449C CNB018230261A CN01823026A CN1288449C CN 1288449 C CN1288449 C CN 1288449C CN B018230261 A CNB018230261 A CN B018230261A CN 01823026 A CN01823026 A CN 01823026A CN 1288449 C CN1288449 C CN 1288449C
Authority
CN
China
Prior art keywords
probe
ground
hole
spring
spring probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB018230261A
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English (en)
Chinese (zh)
Other versions
CN1555489A (zh
Inventor
史蒂文·费尔德曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1555489A publication Critical patent/CN1555489A/zh
Application granted granted Critical
Publication of CN1288449C publication Critical patent/CN1288449C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Orthopedics, Nursing, And Contraception (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Socks And Pantyhose (AREA)
CNB018230261A 2001-03-13 2001-12-11 保持弹簧探针的方法和设备 Expired - Fee Related CN1288449C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/804,782 2001-03-13
US09/804,782 US6447328B1 (en) 2001-03-13 2001-03-13 Method and apparatus for retaining a spring probe

Publications (2)

Publication Number Publication Date
CN1555489A CN1555489A (zh) 2004-12-15
CN1288449C true CN1288449C (zh) 2006-12-06

Family

ID=25189817

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018230261A Expired - Fee Related CN1288449C (zh) 2001-03-13 2001-12-11 保持弹簧探针的方法和设备

Country Status (8)

Country Link
US (1) US6447328B1 (https=)
EP (1) EP1368666B1 (https=)
JP (1) JP4106273B2 (https=)
KR (1) KR100831787B1 (https=)
CN (1) CN1288449C (https=)
AT (1) ATE291234T1 (https=)
DE (1) DE60109499T2 (https=)
WO (1) WO2002073220A2 (https=)

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US6902416B2 (en) 2002-08-29 2005-06-07 3M Innovative Properties Company High density probe device
US6696850B1 (en) * 2002-10-02 2004-02-24 Interconnect Devices, Inc. Contact probe with off-centered back-drilled aperture
US6824427B1 (en) * 2003-05-13 2004-11-30 3M Innovative Properties Company Coaxial probe interconnection system
US7015708B2 (en) * 2003-07-11 2006-03-21 Gore Enterprise Holdings, Inc. Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts
JP4053962B2 (ja) * 2003-10-15 2008-02-27 株式会社東芝 半導体装置
US7315176B2 (en) 2004-06-16 2008-01-01 Rika Denshi America, Inc. Electrical test probes, methods of making, and methods of using
KR100600482B1 (ko) * 2004-06-22 2006-07-13 삼성전자주식회사 반도체 패키지 측정용 프로브
JP4757531B2 (ja) 2005-04-28 2011-08-24 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
US7298153B2 (en) * 2005-05-25 2007-11-20 Interconnect Devices, Inc. Eccentric offset Kelvin probe
US7740508B2 (en) * 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
US20100194419A1 (en) * 2009-02-05 2010-08-05 Chan Edward K Multi-contact probe assembly
US7927144B2 (en) * 2009-08-10 2011-04-19 3M Innovative Properties Company Electrical connector with interlocking plates
US7850489B1 (en) 2009-08-10 2010-12-14 3M Innovative Properties Company Electrical connector system
US7997933B2 (en) 2009-08-10 2011-08-16 3M Innovative Properties Company Electrical connector system
US7909646B2 (en) * 2009-08-10 2011-03-22 3M Innovative Properties Company Electrical carrier assembly and system of electrical carrier assemblies
US8905795B2 (en) 2011-10-12 2014-12-09 Apple Inc. Spring-loaded contacts
USRE47459E1 (en) 2011-10-24 2019-06-25 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
EP2771948B1 (en) 2011-10-24 2018-12-05 Ardent Concepts Inc. Controlled-impedance cable termination using compliant interconnect elements
USRE46958E1 (en) 2011-10-24 2018-07-17 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
US20130330983A1 (en) * 2012-06-10 2013-12-12 Apple Inc. Spring-loaded contacts having sloped backside with retention guide
KR101403048B1 (ko) * 2012-06-26 2014-06-09 주식회사 오킨스전자 고주파 특성을 갖는 반도체 디바이스 테스트소켓
TWI555987B (zh) * 2014-01-28 2016-11-01 Spring sleeve type probe and its manufacturing method
CN104280678B (zh) * 2014-10-30 2018-11-27 通富微电子股份有限公司 半导体测试治具
CN106645809A (zh) * 2016-10-14 2017-05-10 厦门大学 一种双重包覆壳层隔绝针尖的制备方法
US10705118B2 (en) * 2017-03-23 2020-07-07 Ford Global Technologies, Llc Power module testing apparatus
CN108663553B (zh) * 2017-03-29 2022-01-25 上海中船电气有限公司 一种接触式半导体材料测试头
JP7346026B2 (ja) * 2018-12-26 2023-09-19 株式会社日本マイクロニクス 電気的接続装置
WO2021215334A1 (ja) * 2020-04-22 2021-10-28 株式会社村田製作所 検査用コネクタ及び検査用ユニット
US11293976B1 (en) * 2020-09-25 2022-04-05 Essai, Inc. Integrated circuit device test tooling with dual angle cavities
US11942722B2 (en) 2020-09-25 2024-03-26 Apple Inc. Magnetic circuit for magnetic connector
US11437747B2 (en) 2020-09-25 2022-09-06 Apple Inc. Spring-loaded contacts having capsule intermediate object
KR102503437B1 (ko) * 2021-04-26 2023-02-24 주식회사 에이플러스알에프 인쇄회로기판 테스트용 커넥터

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US3806801A (en) * 1972-12-26 1974-04-23 Ibm Probe contactor having buckling beam probes
BE847127A (fr) * 1975-10-17 1977-01-31 Appareil de connexion de controle electrique,
US4593243A (en) 1984-08-29 1986-06-03 Magnavox Government And Industrial Electronics Company Coplanar and stripline probe card apparatus
GB2166913A (en) * 1984-11-13 1986-05-14 Tektronix Inc Impedance matched test probe
US4712062A (en) 1984-12-20 1987-12-08 Hughes Aircraft Company Ground shield apparatus for giga-hertz test jig
US4724180A (en) 1985-08-05 1988-02-09 Teradyne, Inc. Electrically shielded connectors
US4783624A (en) * 1986-04-14 1988-11-08 Interconnect Devices, Inc. Contact probe devices and method
US4827211A (en) 1987-01-30 1989-05-02 Cascade Microtech, Inc. Wafer probe
EP0283545B1 (de) * 1987-03-27 1991-10-16 Ibm Deutschland Gmbh Kontaktsonden-Anordnung zur elektrischen Verbindung einer Prüfeinrichtung mit den kreisförmigen Anschlussflächen eines Prüflings
US4931726A (en) * 1987-06-22 1990-06-05 Hitachi, Ltd. Apparatus for testing semiconductor device
JPH0178029U (https=) * 1987-11-13 1989-05-25
US4965514A (en) 1989-06-05 1990-10-23 Tektronix, Inc. Apparatus for probing a microwave circuit
US5144228A (en) 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
JPH0529407A (ja) * 1991-07-19 1993-02-05 Fujitsu Ltd 回路基板試験装置
US5308250A (en) 1992-10-30 1994-05-03 Hewlett-Packard Company Pressure contact for connecting a coaxial shield to a microstrip ground plane
US5477159A (en) 1992-10-30 1995-12-19 Hewlett-Packard Company Integrated circuit probe fixture with detachable high frequency probe carrier
KR0138618B1 (ko) 1993-08-04 1998-06-15 이노우에 아끼라 프로브카드, 프로브카드용 동축 프로브빔 및 그 제조방법
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JPH07325108A (ja) * 1994-05-31 1995-12-12 Kyocera Corp 電子部品の測定装置
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JP3483961B2 (ja) * 1994-10-31 2004-01-06 株式会社アドバンテスト 高周波用コネクタ
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US5641315A (en) * 1995-11-16 1997-06-24 Everett Charles Technologies, Inc. Telescoping spring probe
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US5936415A (en) 1996-12-20 1999-08-10 Xilinx, Inc. Method and apparatus for a pin-configurable integrated circuit tester board
EP0915342B1 (de) * 1997-11-05 2004-03-03 Feinmetall GmbH Prüfkopf für Mikrostrukturen mit Schnittstelle
KR20010041554A (ko) * 1998-03-04 2001-05-25 레카 도날드 지. 자동 테스트 장치용 동축 프로브 인터페이스
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JP2001004659A (ja) * 1999-06-17 2001-01-12 Yokowo Co Ltd 測定用同軸型プローブ

Also Published As

Publication number Publication date
JP4106273B2 (ja) 2008-06-25
WO2002073220A3 (en) 2003-04-03
KR20030081513A (ko) 2003-10-17
JP2004530870A (ja) 2004-10-07
DE60109499D1 (de) 2005-04-21
EP1368666A2 (en) 2003-12-10
WO2002073220A2 (en) 2002-09-19
CN1555489A (zh) 2004-12-15
EP1368666B1 (en) 2005-03-16
ATE291234T1 (de) 2005-04-15
US6447328B1 (en) 2002-09-10
US20020132514A1 (en) 2002-09-19
DE60109499T2 (de) 2006-04-13
KR100831787B1 (ko) 2008-05-28

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20061206

Termination date: 20131211