CN1287987C - 喷墨准直器 - Google Patents

喷墨准直器 Download PDF

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CN1287987C
CN1287987C CNB028172892A CN02817289A CN1287987C CN 1287987 C CN1287987 C CN 1287987C CN B028172892 A CNB028172892 A CN B028172892A CN 02817289 A CN02817289 A CN 02817289A CN 1287987 C CN1287987 C CN 1287987C
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nozzle
printhead
ink
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nozzle assembly
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CN1551836A (zh
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卡·西尔弗布鲁克
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Silverbrook Research Pty Ltd
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Abstract

一种喷墨打印机的打印头，所述的打印头具有与每个墨喷嘴(22)相关联的准直器(84)以滞留从损坏的喷嘴(22)喷射出的错误处置的墨滴(150)。所述的准直器(84)形成在盖住外部或者喷嘴阵列的喷嘴档板(80)上。每个准直器(84)都有一个细长通道形式的孔隙，所述细长通道的纵向尺度远超过通过的其孔径尺寸。

Description

喷墨准直器
技术领域
本发明涉及数字打印机，尤其涉及喷墨打印机。
背景技术
喷墨打印机是我们公知并广泛使用的打印形式。油墨被送到打印头上的一组数字控制的喷嘴阵列中。当打印头通过打印介质上方时，喷出油墨墨在打印介质上产生图像。
打印机的性能取决于诸如工作成本、打印质量、运行速度和易于操作之类的因素。总体上，从喷嘴喷出单独墨滴的频率和速度会影响这些性能参数。
近来，人们采用微电机械系统(MEMS)技术制成具有亚微米厚度机械结构的喷嘴阵列这就使得能够制造出可以快速地喷射大小在微微升(×10-12升)级的墨滴的打印头。
尽管这样的打印头的显微结构可以以相对低廉的价格提供高速度和良好的打印质量，但是其尺寸使喷嘴极为脆弱，会由于手指、灰尘或者介质衬底的最轻微的接触而被损坏。这使得这种打印头在多数要求打印头有一定坚固性的实际应用中变得不实用。而且损坏了的喷嘴可能不能喷出馈送给它的油墨。墨累积起来并且在喷嘴的外部形成墨珠，可能会影响到周围喷嘴的喷墨和/或损坏的喷嘴会直接地向衬底上漏墨。这两种情况都不利于打印质量。
在其它的情况下，损坏的喷嘴只能沿错误处置的轨迹喷射墨滴。显然，这也降低了打印质量。
发明内容
因此，本发明提供一种喷墨打印机的打印头，所述的打印头包括：
一组用于向打印介质上喷墨的喷嘴阵列组件；
一个用于盖住喷嘴阵列喷嘴档板，所述的喷嘴挡板具有一组分别对应于每个喷嘴组件的孔隙阵列；其中每个挡板中的孔隙的尺寸和构形设置车成防止从喷嘴喷出的错误取向的墨到达打印介质。
在本说明书中，术语“喷嘴组件”理解为元件的组合，尤其是一种开口的组合。它不被解释为开口本身。
优选地，在挡板中的孔隙是具有一个纵向尺度的通道，所述的纵向尺度显著超过孔径尺寸以给每个喷嘴各提供一个准直器。
读者会理解对于本发明的用途，所述孔隙的截面可以是一个适宜的形状但参照孔隙的孔径尺寸不是必须限制孔隙的截面为圆截面。
在本发明的另一个优选的实施例中，把打印头适于检测任何喷嘴组件中的运行故障继而停止向它们供墨。在该实施例中，打印头还可以一种容错装置，用于调节喷嘴阵列内的其它喷嘴组件的运行以补偿一些损坏的喷嘴组件。
在这些实施例中，希望提供一种约束结构用于至少把一个喷嘴组件的漏墨的或者喷射错误处置的墨与其余的喷嘴组件隔离开。在一个特别优选的实施例中，阵列中的每个喷嘴组件都有各自的约束结构用于至少把一个喷嘴组件的漏墨或者被错误处置的墨与其余的喷嘴组件隔离开。
在一个实施例中，每个喷嘴上使用一个热弯曲致动器以喷射墨滴和一个控制器用于检测弯曲该致动器所需的能量，然后与准确动作的喷嘴组件所用的能量相比较以检测运行故障。在本发明的一个优选实施例中，喷嘴上装有触点，所述触点布置使得：在致动过程中，当弯曲致动器处于其行程极限时一个电路闭路，从而控制器可以测量将致动器移动到其行程极限所消耗的功率和所占用的时间，从而计算出弯曲制动器所要求的能量。如果控制器检测到喷嘴中的运行故障，它就触发容错装置继而停止向该喷嘴进一步供墨。
约束结构必然地占用打印头的一定比例的表面积，并且给喷嘴的组装密度带来不利影响。所要求的额外的打印头芯片面积可能将芯片的制造成本增加20％。然而在喷嘴制品不可靠的情况下，这将会有效地降低故障率。
在一个特别优选的实施例中，喷嘴挡板适用于阻止与喷嘴的损坏性接触。而且，优选地是用硅制成喷嘴档板。
喷嘴挡板还可以包括流体入口用于引导经过通道的流体，以阻止外来颗粒累积在喷嘴阵列上。
喷嘴挡板可以包括一个用于支撑打印头上喷嘴护罩的支承装置。所述的支承装置可以是整体成形并且包括一对安装在喷嘴挡板两端的间隔开的支承元件。
在该实施例中，流体入口可以安装进所述支承元件之一中。
应当理解，当空气从开口经喷嘴阵列的上方并从通道出来时，就阻止了外来颗粒累积在喷嘴阵列上。
流体入口可以安排在支承元件中，该支承元件远离喷嘴阵列的连接垫。
本发明通过把从损坏的喷嘴组件中喷出的错误处置的墨留滞住来保持打印质量。贯穿挡板的细长通道起准直器的作用，所述的准直器可以把墨收集在其侧壁上。而且，挡板防止精细的喷嘴结构受到多数其它表面的接触或者碰撞。通过用硅制成屏蔽，使热膨胀系数基本上与喷嘴阵列的热膨胀系数相匹配。这会有助于防止挡板中的通道阵列从带有喷嘴阵列的定位装置中脱落、使用硅还使得屏蔽可以用MEMS技术精确地微加工。而且硅非常坚固并且基本上是不可变形的。
附图说明
下面结合附图仅通过举例来对本发明的优选实施例进行描述。
图1所示为一个喷墨打印头的一个喷嘴组件的立体图；
图2至4所示为图1所示的喷嘴组件的工作示意图；
图5所示为带有喷嘴档板或者约束壁的喷墨打印头的构成——一个喷嘴阵列的立体图；
图5a所示为本发明的一个带有喷嘴档板和约束壁的打印头的立体剖视图；
图5b示出在隔离每个喷嘴的约束壁上的喷嘴的平面剖视图；
图6所示为图5所示喷嘴阵列的局部放大图；
图7所示为一个喷墨打印头的立体图，该喷墨打印头包括喷嘴而没有约束壁；
图8a至8r所示为喷墨打印头的喷嘴组件的制造步骤的立体图；
图9a至9r所示为制造步骤的侧剖视图；
图10a至10k所示为在制造过程中各个步骤所使用的掩模布局；
图11a至11c所示为根据图8和9所示方法制造的喷嘴组件的工作的立体图；
图12a至12c所示为根据图8和9所示方法制造的喷嘴组件的工作的侧剖视图。
具体实施方式
首先参阅图1，本发明的喷嘴组件一般用标号10标示出。一个喷墨打印头具有多个在阵列14(如图5和6所示)中排列在硅基片16上的喷嘴组件10。阵列14将在下文较详细地予以说明。
喷嘴组件10包括一个硅基片16，介电层18沉积在其上。一个CMOS钝化层20沉积在介电层18上。
每个喷嘴组件10包括一个界定喷嘴开口24、杆臂26形式的连接构件和致动器28的喷嘴22。通过杆臂26把致动器28连接到喷嘴22上。
如在图2至4中较详细地示出，喷嘴22包含一个冠部30，所述的冠部带有一个从冠部30下垂的裙边部分32。裙边部分32形成喷嘴室34的周壁的一部分。喷嘴开口24与喷嘴34流体连通。请注意喷嘴开口24由隆起的缘36包围，所述的隆起的缘36用来“插入”喷嘴室34中墨水主体40的弯液面38(图2)。
一个进墨孔42(在图6中表示得最清楚)界定在喷嘴室34的底板46中。所述的孔隙42与由底板16界定的一个进墨通道48流体连通。
一个壁部50限定孔隙42并且从底板46向上伸展。如上所述，喷嘴22的裙边部分32界定喷嘴室34的周壁的第一部分，而所述壁部50界定喷嘴室34的周壁的第二部分。
壁部50的自由端具有一个向内指的唇边52，用作一个液体封闭装置，防止在喷嘴22移动时墨的逸出，这将在下文中详述。可以注意到，由于墨40的粘度和唇边52与裙边部分32之间间隔的尺寸很小，向内指的唇边52加之墨水的表面张力起到了防止墨从喷嘴室34逸出的有效的封闭作用。
致动器28是一种热弯曲致动器，连接在从基片16向上伸展的，或者更具体地从CMOS钝化层20向上伸展的簧片54上。簧片54安装在与致动器28电气连接的导电板56上。
致动器28含有第一主动梁58，位于一个第二被动梁60的上方。在一个优选的实施例中，梁58和60有或者包括诸如氮化钛(TiN)之类的导电陶瓷材料。
梁58和60都具有一个固附在簧片54上的第一端，并且其相对端与杆臂26相连。当电流产生流过主动梁58时，导致梁58热膨胀。作为被动梁60，没有电流流过，所以不以相同的速率膨胀，这样就产生一个弯矩使得杆臂26连同喷嘴22向着基片16的方向向下推移，如图3中所示。这引起墨从喷嘴开口24喷出，如在62处所示。当从主动梁58移走热源，即断掉电流时，喷嘴22返回到其静止位置，如图4所示。当喷嘴22返回其静止位置时，如图4中的66处所示的墨滴颈部断开的而形成墨滴64。墨滴64然后转移到诸如纸之类的打印介质上。作为墨滴64形成的结果，形成一个“凹形”弯液面，如图4中的68处所示。该“凹形”弯液面引起墨40流进喷嘴室34，从而形成新的弯液面38(图2)为从喷嘴组件10喷出下个墨滴作好准备。
现在结合图5和图6详细地说明喷嘴阵列14。所述的阵列14用于四色打印头。因此，阵列14包括四个各用于一个颜色的喷嘴组件组70。每个组70具有一个其按两行72和74排列的喷嘴组件10。组70之一较详细地示于图6之中。
为了更加密排行72和74中的喷嘴组件，把行72中的喷嘴组件相对于行72中的喷嘴组件10偏移排列，或者交错排列。还有，行72中的喷嘴组件10充分地彼此间隔开，以使行74中的喷嘴组件10的杆臂26能够在行72中的组件10的相邻喷嘴22之间通过。请注意每个喷嘴组件10基本上都做成哑铃形以便使行72的喷嘴22嵌套在行74的相邻喷嘴组件10的喷嘴22和致动器28之间。
而且，为了更加密排行72和74的喷嘴22，每个喷嘴基本上都做成六角形的。
领域内普通技术人员可以理解，在工作时，喷嘴22向基片16移位时，由于相对喷嘴室34很小的一个角度的喷嘴开口24稍被推挤得离开垂直。图5和图6所示的排列的优点是在行72和74中的喷嘴组件10的致动器28沿相同的方向伸向行72和74的一侧。因此从行72中的喷嘴22喷出的墨和从行74中的喷嘴22喷出的墨由于角度相同而相互补偿，结果提高了打印的质量。
同样，如图5所示，基片16具有安装在其上的连接垫76，所述的连接垫76通过导电片56电连接到喷嘴组件10的致动器28上。这些电连接经CMOS层(未图示)形成。
参见图5a和5b，图5中所示的喷嘴阵列14彼此隔开以容纳环绕每个喷嘴组件10的约束构造。所述的约束构造是一个约束壁144，所述约束壁包围喷嘴22并且从硅基片16伸向有孔隙的喷嘴挡板80的下侧形成一个约束室146。如果由于喷嘴的损坏而不能正当地喷墨时，漏墨被封闭在约束室中从而不影响周围喷嘴的功能。
每个约束室146中的漏墨通过监测从喷嘴开口24喷射一滴墨所需要的功率来检测出。如果约束室16被泄漏的或错误处置的墨充满，对从喷嘴开口24喷射出的墨的阻力就会增加。热弯曲致动器28消耗的能量也会增加，这表明喷嘴组件10被损坏。对打印头控制器的反馈就停止致动器18和对喷嘴组件10的进一步工作。使用容错装置可以通过阵列14中的其余喷嘴补偿，从而保持打印质量。参阅图9i，CMOS钝化层20具有一个从晶片基片16向上伸的自由端。
约束壁144必然占据硅基片16的面积的一部分，这降低了阵列的喷嘴组装密度。这转而增加了打印头芯片的制造成本。然而在制造技术产生相对高的喷嘴磨损率时，各个喷嘴约束结构会消除或者至少把对打印质量的不利影响减到最小。
领域内普通技术人员会理解，还可以对隔离的喷嘴群构成约束结构。隔离的喷嘴群提供较好的喷嘴组装密度，但是使用周围喷嘴群补偿损坏的喷嘴变得较为困难。
图7是一个喷嘴阵列和一个没有约束壁的喷嘴挡板。对于以上各图，除非另有说明，相同的标号指示相同的部件。
一个喷嘴挡板80安装在阵列14的硅基片16上。喷嘴档板80包括一个护板82，所述护板82具有若干由之界定的孔隙84。孔隙84与阵列14的喷嘴组件10的喷嘴开口24对齐，以便于当墨从喷嘴开口24中任何一个喷射出时，墨在喷到打印介质之前穿过相关的通道。
档板80是硅的，从而它具有足够的强度和刚性保护喷嘴阵列14防止由于灰尘或者使用者的手指接触而被损坏。通过用硅制成档板，其热膨胀系数基本上与喷嘴阵列的热膨胀系统匹配。这旨在防止打印头的温度升高到正常的工作温度时，护板82中的孔隙84从定位装置中脱落。硅还适于使用MEMS技术进行准确的微机械加工，所述的MEMS技术将在下面关于喷嘴组件10的制造中详细论述。
护板82通过臂或者说柱86相对于喷嘴组件10隔开安装。柱86之一具有界定于其中的空气入口88。
在打印机工作时，阵列14动作，空气经过入口88进入，被迫与流经孔隙84的墨一起经过孔隙84。
当空气以一个与墨滴64不同的速度冲过孔隙84时，墨不被带入到空气中。例如，墨滴64以大约3m/s的速度从喷嘴22喷射出。空气以大约1m/s的速度经孔隙84进入。
空气的用途是保持孔隙84摆脱外来颗粒。存在有这些外来颗粒，譬如灰尘颗粒，会落在喷嘴组件10上不利地影响其工作的危险。通过在喷嘴档板80中提供空气入口88，在较大的程度上避免了这个问题。
如果外来的颗粒粘附在喷嘴组件上，喷射的墨可能会被错误处置。类似地，在制造中不精确的喷嘴构成也可以得出错误处置的墨滴。如图7a和7b所示，在喷嘴档板80中的孔隙84可以作为准直器用于挡住错误处置的墨滴。通过仔细地把档板孔隙84对齐喷嘴22，从损坏的喷嘴22喷出的墨被档板80收集，从而防止喷到打印介质上。图7a示出一个从损坏的喷嘴组件10喷射出的错误处置了的墨滴150。当墨滴150从预期的墨轨道喷射出时，这碰到并且贴附到档板孔隙84的侧壁。图7b示出未损坏的喷嘴组件10沿预期的轨道向要打印的介质喷射墨滴150，没有受到档板80的阻挡。
图5a和5b中所示的约束壁144可以用于防止错误处置的墨的积累影响任何周围喷嘴的工作。再有，以上相对于约束壁讨论的检测传感器会检测出在约束室146中墨的存在，并且向控制打印头的微处理器提供反馈，所述的微处理器转而停止对损坏的喷嘴供墨。为了保持打印质量，容错装置调整阵列14中的其它喷嘴22的工作以补偿损坏的喷嘴22。
下面参阅图8至10，讨论喷嘴组件10制造方法。
以硅基片或者说晶片16开始，在晶片的表面上沉积介电层18。所述介电层是大约1.5微米的CVD氧化物的形式。在层18上离心铺设抗蚀剂并且把层18暴露向掩模100并且接着显影。
在显影后把层18等离子蚀刻到硅层16。剥去抗蚀层并且清洁层18。该步骤界定进墨口孔隙42。
在图8b中，大约0.8微米的铝102沉积在层18上。在铝102上离心铺设抗蚀剂，并且把铝102暴露向掩模104，并且显影。把铝102等离子蚀刻到氧化层18。剥去抗蚀层并且清洁所述装置。该步骤提供连接垫和对喷墨致动器28的互相连接线。该互相连接线通到NMOS驱动晶体管和在CMOS层中与带有连接线的电源板(未示)。
沉积大约0.5微米的氮化PECVD作为CMOS钝化层20。离心铺设抗蚀剂，并且把层20暴露向掩模106，此后在该掩模处显影。在显影后把氮化物等离子蚀刻到铝层102和入口孔隙42的区域中的硅层16。剥去抗蚀层并且清洁所述装置。
在层20上离心铺设阴极保护材料层108。层108是6微米的光敏聚酰亚胺或者约4微米的高温抗蚀剂。把层108软烘烤然后暴露向掩模110，此后显影。然后，如层108由聚酰亚胺构成，就把层108在400℃硬烘烤一个小时，或者在层108是高温抗蚀剂时，在300℃以上硬烘烤。应当注意在附图中设计掩模时要考虑由于皱缩引起的聚酰亚胺层的图案相关性畸变。
在图8e所示的下一个步骤中，施加一个第二阴极保护材料层112。层112或为离心抛设的2微米的光敏聚酰亚胺或为约1.3微米的高温抗蚀剂。把层112软烘烤然后暴露向掩模114。在对掩模114曝光后层112显影。在层112是聚酰亚胺的情况下，在400℃把层112硬烘烤约一个小时。在层112是抗蚀剂的情况下，在300℃以上温度硬烘烤约一个小时。
然后在0.2微米的复层上沉积金属层116。该层116的部分形成致动器28的被动梁60。
通过在300℃左右温度喷溅1,000埃氮化钛(TiN)接着再喷溅50埃氮化钽(TaN)形成层116。再喷溅1,000埃氮化钛(TiN)接着再喷溅50埃氮化钽(TaN)和1,000埃氮化钛(TiN)。可以用于代替TiN的其它材料是TiB2、MoSi2或者(Ti，Al)N。
然后把层116暴露向掩模118，显影并且等离子蚀刻到层112，其后把施加在层116上的抗蚀层湿剥离，小心不要去掉固化了的层108或112。
通过在4微米的光敏聚酰亚胺上或者2.6微米的高温抗蚀剂上离心铺设施加一个第三牺牲层120。把层120软烘烤然后向掩模122暴露。把暴露的层进行显影，接着硬烘烤。在聚酰亚胺的情况下，在400℃硬烘烤约一个小时，或者在层120由是抗蚀剂构成的情况下在300℃以上温度硬烘烤。
在层120上施加一个第二多层金属层124。层124的构成与层116相同并且以相同的方法施加。应当理解层116和层124都是导电层。
把层124暴露向掩模126，然后显影并且把层124等离子蚀刻到聚酰亚胺或抗蚀层120，其后把施加在层124上的抗蚀层湿剥离，小心不要去掉固化了的层108、112或120。会注意到层124的余留部分界定致动器28的主动梁58。
通过在4微米的光敏聚酰亚胺上或者在约2.6微米的高温抗蚀剂上离心铺设施加一个第四牺牲层128。把层128软烘烤，向掩模130暴露，然后进行显影，留下如图9k所示的岛状部分。把层128的余留的部分为聚酰亚胺的情况下，在400℃硬烘烤约一个小时，或者对于抗蚀剂情况下，在300℃以上温度硬烘烤。
如图8l所示沉积一个高杨氏模数的介电层132。层132是由约1微米的氮化硅或者氧化铝构成的。层132是在牺牲层108、112、120、128的硬烘烤温度以下的温度沉积的。对该介电层132的主要要求是高的弹性模数、化学惰性和对TiN的良好贴附性。
通过在2微米的光敏聚酰亚胺上或者在约1.3微米的高温抗蚀剂上离心铺设施加一个第五牺牲层134。把层134软烘烤，向掩模136暴露，然后进行显影。把层134的余留的部分在聚酰亚胺的情况下，在400℃硬烘烤一个小时，或者对于抗蚀剂情况下，在300℃以上温度硬烘烤。
把介电层132等离子蚀刻到牺牲层128，小心不要去掉任何牺牲层134。
该步骤界定喷嘴组件10的喷嘴开口24杆臂26和簧片54。
沉积一个高杨氏模数的介电层138。层138通过在牺牲层108、112、120和128的硬烘烤温度以下的温度沉积0.2微米的氮化硅或者氧化铝形成的。
然后如图8p所示，把层138用异向性等离子蚀刻到0.35微米的深度。该蚀刻旨在从除介电层132和牺牲层134的侧壁外的整个表面清除介电层。该步骤产生绕喷嘴开口24的喷嘴缘36，所述的喷嘴缘36“插入”墨的弯液面中，如前所述。
施加紫外线(UV)释放带140。在硅晶片16的后部离心铺设4微米的的抗蚀剂。把晶片160向掩模142暴露以烘烤蚀刻晶片16以界定进墨口通道48。然后把该抗蚀剂从晶片上剥落。
在晶片16的后部施加另一个紫外线(UV)释放带140然后去掉释放条140。在氧等离子体中剥落牺牲层108、112、120、128和134以提供如图8r和9r所示的成品喷嘴组件10。为了便于参照，在这两个图中所示的标示喷嘴组件的相关部分的标号与图1中相同。图11和12为按照图8和9和相应于图2至4的图形所示的工艺制造的喷嘴组件的工作。
领域内的普通技术人员会理解可以对特定实施例所示的本发明做出各种变例和/或修改，而不偏离泛泛说明的本发明的精神和范围。因此所述实施例可以认为在所有方面都是阐述性的而不是限制性的。

Claims (15)

1.一种喷墨打印机的打印头，所述的打印头包括：
一个用于向打印介质上喷墨的喷嘴组件阵列；和
一个盖住喷嘴阵列的喷嘴档板，所述的喷嘴挡板具有一个各自相应于每个喷嘴组件的孔隙阵列，其中
每个挡板中的孔隙是纵向尺寸超过其孔径尺寸的通道，用以防止从喷嘴组件喷出的错误处置的墨抵达介质。
2.如权利要求1所述的打印头，其特征在于，所述孔隙为每个喷嘴各提供一个准直器。
3.如权利要求1所述的打印头，其特征在于，所述打印头适于检测任何一个喷嘴组件中的运行故障，继而停止向它们供墨。
4.如权利要求1所述的打印头，其特征在于，所述打印头还包括一个容错装置，所述容错装置用来调节阵列中的其它喷嘴组件的工作以补偿任何损坏的喷嘴构件。
5.如权利要求4所述的打印头，其特征在于，所述打印头还包括一种约束结构，用于至少把一个喷嘴组件的漏墨或者被错误处置的墨与其余的喷嘴组件隔离开。
6.如权利要求4所述的打印头，其特征在于，所述阵列中的每个所述的喷嘴组件都有各自的约束结构用于至少把一个喷嘴组件的漏墨或者被错误处置的墨与每个个别的喷嘴组件隔离开。
7.如权利要求5或6所述的打印头，其特征在于，每个约束室都有墨检测装置，所述墨检测装置在所述约束室中的墨达到预定的墨量时致动，并且为一个容错装置提供反馈以调节阵列内所述的其它喷嘴的工作，从而补偿所述的损坏的喷嘴。
8.如权利要求7所述的打印头，其特征在于，所述喷嘴具有触点，所述触点布置使得：在致动过程中，当所述弯曲致动器处于其行程极限时一个电路闭路，从而控制器可以测量将所述致动器移动到其行程极限所消耗的功率和所占用的时间，从而计算出弯曲所述制动器所要求的能量。
9.如权利要求8所述的打印头，其特征在于，所述控制器检测到所述喷嘴中运行故障，所述控制器就触发容错装置，继而停止向所述嘴的任何进一步供墨。
10.如权利要求1所述的打印头，其特征在于，所述喷嘴挡板适配用于防止损坏性接触喷嘴。
11.如权利要求10所述的打印头，其特征在于，所述喷嘴挡板用硅制成。
12.如权利要求11所述的打印头，其特征在于，所述喷嘴挡板还包括用于引导流经所述通道的流体的流体入口，以抑制外来颗粒堆积阻塞在喷嘴阵列上。
13.如权利要求12所述的打印头，其特征在于，所述打印头还包括支承柱用于把喷嘴护板支承到打印头上。
14.如权利要求13所述的打印头，其特征在于，所述的支承柱是整体构成的，并且所述支承柱安装在所述喷嘴档板的每一端上。
15.如权利要求14所述的打印头，其特征在于，所述流体入口位于所述支承柱之一上远离所述喷嘴阵列的连接垫。
CNB028172892A 2001-09-04 2002-08-21 喷墨准直器 Expired - Fee Related CN1287987C (zh)

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