CN1625482A - 喷墨打印头的喷嘴防护装置 - Google Patents

喷墨打印头的喷嘴防护装置 Download PDF

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CN1625482A
CN1625482A CNA028289404A CN02828940A CN1625482A CN 1625482 A CN1625482 A CN 1625482A CN A028289404 A CNA028289404 A CN A028289404A CN 02828940 A CN02828940 A CN 02828940A CN 1625482 A CN1625482 A CN 1625482A
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卡·西尔弗布鲁克
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Abstract

一种喷墨打印头机的打印头包括至少一个打印头芯片，所述至少一个打印头芯片包括一个衬片(16)，和多个置于所述衬片上喷嘴装置(10)。每个喷嘴装置(10)包括确定一个喷嘴腔的一个顶壁和喷嘴腔壁。一个喷嘴防护装置(80)置于打印头芯片上并且包括一个体部构件(82)，所述体部构件(82)与打印头芯片间隔开并且跨打印头芯片，所述体部构件确定多个经体部构件延伸的通道(84)，所述体部构件布置得使每个通道(84)与喷墨口之一对准。一个支承结构置于体部构件与打印头芯片之间。所述支承结构构造为允许空气流入一确定在体部构件与打印头芯片之间的空间并且经过每个通道，以保持通道没有颗粒。

Description

喷墨打印头的喷嘴防护装置
技术领域
本发明涉及一种喷墨打印头。更加特别地，本发明涉及一种喷墨打印头的喷嘴防护装置。
背景技术
我们的共同待批的申请，美国专利申请09/575,141公开了一种喷墨打印头的喷嘴防护装置，所述申请并入本文作为参引。喷嘴的阵列使用微电子机械系统(MEMS)技术形成，并且具有亚微米厚度的机构结构。这样的结构非常脆，并且可能由于与纸、手指和其它物体接触而损坏。本发明公开了一种喷嘴防护装置保护脆性的喷嘴并且保持它们没有纸尘。
发明内容
根据本发明，提供一种喷墨打印机的打印头，所述喷墨打印头包括：
至少一个打印头芯片，所述至少一个打印头芯片包括：
一个衬片，和
多个置于所述衬片上喷嘴装置，每个喷嘴装置包括：
喷嘴腔壁和一个顶壁，所述喷嘴腔壁和顶壁确定一个喷嘴腔，所述顶壁确定至少一个喷墨口；和
一个喷墨机构，所述喷墨机构工作地相对于喷嘴腔壁布置，在喷墨机构位移时从所述至少一个喷墨口喷墨，
一个喷嘴防护装置置于所述的或者每个对应的打印头芯片上，所述喷嘴防护装置包括：
一个体部构件，所述体部构件与打印头芯片间隔开并且跨打印头芯片，所述体部构件确定多个经体部构件延伸的通道，所述体部构件布置得使每个通道与喷墨口之一对齐，体部构件的厚度和每个通道的截面积使得从喷墨口喷射的墨可以从所述通道穿过；以及
一个支承结构，所述支承结构置于体部构件与打印头芯片之间，所述支承结构构造为允许空气流入确定于体部构件与打印头芯片之间的空间并且经过每个通道，以保持通道没有颗粒。
所述衬片可以是硅晶片的形式。每个打印头装置可以是集成电路制造工艺的产品，所述集成电路制造工艺在硅晶片衬片上进行，从而使喷嘴腔确定一个微电子机械系统。
支承结构可以由多个置于体部构件与打印头芯片之间的支撑确定。
附图说明
下面将参照附图，以举例的方式说明本发明。在所述附图中：
图1示出一个喷墨打印头的一个喷嘴总成的三维示意图；
图2至4是图1示出的喷嘴总成运行的三维示意图；
图5示出构成一个喷墨打印头的喷嘴阵列的三维示意图；
图6放大地示出图5所示的阵列的一部分；
图7示出根据本发明的一个包括一个喷嘴防护装置的喷墨打印头的三维示意图；
图8a至8r为示出一个喷墨打印头的一个喷嘴总成的制造步骤的三维视图；
图9a至9r为示出制造步骤的侧视剖面图；
图10a至10k示出用在制造工艺中的各步骤的掩模布局；
图11a至11c为示出根据图8和9的方法制造的喷嘴总成的运行的三维视图。
图12a至12c为示出根据图8和9的方法制造的喷嘴总成的运行的侧视剖视图。
具体实施方式
首先参照图1，根据本发明的一个喷嘴总成总体上用标号10指代。一个喷墨打印头具有多个在硅衬片16上排列在一个墨水阵列14(图5和6)的喷嘴总成10。下面较详细地说明阵列14。
所述总成12包括一个硅衬片或者说晶片16，其上沉积一个介电层18。一个CMOS钝化层20沉积在介电层18上。
每个喷嘴总成10包括一个确定一个喷嘴口24的喷嘴22、一个杠杆臂26形式的连接构件和一个致动器28。杠杆臂26把致动器28连接到喷嘴22。
如在图2至4中较详细地所示，喷嘴22包括一个冠部30，所述冠部30带有从该冠部30垂下的裙部32。所述裙部32形成喷嘴腔34的周边壁的部分(图2至4)。喷嘴口24与喷嘴腔34流体连通。应当注意到喷嘴口24由一个隆起框缘36(图2)包绕，隆起框缘36“别住”一个喷嘴腔34中的墨40的体部的半月形38。
一个墨输入口孔隙42(图6中所示最清楚)确定于喷嘴腔34的一个底面46中。孔隙42与穿过衬片16确定的墨输入槽路48流体连通。
一个壁部50限界孔隙42并且从底部46向上延伸。如以上所述，喷嘴22的裙部32确定喷嘴腔34的周边壁的一个第一部分并且壁部50确定喷嘴腔34的周边壁的一个第二部分。
壁50在其游离端具有向内指的唇部52，该唇部用作流体密封防止在位移喷嘴22时墨逸出，下面将更详细地说明。可以看出，由于墨40的粘性以及唇部52与裙部32之的间隔尺度小，向内指的唇部52和表面张力起到有效密封的作用，用于防止墨从喷嘴腔34逸出。
致动器28是一种热弯致动器并且连接到一个从衬片16向上伸或者更加具体地说从CMOS钝化层20向上伸的锚件54上。锚件54安装在导电垫片56上，形成与致动器28的电气连接。
致动器28包括一个第一主动梁58，所述第一主动梁58安排在一个第二被动梁60上方。两个梁58和60都是，或者包括一种导电陶瓷材料，譬如氮化钛(TiN)。
两个梁58和60都具有锚在锚件54上的第一端并且其对置的端连接到臂26。当使一个电流流经主动梁58时，梁58热膨胀。由于被动梁60中没有电流流过，故而被动梁60不以相同的比率膨胀，从而产生一个弯曲运动，引起臂26进而引起喷嘴22向下朝向衬片16位移，如图3中所示。这引起经喷嘴口24喷墨，如在图3中的62处所示。从主动梁58取消热源，也就是停止电流时，喷嘴22返回其静态的位置，如图4中所示。当喷嘴22返回其静态位置时，由于一个小墨滴颈部断裂结果形成一个小墨滴64，如图4中的66处所示。然后该墨小滴64运行到打印介质，譬如一张纸上。作为形成小墨滴64的结果，形成一个“负的”半月形，如图4中的68处所示。该“负的”半月形68导致墨40流入喷嘴腔34中，从而形成一个新的半月形38(图2)以准备下一次从喷嘴总成10喷射墨滴。
现在参见图5和图6更详细地说明喷嘴阵列14。该阵列14用于一个四色打印头。因此，阵列14包括四个喷嘴总成组70，每组用于一个颜色。每组70具有其安排为两排72和74的喷嘴总成10。一个组70更详细地示于图6中。
为了便于排72和74中的喷嘴总成10的紧凑封装，排74中的喷嘴总成10相对于排72中的喷嘴总成10偏移或者说错开。还有排74中的喷嘴总成10相互间隔开足够远，使得排74中的喷嘴总成10的杠杆臂26能够在排72中的喷嘴总成10的相邻的喷嘴22之间通过。还应注意每个喷嘴总成10基本上是哑铃形状的，从而使排72中的喷嘴22嵌在排74中的相邻的喷嘴总成10的致动器28与喷嘴22之间。
而且，为了便于排72和74中的喷嘴22的紧凑封装，每个喷嘴22基本上为六边形形状。
本领域内普通技术人员可以理解，在使用中，当向衬片66位移喷嘴22时，由于喷嘴口24相对于喷嘴腔34稍成角度，墨稍微偏离垂直方向地喷射。图5和6中所示的安排的一个优点是排74和72中的喷嘴总成10的致动器28在同一个方向延伸到排74和72的一侧。因此从排72中的喷嘴22中喷射出的墨滴和从排74中的喷嘴22中喷射出的墨滴相对于彼此偏离相同的角度，结果提高了打印质量。
还有，如图5中所示，衬片16具有安排于其上的连接垫片76，所述连接垫片76经垫片56提供至喷嘴总成10的致动器28的电气连接。这些电气连接经CMOS层(未示)形成。
参见图7，图中示出本发明的一个发展。相对于以前的各图，除非另有说明，相同的标号指代相似的部分。
在此发展中，一个喷嘴防护装置80安装在阵列14的衬片16上。喷嘴防护装置80包括一个的体部构件82，体部构件82具有多个经之确定的通道84。通道84与阵列14的喷嘴总成10的喷嘴口24对应，从而，当从喷嘴口24之一喷墨时，墨在射在打印介质上之前通过相关联的通道84。
通过翼或者说支撑86把体部构件82以处于对喷嘴总成10的间隔开的关系安装。支撑86之一具有确定于其中的空气入口88。
在使用中，当阵列14运行时，经入口孔88充以空气以使之能够被迫入通道84中与墨一起穿过通道84。
当以与墨滴64的速度不同的速度经通道84充以空气时，墨不会被空气夹带。例如，以约3m/s的速度从喷嘴22喷射墨滴64。以约1m/s的速度经通道84充空气。
空气的用途是保持通道84没有异物颗粒。存在危险：诸如纸尘之类的异物颗粒会落在并且贴附到喷嘴防护装置80的前表面上而阻塞通道。经通道84吹入的空气防止灰尘在通道84区域沾染和贴附到喷嘴防护装置。
下面参见图8至10，说明制造喷嘴总成10的一种工艺。
从硅衬片或者说晶片16开始，在晶片16的一个表面上沉积一个介电层18，所述介电层18是大约1.5微米的CVD氧化物的形式。在层18上旋涂阻蚀剂，并且把层18暴露于掩模100并且接着显影。
在显影以后，把层18向下等离子蚀刻到硅层16。然后剥去阻蚀剂并且对层18进行清洁。此步骤确定墨输入口孔隙42。
在图8b中，在层18上沉积约0.8微米的铝102。旋涂阻蚀剂，并且把铝102暴露于掩模104并且接着显影。把铝102向下等离子蚀刻到氧化物层18，剥去阻蚀剂并且清洁所述装置。此步骤提供连接垫片和至喷墨致动器28的相互连接。此相互连接是至一个NMOS驱动晶体管和一个电源层，该电源层带有制造在CMOS层(未示)中的连接。
沉积约0.5微米的PECVD氮化物作为CMOS钝化层20。旋涂阻蚀剂并且把层20暴露于掩模106然后把它显影。显影后在入口孔隙42的区域中把氮化物向下等离子蚀刻到铝层102和硅层16。剥去阻蚀剂并且清洁所述装置。
在层20上旋涂牺牲材料层108。层108是6微米的光敏聚酰亚胺或者约4微米的高温阻蚀剂。把层108软烘烤(softbake)并且然后暴露于掩模110，此后把它显影。然后，在层108包括聚酰亚胺的情况下把层108在400℃下硬烘烤(hardbake)一个小时，或者在层108是高温阻蚀剂的情况下在高于300℃的温度下硬烘烤。应当注意在附图中，在掩模110的设计中考虑进了由于绉缩引起聚酰亚胺层108的图样依从性畸变(pattern-dependent distortion)。
下一个步骤中，示于图8e中，施加一个第二牺牲层112。层112或者是一个旋涂的2微米光敏聚酰亚胺，或者是约1.3微米的高温阻蚀剂。把层112软烘烤并且暴露于掩模114。在暴露于掩模114后把层112显影。在层112是聚酰亚胺的情况下，把层112在400℃下硬烘烤一个小时。在层112是阻蚀剂的情况下在高于300℃的温度下硬烘烤约一个小时。
然后沉积一个0.2微米的多层金属层116。层116的一部分形成致动器28的被动梁60。
层116通过在约300℃喷涂1000埃的氮化钛(TiN)接着喷涂50埃的氮化钽(TaN)形成。再喷涂上另一个1000埃的TiN，接着喷涂50埃的TaN，并且再喷涂一个1000埃的TiN。
可以用于代替TiN的其它材料有TiB2、MoSi2或者(Ti，Al)N。
然后把层116暴露于掩模118，显影并且向下等离子蚀刻到层112，此后湿剥离为层116施加的阻蚀剂，小心不要去掉硬化了的层108或者112。
通过旋涂上4微米的光敏聚酰亚胺或者是约2.6微米的高温阻蚀剂施加一个第三牺牲层120。把层120软烘烤，此后将其暴露于掩模122。然后把暴露了的层120显影，接着硬烘烤。在层120是聚酰亚胺的情况下，把层120在400℃下硬烘烤一个小时，或者在层112是阻蚀剂的情况下在高于300℃的温度下硬烘烤。
然后向层120施加一个第二多层金属层124。层124的构成与层116的构成相同并且用相同的方式施加。可以看出，两个层116和124都是导电的层。
把层124暴露于掩模126并且然后显影。把层124向下等离子蚀刻到聚酰亚胺或者阻蚀剂层120，此后湿剥离为层24施加的阻蚀剂，小心不要去掉硬化了的层108、112或者120。可以注意到层124的剩余部分确定致动器28的主动梁58。
通过旋涂上4微米的光敏聚酰亚胺或者是约2.6微米的高温阻蚀剂施加一个第四牺牲层128。把层128软烘烤、暴露于掩模130，然后显影以留下图9k中所示岛部。把层28的剩余部分硬烘烤，在是聚酰亚胺的情况下于400℃下硬烘烤一个小时，在阻蚀剂的情况下在高于300℃的温度下硬烘烤。
如图81中所示，沉积一个高杨氏模量介电层132。层132由约1微米的氮化硅或者氧化铝构成。层132在低于牺牲层108、112、120、120、128的硬烘烤温度的温度下沉积。对于该介电层132所要求的主要特性是高弹性模量、化学惰性和对TiN良好的粘附性。
通过旋涂上2微米光敏聚酰亚胺或者是约1.3微米的高温阻蚀剂施加一个第五牺牲层134。把层134软烘烤，暴露于掩模136并且显影。把层128的剩余部分硬烘烤，在是聚酰亚胺的情况下于400℃下硬烘烤一个小时，对于阻蚀剂的情况在高于300℃的温度下硬烘烤。
把介电层132向下等离子蚀刻到牺牲层128，小心不要去掉任何牺牲层134。
该步骤确定喷嘴总成10的喷嘴口24、杠杆臂26和锚件54。
沉积一个高杨氏模量的介电层138。所述层138通过在低于牺牲层108、112、120和128的硬烘烤温度的温度下沉积约0.2微米氮化硅或者氮化铝形成。
然后，如图8p中所示把层138非均匀地向下等离子蚀刻一0.35微米的深度。此蚀刻旨在从除介电层132和牺牲层134的侧壁以外的整个表面清除介电质。该步骤产生如“别住”(pin)墨的半月形的围绕喷嘴口24的喷嘴框缘36。
施加一个紫外线(UV)分离带(release tape)140。在硅晶片16的后部旋涂上0.4微米阻蚀剂。把晶片16暴露于掩模142以反向蚀刻晶片16以确定墨输入槽48。然后从晶片16剥去阻蚀剂。
把另一个紫外线(UV)分离带(未示)施加到晶片16的后部并且去除带140。用氧等离子剥去牺牲层108、112、120、120、128和134，以提供如图8r和9r中所示的最终的喷嘴总成10。为了便于参照，这两个图中的所示标号与图1中的标号相同以指代喷嘴总成10的相关部分。图11和12示出根据上面参照图8和图9说明的工艺制造的喷嘴总成10的运行，并且这些图与图2至4对应。
本领域内普通技术人员可以看出可以对如特定实施方式中所示的本发明进行改变和/或修改而不偏离宽泛说明的本发明的精神和范畴。因此所有实施方式都是示例性的而不是限制性的。

Claims (4)

1.一种喷墨打印机的打印头，所述喷墨打印头包括：
至少一个打印头芯片，所述至少一个打印头芯片包括：
一个衬片，和
多个置于所述衬片上喷嘴装置，每个喷嘴装置包括：
喷嘴腔壁和一个顶壁，所述喷嘴腔壁和顶壁确定一个喷嘴腔，所述顶壁确定至少一个喷墨口；和
一个喷墨机构，所述喷墨机构工作地相对于喷嘴腔壁定位，以在所述喷墨机构位移时从所述至少一个喷墨口喷墨；和
一个喷嘴防护装置，所述喷嘴防护装置置于每个对应的打印头芯片上，其包括：
一个体部构件，所述体部构件与所述打印头芯片间隔开并且跨所述打印头芯片，所述体部构件确定多个延伸经过所述体部构件的通道，所述体部构件定位为使得每个通道与所述喷墨口之一对准，所述体部构件的厚度和每个通道的截面积使得从喷墨口喷射的墨能够从所述通道中穿过；和
一个支承结构，所述支承结构置于所述体部构件与所述打印头芯片之间，所述支承结构构造为允许空气流入一确定于所述体部构件与所述打印头芯片之间的空间并且经过每个通道，以保持通道没有微粒。
2.如权利要求1所述的打印头，其中，所述衬片是硅晶片衬片形式的。
3.如权利要求2所述的打印头，其中，各喷嘴装置是在硅晶片衬片上进行集成电路制造工艺而得到的产品，使得所述喷嘴装置确定一个微电子机械系统。
4.如权利要求1所述的打印头，其中，所述支承结构由多个置于所述体部构件与所述打印头芯片之间的支撑确定。
CNA028289404A 2002-05-20 2002-08-29 喷墨打印头的喷嘴防护装置 Pending CN1625482A (zh)

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