CN1270899C - 可清除残留物质的喷墨打印头的喷嘴防护装置 - Google Patents

可清除残留物质的喷墨打印头的喷嘴防护装置 Download PDF

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CN1270899C
CN1270899C CNB028201205A CN02820120A CN1270899C CN 1270899 C CN1270899 C CN 1270899C CN B028201205 A CNB028201205 A CN B028201205A CN 02820120 A CN02820120 A CN 02820120A CN 1270899 C CN1270899 C CN 1270899C
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nozzle
nozzle guard
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CN1568261A (zh
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卡·西尔弗布鲁克
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Abstract

一种用于喷墨打印机打印头的喷嘴防护装置(80)，该打印头具有喷嘴(10)的阵列(14)。所述喷嘴防护装置(80)具有单独地对应于所述喷嘴阵列(14)的孔隙(84)的阵列。墨滴通过所述孔隙(84)喷出到达打印介质上。一个刮片(143)清除粘在所述喷嘴防护装置(82)的外表面(142)上的灰尘和残留墨水(144)，其特征在于，所述外表而(142)具有与每一个孔隙(86)单独配对的凹槽(146)，以防止所述刮片(143)挟带的残留物质(144)堵塞在所述孔隙(84)中。

Description

可清除残留物质的喷墨打印头的喷嘴防护装置
技术领域
本发明涉及数字打印机，尤其涉及喷墨打印机。
背景技术
喷墨打印机是一种公知的并且广泛使用的打印介质产品的形式。着色剂，通常是墨水，传送到打印头上微处理器控制的喷嘴阵列。当打印头越过打印介质上方时，着色剂从喷嘴阵列中喷出，以在介质基底上产生打印图像。
打印机的性能取决于诸如运行成本、打印质量、运行速度和易于操作之类的因素。总体上，从喷嘴喷出的单独墨滴的频率和速度会影响这些性能参数。
近来，人们采用微机电系统(MEMS)技术制成具有亚微米厚度机械结构的喷嘴阵列。这就使得能够制造出可以快速地喷射大小在微微升(×10-12升)级的墨滴的打印头。
尽管这些打印头的微观结构可以以相对低廉的成本提供高速度和良好的打印质量，但是其尺寸使得喷嘴极为脆弱，会由于手指、灰尘或者介质基底的最轻微的接触而被损坏。这使得这种打印头在多数要求打印头有一定坚固性的实际应用中变得不实用。而且，损坏了的喷嘴可能不能喷出传送给它的着色剂。着色剂累积起来并且在喷嘴的外部形成墨珠，可能会影响到周围喷嘴的喷射着色剂和/或损坏的喷嘴会直接地向介质基
底上渗漏着色剂。这两种情况都不利于打印质量。
针对于此，可在所述喷嘴上安装一个孔隙防护装置，以保护它们免受损坏性接触。从喷嘴中喷出的墨水穿过所述孔隙喷到打印纸上或其它打印基底上。但是，为了有效地保护喷嘴，所述孔隙需要尽可能的小，以在使得墨滴可以通过的同时，最大化地限制外界颗粒的入侵。理想的情况是，每一个喷嘴都将通过它们本身的防护装置中的孔隙喷射墨水。
通常，防护装置中的孔隙极小，所以它们容易堵塞。所以，常常期望保持喷嘴防护装置的外表面清洁，尤其是在具有相对高级别的灰尘或其它空气悬浮粒子的环境中。定期地利用一个刮片清除防护装置的外表面，从而移走灰尘或墨水残留物质，这是一个实现上述期望的便利的方法。但是，所述刮片上的残留物质通常会聚集在外缘上，尤其是面对刮片行进方向的边缘的部分上。残留物质的聚集不太易于通过刮片清除，并且将很快堵塞所述孔隙。
发明内容
因此，本发明提供一种用于喷墨打印机打印头的带孔隙的喷嘴防护装置，该打印头包括用于将着色剂喷射到打印基底上的喷嘴阵列；其中，
所述喷嘴防护装置适合定位在所述打印头上，这样该喷嘴防护装置遍布所述喷嘴的外部，以防止对所述喷嘴的损坏性接触，同时使得从所述喷嘴中喷出的着色剂穿过所述孔隙并到达打印基底上；所述喷嘴防护装置包括：
一个外表面，该外表面在工作中面对所述打印基底；
所述外表面的构造可与一个刮片相接合，该刮片定期地对所述表面进行清理以除去残留物质；其中，
所述外表面具有与每一个孔隙单独配对的凹槽，以防止所述刮片与直接邻接所述孔隙的外表面相接合。
在本说明书中，术语“喷嘴”可理解为界定有一个开口的元件，而不是开口本身。
优选地，所述外表面在每一个凹槽中还包括一个导向脊，在所述刮片越过与所述凹槽配对的孔隙之前，所述导向脊的设置可与所述刮片相接合。在一个便于实施的形式中，所述导向脊是弓形的，并且相对于所述刮片的行进方向定位，以引导残留物质远离所述孔隙并到达所述凹槽的边缘处。
所述喷嘴防护装置还可包括流体入口，用于引导流体流经所述喷嘴阵列并通过所述孔隙将流体引出，以防止杂质颗粒在所述喷嘴阵列上的聚集。
所述喷嘴防护装置可包括一对整体成形的并相互隔开的支承元件，所述一对支承元件中的一个设置在所述喷嘴防护装置的每一端上。
在该实施例中，所述流体入口可设置在一个所述的支承元件上。
可以理解的是，当空气从所述开口经所述喷嘴阵列的上方并从所述通道导出时，就阻止了杂质颗粒聚集在所述的喷嘴阵列上。
所述流体入口可设置在远离所述喷嘴阵列的连接垫的支承元件中。
为了最优化所述刮片的有效性，所述外表面除了所述凹槽和所述导向脊之外呈平面。通过用硅制成防护装置，其热膨胀系数基本上与所述喷嘴阵列的热膨胀系数相匹配。这将有助于防止所述防护装置中孔隙的阵列与所述喷嘴阵列不相对齐。使用硅还使得护板可以用MEMS技术精确地微加工。而且，硅非常坚固并且基本上是不可变形的。
附图说明
参考附图，现在仅通过实例，结合附图对本发明的优选实施例进行描述，其中：
图1所示为喷墨打印头的喷嘴组件的立体示意图；
图2-图4所示为图1中的喷嘴组件进行操作的立体示意图；
图5所示为喷嘴阵列的立体图；
图6所示为图5中所述阵列的局部放大视图；
图7所示为含有喷嘴防护装置的喷墨打印头的立体图；
图7a所示为图7中的喷墨打印头和通过刮片进行清洁的喷嘴防护装置局部剖面图；
图7b所示为本发明喷嘴防护装置的局部剖面图；
图7c所示为图7b中的喷嘴防护装置的外表面的平面图；
图8a-图8r所示为喷墨打印头的喷嘴组件制造步骤的立体图；
图9a-图9r所示为所述制造步骤的侧剖视图；
图10a-图10k所示为在制造过程中用于不同的步骤中的掩模设计图；
图11a-图11c所示为对按照图8和图9中的方法制造的喷嘴组件进行操作的立体图；和
图12a-图12c所示为对按照图8和图9中的方法制造的喷嘴组件进行操作的侧剖图。
具体实施方式
首先参阅图1，本发明的喷嘴组件一般用标号10标示出。一个喷墨打印头具有若干个在阵列14(如图5和6所示)中排列在硅基片16上的喷嘴组件10。阵列14将在下文较详细地予以说明。
喷嘴组件10包括一个硅基片16，介电层18沉积在其上。一个CMOS钝化层20沉积在介电层18上。
每个喷嘴组件10包括一个界定有喷嘴开口24、呈杆臂26形式的连接构件和致动器28的喷嘴22。通过杆臂26把致动器28与喷嘴22连接。
如在图2至图4中较详细地示出，喷嘴22包含一个冠部30，所述的冠部带有一个从冠部30下垂的裙边部分32。裙边部分32形成喷嘴室34的周壁的一部分。喷嘴开口24与喷嘴室34的液体相通。请注意喷嘴开口24由隆起的缘36包围，所述隆起的缘36用来“插入”喷嘴室34中墨水主体40的弯液面38(图2)。
一个进墨孔42(在图6中表示得最清楚)界定在喷嘴室34的底板46中。所述孔隙42中的液体与由基片16界定的一个进墨通道48的液体相通。
一个壁部50限定孔隙42并且从底板46向上伸展。如上所述，喷嘴22的裙边部分32界定喷嘴室34的周壁的第一部分，而所述壁部50界定喷嘴室34的周壁的第二部分。
壁部50的自由端具有一个向内指的唇边52，用作一个液体封闭装置，以防止在喷嘴22移动时墨水的溢出，这将在下文中详述。可以注意到，由于墨水40的粘度和唇边52与裙边部分32之间间隔的尺寸很小，向内指的唇边52和表面张力起到了有效地防止墨水从喷嘴室34中溢出的密封作用。
致动器28是一种热弯曲致动器，并连接在从基片16向上伸展的，或者更具体地从CMOS钝化层20向上伸展的簧片54上。簧片54安装在导电垫56上，该导电垫与致动器28形成一种电性连接。
致动器28包括一个设置在一个第二无源梁60上的一个第一有源梁58。在一个优选的实施例中，两个梁58和60是，或者包括诸如氮化钛(TiN)的导电陶瓷材料。
两个梁58和60都具有一个固附在簧片54上的第一端，并且它们的相对端与杆臂26相连。当电流产生流过有源梁58时，导致梁58热膨胀。由于无源梁60中没有电流流过，所以它不以相同的速率膨胀，这样就产生一个弯矩使得杆臂26连同喷嘴22向着基片16的方向向下推移，如图3中所示。这引起墨水通过喷嘴开口24喷出，如在62处所示。当从有源梁58移走热源，即断掉电流时，喷嘴22返回到其静止位置，如图4所示。当喷嘴22返回其静止位置时，如图4中66处所示，由于墨滴颈缩处出现了断裂，所以形成了墨滴64。墨滴64然后传送到诸如纸张的打印介质上。由于墨滴64的形成，形成了一个“凹形”弯液面，如图4中的68处所示。该“凹形”弯液面68引起墨水40流进喷嘴室34中，从而形成一个新的弯液面38(如图2所示)为从喷嘴组件10喷出下一个墨滴作好准备。
现在结合图5和图6详细地说明喷嘴阵列14。所述的阵列14用于四色打印头。因此，阵列14包括四个各用于一个颜色的喷嘴组件组70。每个组70都具有排列成两行72和74的喷嘴组件10。组70之一较详细地示于图6之中。
为了有利于密排行72和74中的喷嘴组件10，把行74中的喷嘴组件10相对于行72中的喷嘴组件10偏移排列，或者交错排列。而且，行72中的喷嘴组件10彼此充分地间隔开，以使行74中的喷嘴组件10的杆臂26能够在行72中的组件10的相邻喷嘴22之间通过。请注意每个喷嘴组件10基本上都做成哑铃形以便使行72中的喷嘴22嵌套在行74中的相邻喷嘴组件10的喷嘴22和致动器28之间。
而且，为了有利于密排行72和74的喷嘴22，每个喷嘴22基本上都呈六角形。
本领域中的技术人员可以理解的是，当喷嘴22在工作中朝着基片16移动时，由于喷嘴开口24相对于喷嘴室34存在一个微小的角度，所以墨水稍微偏离垂直进行喷射。图5和图6中所示的排列的优点在于行72和74中的喷嘴组件10的致动器28沿相同的方向伸向行72和74的一侧。因此从行72中的喷嘴22喷出的墨水和从行74中的喷嘴22喷出的墨水以相同的角度彼此偏置，结果提高了打印的质量。
还有，如图5所示，基片16具有安装在其上的连接垫76，所述的连接垫76通过导电垫56电性连接到喷嘴组件10的致动器28上。这些电性连接经CMOS层(未图示)形成。
图7所示为一个喷嘴阵列和一个喷嘴防护装置。对于以上各图，除非另有说明，相同的标号指示相同的部件。
一个喷嘴防护装置80安装在阵列14的硅基片16上。喷嘴防护装置80包括一个护板82，所述护板82具有若干个通过它界定的孔隙84。孔隙84与阵列14的喷嘴组件10的喷嘴开口24对齐，以便于当墨水从喷嘴开口24中任何一个喷射出时，墨水可在喷到打印介质上之前穿过相关的通道。
在具有相对高级别的灰尘或其它空气悬浮粒子的环境中，孔隙84将会堵塞。而且，喷嘴防护装置80的外表面会聚集从损坏的喷嘴中漏出的墨水。如图7a所示，使用一个刮片143以定期地将残留物质144从外表面142上清除是有利的。不幸的是，在刮片143上的残留物质144常常会堵塞孔隙84的外缘，尤其是面对刮片的行进方向145的边缘的部分。这样聚集起来的残留物质144不太易于通过刮片143清除，并且很快就会堵塞孔隙84。
如图7b所示，本发明在环绕着每一个孔隙84的外表面142中提供了凹槽。现在刮片143可以越过孔隙84，所以收集的残留物质144不会聚集在外缘里了。作为进一步的保护措施，每一个凹槽146都具有一个导向脊147。如图7c所示，导向脊147在刮片143越过孔隙84之前直接与该刮片143接合。导向脊147将刮片143上的一些残留物质144清除，以进一步降低残留物质144落入孔隙84中的可能性。导向脊147呈弓形，其表面朝着刮片143的行进方向145，以引导聚集的残留物质144远离孔隙84，而到达凹槽146的边缘处。
防护装置80是硅制的，从而它具有足够的强度和刚性来保护喷嘴阵列14，防止由于纸张、灰尘或者使用者的手指接触而被损坏。通过用硅制成防护装置，其热膨胀系数基本上与喷嘴阵列的热膨胀系统匹配。这旨在防止当打印头的温度升高到其正常工作温度时，护板82中的孔隙84与喷嘴阵列14不相对齐。硅还适于使用MEMS技术进行准确的微加工，所述的MEMS技术将在下面关于喷嘴组件10的制造中详细论述。
护板82通过臂或者支柱86相对于喷嘴组件10隔开安装。支柱86之一具有界定于其中的空气入口88。
在打印机工作时，阵列14动作，空气经过入口88进入，被迫与流经孔隙84的墨水一起经过孔隙84。
当空气以一个与墨滴64不同的速度冲过孔隙84时，墨水不被带入到空气中。例如，墨滴64以大约3m/s的速度从喷嘴22喷射出。空气以大约1m/s的速度经孔隙84进入。
空气的用途是保持孔隙84摆脱外来颗粒。如上所述，存在有这些外来颗粒，譬如灰尘颗粒，会落在喷嘴组件10上对其运作带来不利影响的危险。通过在喷嘴防护装置80中提供空气入口88，可以避免这个问题。
下面参阅图8至图10，描述喷嘴组件10的制造方法。
以硅基片或者晶片16开始，在晶片16的表面上沉积介电层18。所述介电层18是大约1.5微米的CVD氧化物的形式。在层18上旋涂抗蚀剂并且把层18暴露向掩模100并且接着显影。
在显影后，把层18等离子蚀刻到硅层16上。然后剥去抗蚀层并且清洁层18。该步骤界定进墨孔隙42。
在图8b中，大约0.8微米的铝102沉积在层18上。旋涂抗蚀剂，并把铝102暴露向掩模104，并且显影。把铝102等离子蚀刻到氧化层18，剥去抗蚀层并且清洁所述装置。该步骤提供连接垫和对喷墨致动器28的互相连接线。该互相连接线通到NMOS驱动晶体管和在CMOS层(未图示)中带有连接线的电源板。
沉积大约0.5微米的氮化PECVD作为CMOS钝化层20。旋涂抗蚀剂，并且把层20暴露向掩模106，此后在该掩模处显影。在显影后，把氮化物等离子蚀刻到铝层102和入口孔隙42的区域中的硅层16。剥去抗蚀层并且清洁所述装置。
在层20上旋涂牺牲层108。层108是6微米的光敏聚酰亚胺或者约4微米的高温抗蚀剂。把层108软烘烤然后暴露向掩模110，此后显影。然后，当层108由聚酰亚胺构成的情况下，把层108在400℃硬烘烤一个小时，或者当层108是高温抗蚀剂的情况下，在300℃以上硬烘烤。应当注意在附图中设计掩模110时要考虑由于皱缩引起的聚酰亚胺层108的图案相关性畸变。
在图8e所示的下一个步骤中，施加一个第二牺牲层112。层112或为旋涂的2微米的光敏聚酰亚胺，或为约1.3微米的高温抗蚀剂。把层112软烘烤然后暴露向掩模114。在对掩模114曝光后，层112显影。在层112是聚酰亚胺的情况下，在400℃把层112硬烘烤约一个小时。在层112是抗蚀剂的情况下，在300℃以上温度硬烘烤约一个小时。
然后沉积0.2微米的复层金属层116。该层116的部分形成致动器28的无源梁60。
通过在300℃左右的温度喷溅1,000埃氮化钛(TiN)接着再喷溅50埃氮化钽(TaN)形成层116。再喷溅1,000埃氮化钛(TiN)接着再喷溅50埃氮化钽(TaN)和1,000埃氮化钛(TiN)。可以用于代替TiN的其它材料是TiB2、MoSi2或者(Ti，A1)N。
然后把层116暴露向掩模118，显影并且等离子蚀刻到层112，其后把施加在层116上的抗蚀层湿剥离，小心不要去掉固化了的层108或112。
通过旋涂4微米的光敏聚酰亚胺或者大约2.6微米的高温抗蚀剂施加一个第三牺牲层120。把层120软烘烤然后向掩模122暴露。把暴露的层进行显影，接着硬烘烤。在聚酰亚胺的情况下，在400℃将层120硬烘烤约一个小时，或者在层120由是抗蚀剂构成的情况下在300℃以上温度硬烘烤。
在层120上施加一个第二复层金属层124。层124的构成与层116相同并且以相同的方法施加。应当理解层116和层124都是导电层。
把层124暴露向掩模126，然后显影。把层124等离子蚀刻到聚酰亚胺或抗蚀层120，其后把施加在层124上的抗蚀层湿剥离，小心不要去掉固化了的层108、112或120。会注意到层124的余留部分界定致动器28的有源梁58。
通过旋涂4微米的光敏聚酰亚胺或者大约2.6微米的高温抗蚀剂施加一个第四牺牲层128。把层128软烘烤，向掩模130暴露，然后进行显影，留下如图9k所示的岛状部分。层128的余留部分为聚酰亚胺的情况下，在400℃硬烘烤约一个小时，或者在抗蚀剂的情况下，在300℃以上温度硬烘烤。
如图81所示沉积一个高杨氏模数的介电层132。层132是由约1微米的氮化硅或者氧化铝构成的。层132是在牺牲层108、112、120、128的硬烘烤温度以下的温度沉积的。对该介电层132的主要特性要求是高的弹性模数、化学惰性和对TiN的良好贴附性。
通过旋涂2微米的光敏聚酰亚胺或者大约1.3微米的高温抗蚀剂施加一个第五牺牲层134。把层134软烘烤，向掩模136暴露，然后进行显影。层134的余留部分在聚酰亚胺的情况下，在400℃硬烘烤一个小时，或者在抗蚀剂的情况下，在300℃以上温度硬烘烤。
把介电层132等离子蚀刻到牺牲层128，小心不要去掉任何牺牲层134。
该步骤界定喷嘴组件10的喷嘴开口24，杆臂26和簧片54。
沉积一个高杨氏模数的介电层138。层138通过在牺牲层108、112、120和128的硬烘烤温度以下的温度沉积0.2微米的氮化硅或者氮化铝形成。
然后如图8p所示，把层138用异向性等离子蚀刻到0.35微米的深度。该蚀刻旨在从除了介电层132和牺牲层134的侧壁以外的所有表面清除介电层。该步骤产生绕喷嘴开口24的喷嘴缘36，所述的喷嘴缘36“插入”墨水的弯液面中，正如前所述。
施加紫外线(UV)释放带140。在硅晶片16的后部旋涂4微米的抗蚀剂。把晶片160向掩模142暴露以烘烤蚀刻晶片16用来界定进墨通道48。然后把该抗蚀剂从晶片16上剥落。
在晶片16的后部施加另一个紫外线(UV)释放带(未图示)，然后去掉释放带140。在氧等离子体中剥落牺牲层108、112、120、128和134以提供如图8r和9r所示的成品喷嘴组件10。为了便于参考，在这两个图中所示的标示喷嘴组件10的相关部分的标号与图1中相同。图11和图12所示为按照图8和图9中所述的工艺制造喷嘴组件的过程，附图标记对应于图2至图4中的附图标记。
本领域内的普通技术人员会理解可以对特定实施例所示的本发明做出各种变例和/或修改，而不偏离泛泛说明的本发明的精神和范围。因此所述实施例可以认为在所有方面都是阐述性的而不是限制性的。

Claims (9)

1.一种用于喷墨打印机打印头的带孔隙的喷嘴防护装置，所述打印头包括用于将着色剂喷射到打印基底上的喷嘴阵列，其特征在于，
所述喷嘴防护装置适当地定位在所述打印头上，这样所述喷嘴防护装置遍布所述喷嘴的外部，以阻止对所述喷嘴的损坏性接触，同时使得从所述喷嘴中喷出的着色剂穿过所述孔隙并到达打印基底上；所述喷嘴防护装置包括：
一个外表面，所述外表面在工作中面对所述打印基底；
所述外表面的构造可与一个刮片相接合，所述刮片定期地对所述表面进行清理以除去残留物质；其中，
所述外表面具有与每一个所述孔隙单独配对的凹槽，以防止所述刮片挟带的残留物质堵塞在所述孔隙中。
2.如权利要求1所述的喷嘴防护装置，其特征在于，所述外表面在每一个凹槽中还包括一个导向脊，在所述刮片越过与所述凹槽配对的孔隙之前，所述导向脊的设置可与所述刮片相接合。
3.如权利要求2所述的喷嘴防护装置，其特征在于，所述导向脊是弓形的，并且相对于所述刮片的行进方向定位，以引导残留物质远离所述孔隙并到达所述凹槽的边缘处。
4.如权利要求1所述的喷嘴防护装置，其特征在于，所述喷嘴防护装置还包括流体入口，用于引导流体流经所述喷嘴阵列，并通过所述孔隙将流体引出，以防止杂质颗粒聚集在所述喷嘴阵列上。
5.如权利要求4所述的喷嘴防护装置，其特征在于，所述喷嘴防护装置还包括一对整体成形的并相互隔开的支承元件，所述一对支承元件中的一个设置在所述喷嘴防护装置的每一端上。
6.如权利要求5所述的喷嘴防护装置，其特征在于，所述流体入口设置在一个所述的支承元件上。
7.如权利要求6所述的喷嘴防护装置，其特征在于，所述流体入口设置在远离所述喷嘴阵列的连接垫的支承元件中。
8.如权利要求2所述的喷嘴防护装置，其特征在于，所述外表面除了所述凹槽和所述导向脊之外呈平面。
9.如权利要求1所述的喷嘴防护装置，其特征在于，所述防护装置由硅制成。
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KR100539498B1 (ko) 2005-12-28
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US20050243123A1 (en) 2005-11-03
WO2003018318A1 (en) 2003-03-06
US6953236B2 (en) 2005-10-11
JP4154331B2 (ja) 2008-09-24
EP1432586A4 (en) 2006-01-18
US20070064044A1 (en) 2007-03-22
AU2002356076B2 (en) 2005-11-10
US20020021322A1 (en) 2002-02-21
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US7556344B2 (en) 2009-07-07
US7152943B2 (en) 2006-12-26
JP2005500193A (ja) 2005-01-06
IL160634A (en) 2006-06-11
EP1432586A1 (en) 2004-06-30
ATE339317T1 (de) 2006-10-15
CA2458602A1 (en) 2003-03-06
US20090237447A1 (en) 2009-09-24
DE60214742D1 (de) 2006-10-26
IL160634A0 (en) 2004-07-25
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CN1568261A (zh) 2005-01-19
US20050073549A1 (en) 2005-04-07

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