CN1491163A - 淹没喷嘴检测 - Google Patents
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Abstract
用于喷墨打印机的喷嘴防护装置(80)具有一个喷嘴(22)阵列(14),以及各自的喷射装置用于向待被打印的介质喷射墨水。该喷嘴防护装置(80)具有墨水密封结构(146),用于阻止任何自损坏的喷嘴方向错误的墨滴或墨水的泄露干扰周围喷嘴的操作或落到该介质上。为了维持打印品质并且停止向损坏的喷嘴供应墨水,每个密封结构(146)具有一个墨水传感器。当存在了预定数量的墨水时该密封结构内的一个或者几个喷嘴(22)将被停掉。
Description
技术领域
本发明涉及打印介质产品,且特别地涉及喷墨打印机。
背景技术
喷墨打印机是众所周知并且广泛使用的打印介质产品的形式。墨水被供应到一个打印头上的微处理机控制的喷嘴阵列。在该打印头经过该介质时,墨水被从该喷嘴阵列喷射以在该介质上产生一幅图像。
打印机品质取决于下列因素例如操作成本,打印品质,操作速度以及易于使用。从该喷嘴喷射的单个墨滴的质量,频率和速度将会影响这些品质参数。
最近,该喷嘴阵列已经采用微电子机械系统(MEMS)技术而形成,它具有亚微米厚度的机械结构。这样就允许生产能够快速地喷射尺寸在皮升(10-12升)范围内的墨滴的打印头。
尽管这些打印头的微观结构能够以相对低的成本提供高速度以及好的打印品质,它们的尺寸使该喷嘴非常脆弱并且极易被与手指,灰尘或者该该介质基片的接触所损坏。这使该打印头对于很多必须具有一定稳健性的应用来说变得不切实际。另外,一个损坏的喷嘴可能错误地引导该喷射的墨滴的方向或者根本不能喷射墨水。如果该喷嘴不能喷射该墨水,将开始形成墨水珠并且影响周围的喷嘴。它迟早可能会将墨水泄露到该打印的基片上。
不管是喷射墨水的方向被误导或者在该打印头的表面形成墨珠,这两种情况对于打印品质都是有害的。为了应付这些情况,可以给该打印头提供覆盖在该喷嘴外面的有孔的防护装置,以避免与手指,灰尘,或者该介质接触所造成的损坏。然而该防护装置也可以用于保留方向被误导的墨滴或者从损坏的喷嘴泄露的任何墨水。通过局部化任何墨水泄露,可以限制受到影响的喷嘴的数量。该防护装置也可以防止误导的墨水滴到达该介质。
不幸的是,该打印品质仍然受到损失,因为它不再包括从该损坏的喷嘴来的墨水。另外,当该密封结构中充满了墨水以后,它仍然能够在该防护装置的外部形成墨珠,因而阻塞该环绕的孔和/或泄露到该介质上。
发明内容
因此,本发明提供了一种用于喷墨打印机的打印头,该打印头包括:
一个基片,设有用于向待被打印的介质上喷射墨水的喷嘴阵列;
一个有孔的防护装置,其被定位为覆盖至少一个喷嘴,以使该喷射的墨水通过一个孔喷射该介质上;
该防护装置和该喷嘴至少部分限定了一个密封结构,该结构用于将从该喷嘴泄露或者方向误导的墨水与该阵列中的至少一部分其他喷嘴隔离开来;以及
用于检测该密封结构中预定数量的墨水并且停止向该喷嘴继续供应墨水的装置。
在本说明书中,该词“喷嘴”应被理解为确定该开口的一个元件而不是该开口自身。
优选地,该阵列中的每个喷嘴有一个单独的密封结构,用于将它从所有该阵列中的其他喷嘴隔离开,并且每个该密封结构具有一个上述的检测装置。然而,本发明的某些形式可能有配置的密封结构,用于将预先定义的喷嘴组从该阵列中的其他喷嘴隔离开;其中
与每个密封结构联系的检测装置被配置为在检测到该密封结构中的墨水数量达到了预定的程度时停止向该预定组继续供应墨水。
在一种形式中,每个喷嘴使用一个弯曲的执行机构,该执行机构附着到用于喷射墨水的叶片上,其中该检测装置使该弯曲的执行机构丧失能力,以停止继续向该喷嘴供应墨水。
在一种优选的实施方式中,该检测装置具有定位于该密封结构中的一对电触点,以便使预定数量墨水的累积使电路闭合,从而使得比较仪使该执行机构停止工作。
在一些实施方式中,该密封结构还包括密封壁,该密封壁从该防护装置延伸至每个喷嘴的外部。在另一个优选的实施方式中,该喷嘴防护装置是由硅形成的。
在一个特殊的优选形式中,该检测装置为容错设备提供了反馈以调节该阵列的其他喷嘴的操作,作为对损坏的喷嘴的补偿。
根据本发明的一个喷墨打印机打印头,不仅隔离了任何墨水的泄露,以使其被包容在一个单个喷嘴或者喷嘴组中,而且检测墨水的累积,并停止向该喷嘴或喷嘴组供应墨水。这样就防止了不进行检查就向损坏的喷嘴供应墨水。
该密封壁必须占据该打印头的表面区域的一部分,并且这样会对该喷嘴聚集密度产生不良影响。所需要的该额外的打印头芯片区域会给制造该芯片增加20%的成本。然而,在喷嘴制造不可靠的时候,尽管有一个相对高的喷嘴故障率本发明将保持打印品质。
该喷嘴防护装置还包括流体进口,用于引导流体通过该孔,以阻止异物颗粒在该喷嘴阵列上的堆积。
该流体进口可以定位于距离该喷嘴的接合垫较远的地方。
通过为该打印头提供一个喷嘴防护装置,该喷嘴结构可以被保护从而不与大多数其他的表面发生接触或者碰撞。为了使提供的保护达到最佳,该防护装置形成了一个平坦的护罩覆盖了该喷嘴的外侧并且具有一个足够大的孔的阵列以允许墨滴的喷射,但是又足够小以防止无意的接触或者大多数灰尘颗粒的进入。通过使用硅来形成该护罩,它的热膨胀系数基本上与该喷嘴阵列相匹配。这将有助于在该打印头加热到其操作温度时,防止该护罩内的孔阵列失去与该喷嘴阵列的精确对位。使用硅也允许该护罩使用微电子机械系统(MEMS)技术实现微型机械化。另外,硅的强度很高并且基本上不可变形。
附图说明
现在将结合例子并且参照附图对本发明优选的实施方式进行描述:
图1是用于喷墨打印头的一个喷嘴组件的示意性的三维视图;
图2到图4是图1的该喷嘴组件操作的示意性的三维视图;
图5是组成具有喷嘴防护装置或者密封壁的喷墨打印头的喷嘴阵列的三维视图;
图5a是本发明的具有一个喷嘴防护装置以及密封壁的打印头的部分剖视图;
图5b是该墨水检测器的电路图;
图6是图5的该阵列一部分的放大的视图;
图7是一个包括喷嘴防护装置而不包括该密封壁的喷墨打印头的三维视图;
图8a到图8r说明了制造喷墨打印头的喷嘴组件的步骤的三维视图;
图9a到图9r是该制造步骤的侧面剖视图;
图10a到图10k说明了用于该制造过程的各个步骤中的掩膜的设计;
图11a到图11c是根据图8和图9的方法制造的该喷嘴组件的操作的三维视图;以及
图12a到图12c是根据图8和图9的方法制造的该喷嘴组件的操作的剖面侧视图。
具体实施方式
首先参见附图1,根据本发明的喷嘴组件通常由参考数字10来表示。一个喷墨打印头具有多个喷嘴组件10,在硅基片16上以阵列14排列(图5和图6)。该阵列14将在下面详细地描述。
该组件10包括一个硅基片16,在其上面沉积了一个介电层18。在该介电层18上面沉积了一个CMOS钝化层20。
每个喷嘴组件10包括限定一个喷嘴开口24的喷嘴22,一个杠杆臂26形式的连接件以及一个执行机构28。该杠杆臂26将该执行机构28连接到该喷嘴22。
如图2到4中的详细图示,该喷嘴22包括一个冠顶部分30以及从该冠顶部分30下垂的裙形部分32。该环绕部分32形成了一个喷嘴腔34的部分外壁。在该喷嘴开口24与该喷嘴腔34之间液体可以自由流通。需要注意的是该喷嘴开口24被凸起的边框36所围绕,它“固定”了在该喷嘴腔34中的墨40主体的一个弯月面38(图2)。
一个墨入口孔42(在附图的图6中最清楚)被确定在该喷嘴腔34的基片46上。在该孔42与由该基片16确定的一个墨入口通道48之间液体可以自由流通。
一个壁体部分50围绕孔42,并且从基片部分46向上方延伸。如上面所指示的该喷嘴22的该环绕部分32,确定了该喷嘴腔34的外壁的第一部分,并且该壁体部分50确定了该喷嘴腔34的外壁的第二部分。
该壁50在其自由端具有一个方向向内的边缘52,它在该喷嘴22被移动时用作一个流体密封,以阻止墨水的泄露,这一点在以下内容将给予详细的描述。值得重视的是,由于该墨水40的粘性以及在该边缘52和该环绕部分32之间的间隔尺寸很小,该向内的边缘52以及表面张力起到阻止墨水从该喷嘴腔34流失的有效密封的作用。
该执行机构28是一个受热弯曲的执行机构,并且被连接到从该基片16或者更具体地从该CMOS钝化层20向上延伸的一个固定器54。该固定器54被安装在与该执行机构28形成电连接的导电垫56上。
该执行机构28包括第一有源梁58,安置在第二无源梁60的上方。在一种优选的实施方式中,梁58和60都是采用或者包括,一种导电材料例如钛氧化物(TiN)。
梁58和60两者都把其第一末端固定到该固定器54并且其相反的一端连接到臂26。当使流体流经该有源梁58,会导致该梁58的热膨胀。对于该无源梁60,没有流体流过,不以同样的速率膨胀,就产生了一个弯矩导致该臂26并且因此该喷嘴22向下向该基片16移动,如图3中所示。这将导致通过62所示的该喷嘴开口喷射墨水。当热源从该有源梁58处移开时,即通过停止流体的流动,该喷嘴22返回到如图4中所示的其静止位置。当该喷嘴22返回到其静止位置时,如图4中66处所示的墨滴颈部断开导致小墨滴64的形成。该小墨滴64然后移动到该打印媒介例如是一页纸上。作为形成小墨滴64的结果,一个“负向”弯月面形成于图4中所示的68处。此“负向”弯月面68导致了墨水40向内流动并流入到该喷嘴腔34中,这样就事先形成了一个新的弯月面38(图2),以便于从该喷嘴组件10的下次墨滴的喷射。
参见图5和图6,对该喷嘴阵列14给予更详细的描述。将阵列14用于一个四色打印头。因此,该阵列14包括四组70的喷嘴组件,每组用于一种颜色。每组70具有以两行72和74排列的喷嘴组件10。图6中给出了一个组70的更多细节。
为了在该行72和74中实现紧凑的该喷嘴组件10的安装,将行74中的喷嘴组件10相对于行72中的喷嘴组件10偏置或交错设置。另外,将该行72中的该喷嘴组件10互相以充分远的距离而间隔设置,以使行74中的喷嘴组件10的杠杆臂26能够在行72的组件10的相邻喷嘴22之间通过。需要注意的是,每个喷嘴组件10基本上是哑铃形的,以使该行72中的该喷嘴22可以嵌套在该喷嘴22和该行74中的相邻的喷嘴组件10的该执行机构28之间。
另外,要使该行72和74中的该喷嘴22安装紧凑,每个喷嘴22基本上是六边形的。
所属领域普通技术人员将会理解:当该喷嘴22向该基片16移动时,在使用中,由于该喷嘴开口24相对于该喷嘴腔34具有一个很小的角度,墨水的喷射会略微地偏离直角。图5和图6中所示的配置的一个优点是该行72和74中的该喷嘴组件10的执行机构28以与该行72和74的一侧同样的方向延伸。因此,从该行72中的该喷嘴22喷射的墨水以及从该行74中的该喷嘴22喷射的墨水互相以相同的角度偏移,这样就提高了打印的品质。
另外,如图5中所示,该基片16具有在其上配置的提供电连接的接合垫76,通过该垫76连接到该喷嘴组件10的该执行机构28。这些电连接是通过该CMOS层(没有示出)而形成的。
参见图5a和5b,将如图5中所示的喷嘴阵列14间隔设置以容纳环绕每个喷嘴组件10的密封结构146。该密封结构146包括一个环绕该喷嘴22且从该硅基片16延伸到一个有孔的喷嘴防护装置80的下侧的密封壁144。若由于喷嘴的损坏使墨水喷射不正常,则该裂缝受到限制以避免影响周围喷嘴的功能。具体参考图5b,每个密封结构146将具有检测是否存在泄露墨水的能力。检测电极位于该密封结构146内以便泄露或方向错误的墨水的累积闭合该电路。这触发喷嘴故障电路使其停止进一步激励该喷嘴阵列14。通过使用容错功能,可通过向该阵列14中的其他喷嘴重新分配待打印的数据来补偿该损坏的喷嘴22。。
该容器壁144必需占据该硅基片16的一部分,这样就降低了该阵列的喷嘴的组装密度。反之这也增加了该打印头芯片的生产成本。然而,在制造技术导致了相对较高的喷嘴磨损速率时,单个的喷嘴密封结构将避免,或者至少最小化对该打印品质的不良影响。
所属领域普通技术人员将可以理解,也可以设置该密封结构来隔离喷嘴组。隔离的喷嘴组提供了更好的喷嘴组装密度但是使用周围的喷嘴组对损坏的喷嘴进行补偿变得更加困难。
参见图7,示出了不包括密封壁的喷嘴阵列和喷嘴防护装置。参见先前的附图,除非另外指定,同样的参考数字指示同样的部分。
将一个喷嘴防护装置80安装在该阵列14的该硅基片16上。该喷嘴防护装置80包括一个罩82,其中限定多个孔84。孔84与阵列14的喷嘴组件10的喷嘴开口24精确对位,以使当墨水从喷嘴开口24的任何一个喷出时,该墨水在到达该打印介质之前通过相联系的通道。
该防护装置80用硅来制作以使其具有必要的强度和刚性,以保护该喷嘴阵列14不会因与纸,灰尘或者用户的手指接触而发生损坏。通过用硅来形成该防护装置,其热膨胀系数基本上与该喷嘴阵列匹配。这样做的目的是为了在打印头被加热至其正常的工作温度范围内时,罩82中的孔84不会失去与该喷嘴阵列14的精确对位。硅也同样很适合于精确的微型机械化,使用下面详细讨论的与该喷嘴组件10的制造有关的MEMS技术。
该罩82的安装通过分支或支柱86相对于该喷嘴组件10形成间隔的关系。一个支柱86具有其中确定的进气口88。
在使用中,当该阵列14在操作时,空气通过该进气口88被注入,并在力的作用下与墨水一起通过该孔84。
该墨水并不夹带在该空气中,因为该空气通过该孔84的注入是以与该小墨滴64不同的速率进行的。例如,该小墨滴64从该喷嘴22以大约3m/s的速率喷出。该空气通过该孔84的注入速率大约为1m/s。
该空气的用途是保持该孔84没有异物颗粒。存在的一个危险是这些异物颗粒,例如灰尘颗粒,能够落到该喷嘴组件10上,对其操作产生不良的影响。通过在喷嘴防护装置80中设置进气口88,在很大程度上排除了此问题。参见图8到图10,描述了喷嘴组件10的制作过程。
从该硅基片或晶片16开始,该介电层18被沉积到该晶片16的表面。该介电层18是采用大约1.5微米的化学汽相沉积(CVD)氧化物的形式制作的。在层18上旋压(spin)抗蚀层并且将层18对掩膜100曝光并且随后显影。
在显影后,将层18等离子蚀刻到该硅层16下。该抗蚀层被剥掉并且清洗层18。此步骤形成了墨水入口孔42。
在图8b中,在该层18上沉积了大约0.8微米的铝102。将抗蚀层旋压到层18上并且使铝102对掩膜104曝光并且随后显影。在显影以后,将铝102等离子蚀刻到该氧化层18下面,将该抗蚀层剥掉并且对该设备进行清洗。此步骤形成该接合垫并且与该喷墨执行机构28互连。此互连至一个NMOS驱动晶体管和一个具有连接的在该CMOS层(没有示出)中制作的电源层。
沉积约0.5微米的PECVD氮化物作为CMOS钝化层20。将抗蚀层旋压在层20并将其对掩膜106曝光然后被显影。在显影之后,将该氮化物等离子蚀刻到该铝层102之下以及该入口孔42的区域中的硅层16。将该防护层被剥并且对该设备进行清洗。
将牺牲材料层108焊接到层20上。该层108是6微米的光敏材料聚酰亚胺或者大约4μm的高温抗蚀层。该层108被软烘并随后将其曝光于掩膜110之后显影。然后若层108是由聚酰亚胺组成,则对层108在400℃硬烘一个小时,或者若层108是高温抗蚀层则在大于300℃硬烘。需要注意的是在附图中由收缩引起的该聚酰亚胺层108的对图案的变形在该掩膜110的设计中被考虑到了。
在下一步中,如图8e所示,采用了第二牺牲层112。该层112或者是2μm的旋压上的光敏材料聚酰亚胺,或者是大约1.3μm的高温抗蚀层。将该层112软烘并随后曝光于掩膜114。在曝光于掩膜114之后将该层112显影。然后,若该层112由聚酰亚胺组成则在400℃硬烘大约一个小时,或者若该层108是高温抗蚀层则在大于300℃烧硬大约一个小时。
随后沉积一个0.2微米的多层金属层116。此层116的部分形成了该执行机构28的无源梁60。
该层116的是通过在300℃左右溅射1,000的氮化钛(TiN),之后在溅射50的氮化钽(TaN)而形成的。进一步再溅射1000的TiN层,之后溅射50的taN和1000的TiN。其他可以用于替代TiN的材料是TiB2,MoSi2或者(Ti,Al)N。
随后将该层116对掩膜118曝光,显影并且等离子蚀刻到该层112之下,在此之将涂敷到该层116抗蚀层湿剥除,注意不要去除已固化的层108或112。
通过旋压4um光敏的聚酰亚胺或者大约2.6um的防高温层而涂敷第三牺牲层120。对该层120进行软烘,随后曝光于掩膜122。随后该曝光层显影并且随后进行硬烘。在采用聚酰亚胺的情况下,将该层120在400℃温度下硬烘大约一个小时,在该层由高温抗蚀层构成的情况下,在大于300℃温度下进行硬烘。
将第二多层金属层124涂敷至层120。该层124的成分与该层116的成分相同并且以同样的方式涂敷。需要注意的是层116和124都是导电层。
将层124对掩膜126曝光并且随后被显影。将层124等离子蚀刻到该聚酰亚胺或防护层120之下,其后将覆盖该层124的防护层被湿剥除,并注意不要将已固化的层108或112或120去除。需要注意的是该层124的剩余部分形成执行机构28的有源梁58。
通过旋压4um光敏聚酰亚胺或者大约2.6μm的高温抗蚀层而涂敷第四牺牲层128。该层128被软烘,曝光于该掩膜130并且随后显影以留下如附图的图9k中所示的岛状部分。该层128的剩余部分在采用聚酰亚胺的情况下在400℃温度进行硬烘大约一个小时,当采用高温抗蚀层的情况下,在大于300℃的温度进行硬烘。
如图8I中所示沉积一高杨氏模量的介电层132。层132是由大约1μm的硅氮化物或铝氧化物所组成。该层132是在低于该牺牲层108,112,120,128的硬烘温度下沉积的。此介电层132需要的基本特性是高弹性模量,化学惰性,以及与TiN的良好粘合。
通过旋压上2μm的光敏聚酰亚胺或者大约1.3μm的高温抗蚀层而形成第五牺牲层134。对该层134进行软烘,并对掩膜136曝光,随后进行显影。在采用聚酰亚胺的情况下将该层134的剩余部分在400℃温度下硬烘大约一个小时,当采用高温抗蚀层的情况下,在大于300℃温度下硬烘。
介电层132是经等离子蚀刻到牺牲层128下面,注意不要去除任何牺牲层134。
此步骤限定喷嘴组件10的喷嘴开口24、杠杆臂26以及固定器54。
沉积一个高杨氏模量的介电层138。该层138的形成是通过在低于牺牲层108,112,120以及128的硬烘温度下沉积0.2微米的硅氮化物或者铝氮化物而形成的。
然后,如图8p所示,将该层138各向异性地等离子蚀刻到0.35微米的厚度。此蚀刻是为了清除整个表面的除该介电层132和该牺牲层134的侧壁之外的绝缘物。此步骤产生了围绕在喷嘴开口24周围的喷嘴边框36,它如上面所述“牵制”了该墨水的弯月面。
采用一个紫外(UV)分离带140。4μm的抗蚀层被旋压到该硅晶片16的后面。将该晶片16对掩膜142曝光,以回蚀该晶片16以形成喷墨通道48。随后将该抗蚀层从该晶片16剥掉。
对该晶片16的后面涂敷另一UV分离带(没有示出)并且该将分离带140去除。在氧等离子体中将该牺牲层108,112,120,128和134剥除,以形成如附图8r和9r中所示的该最终喷嘴组件10。为了便于参考,在这两个图采用与图1相同的参考数字来表示喷嘴组件10的相关元件。图11和12说明了该喷嘴组件10的操作过程,该喷嘴组件是由如上述过程而制造的,参照图8和9,并且这些附图与图2到图4相对应。
需要注意的是:本领域的技术人员可以在不脱离广义描述的本发明的精神或范围的情况下,可以对本发明进行很多改变和/或修改。因此,本实施例在各个方面都应被看作描述性的而非限定性的。
Claims (10)
1.用于喷墨打印机的打印头,该打印头包括:
一个基片,设有用于向待被打印的介质上喷射墨水的喷嘴阵列;
一个有孔的防护装置,其被定位为覆盖至少一个喷嘴,以使喷射的墨水通过一个孔喷射到该介质上;
该防护装置和该喷嘴至少部分确定了一个密封结构,该结构用以将从该喷嘴泄露或者方向错误的墨水与该阵列中的至少一些其他的喷嘴隔离开;以及
用于检测该密封结构中预定数量的墨水并且停止进一步向该喷嘴供应墨水的装置。
2.如权利要求1所述的打印头,其中该阵列中的每个喷嘴具有各自的密封结构,以使其与该阵列中的其他喷嘴隔离开,并且每个密封结构具有一个上述的检测装置。
3.如权利要求1所述的打印头,其中该密封结构使预定的喷嘴组与该阵列中的其他喷嘴隔离开;其中
与每个密封结构配套的该检测装置被配置为在检测到在该密封结构中有预定高度的墨水时停止向该预定组进一步供应墨水。
4.如权利要求1所述的打印头,其中每个喷嘴使用一个弯曲执行机构,该执行机构连接在喷射墨水的叶片上,其中该检测装置终止该弯曲的执行机构,以停止向该喷嘴进一步供应墨水。
5.如权利要求4所述的打印头,其中该检测装置具有一对定位在该密封结构中的电触点,以便该预定数量的墨水累积使电路闭合,从而使得比较仪使该执行机构停止。
6.如权利要求1所述的打印头,其中该密封结构还包括密封壁,该密封壁从该防护装置延伸至每个喷嘴的外部。
7.如权利要求5所述的打印头,其中该喷嘴防护装置是由硅构成的。
8.如权利要求1所述的打印头,其中该检测装置为容错装置提供了反馈,以调节该阵列中的其他喷嘴的操作以对该损坏的喷嘴作出补偿。
9.如权利要求5所述的打印头,其中该喷嘴防护装置还包括一个流体入口,用于引导流体通过该通道,以阻止异物颗粒在该喷嘴阵列上的堆积。
10.如权利要求9所述的打印头,该流体入口的位置远离该喷嘴阵列的接合垫。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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AUPR2924 | 2001-02-06 | ||
AUPR2924A AUPR292401A0 (en) | 2001-02-06 | 2001-02-06 | An apparatus and method (ART101) |
PCT/AU2002/000068 WO2002062582A1 (en) | 2001-02-06 | 2002-01-22 | Flooded nozzle detection |
Publications (2)
Publication Number | Publication Date |
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CN1491163A true CN1491163A (zh) | 2004-04-21 |
CN1328054C CN1328054C (zh) | 2007-07-25 |
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CNB02804634XA Expired - Fee Related CN1328054C (zh) | 2001-02-06 | 2002-01-22 | 具有喷嘴防护装置的打印头 |
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US (3) | US6679582B2 (zh) |
EP (1) | EP1365918B1 (zh) |
JP (1) | JP3960918B2 (zh) |
KR (1) | KR100553561B1 (zh) |
CN (1) | CN1328054C (zh) |
AT (1) | ATE360529T1 (zh) |
AU (3) | AUPR292401A0 (zh) |
DE (1) | DE60219768D1 (zh) |
IL (1) | IL157240A0 (zh) |
WO (1) | WO2002062582A1 (zh) |
ZA (1) | ZA200306303B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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AUPR292301A0 (en) * | 2001-02-06 | 2001-03-01 | Silverbrook Research Pty. Ltd. | A method and apparatus (ART99) |
AUPR292401A0 (en) * | 2001-02-06 | 2001-03-01 | Silverbrook Research Pty. Ltd. | An apparatus and method (ART101) |
US7182423B2 (en) * | 2003-12-08 | 2007-02-27 | Industrial Technology Research Institute | Leakage detection apparatus and method for multi-channel inkjet cartridge |
US7163274B2 (en) * | 2003-12-29 | 2007-01-16 | Industrial Technology Research Institute | Inkjet dispensing apparatus |
JP7374680B2 (ja) * | 2019-09-11 | 2023-11-07 | キヤノン株式会社 | 吐出材吐出装置、インプリント装置、及び検出方法 |
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US4417259A (en) * | 1981-02-04 | 1983-11-22 | Sanyo Denki Kabushiki Kaisha | Method of preventing ink clogging in ink droplet projecting device, an ink droplet projecting device, and an ink jet printer |
DE3677669D1 (de) * | 1985-08-13 | 1991-04-04 | Matsushita Electric Ind Co Ltd | Farbstrahldrucker. |
FR2622277B1 (fr) | 1987-10-23 | 1990-02-23 | Mecanique Gle Foyers Turbine S | Bruleur a gaz pour le chauffage d'un courant d'air ou autre gaz comburant |
JP2746907B2 (ja) | 1988-04-05 | 1998-05-06 | 株式会社リコー | 液体噴射記録ヘッド及び該ヘッドを用いた記録方法 |
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JP3554099B2 (ja) | 1996-02-13 | 2004-08-11 | キヤノン株式会社 | インクジェットプリント装置 |
US5929875A (en) * | 1996-07-24 | 1999-07-27 | Hewlett-Packard Company | Acoustic and ultrasonic monitoring of inkjet droplets |
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EP0983855A3 (en) * | 1998-08-31 | 2000-08-02 | Hewlett-Packard Company | Dot substitution to compensate for failed ink jet nozzles |
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US6526658B1 (en) * | 2000-05-23 | 2003-03-04 | Silverbrook Research Pty Ltd | Method of manufacture of an ink jet printhead having a moving nozzle with an externally arranged actuator |
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EP1289763B1 (en) * | 2000-05-24 | 2007-11-07 | Silverbrook Research Pty. Limited | A nozzle guard for an ink jet printhead |
US6460964B2 (en) * | 2000-11-29 | 2002-10-08 | Hewlett-Packard Company | Thermal monitoring system for determining nozzle health |
AUPR224000A0 (en) * | 2000-12-21 | 2001-01-25 | Silverbrook Research Pty. Ltd. | An apparatus (mj28) |
AUPR277701A0 (en) * | 2001-01-30 | 2001-02-22 | Silverbrook Research Pty. Ltd. | An apparatus (art98) |
AUPR292401A0 (en) * | 2001-02-06 | 2001-03-01 | Silverbrook Research Pty. Ltd. | An apparatus and method (ART101) |
-
2001
- 2001-02-06 AU AUPR2924A patent/AUPR292401A0/en not_active Abandoned
-
2002
- 2002-01-22 AU AU2002224667A patent/AU2002224667B2/en not_active Ceased
- 2002-01-22 EP EP02715316A patent/EP1365918B1/en not_active Expired - Lifetime
- 2002-01-22 JP JP2002562568A patent/JP3960918B2/ja not_active Expired - Fee Related
- 2002-01-22 AT AT02715316T patent/ATE360529T1/de not_active IP Right Cessation
- 2002-01-22 DE DE60219768T patent/DE60219768D1/de not_active Expired - Lifetime
- 2002-01-22 CN CNB02804634XA patent/CN1328054C/zh not_active Expired - Fee Related
- 2002-01-22 WO PCT/AU2002/000068 patent/WO2002062582A1/en active IP Right Grant
- 2002-01-22 AU AU2005201279A patent/AU2005201279B2/en not_active Ceased
- 2002-01-23 US US10/052,400 patent/US6679582B2/en not_active Expired - Fee Related
- 2002-01-24 IL IL15724002A patent/IL157240A0/xx not_active IP Right Cessation
- 2002-01-24 US US10/470,948 patent/US6969145B2/en not_active Expired - Fee Related
- 2002-01-24 KR KR1020037010371A patent/KR100553561B1/ko not_active IP Right Cessation
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2003
- 2003-08-14 ZA ZA2003/06303A patent/ZA200306303B/en unknown
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Also Published As
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AU2005201279A1 (en) | 2005-04-14 |
ZA200306303B (en) | 2005-12-28 |
DE60219768D1 (de) | 2007-06-06 |
US6679582B2 (en) | 2004-01-20 |
JP2004520202A (ja) | 2004-07-08 |
IL157240A0 (en) | 2004-02-19 |
US20040113972A1 (en) | 2004-06-17 |
AU2005201279B2 (en) | 2007-10-25 |
US20050270326A1 (en) | 2005-12-08 |
US6969145B2 (en) | 2005-11-29 |
WO2002062582A8 (en) | 2005-10-06 |
EP1365918A1 (en) | 2003-12-03 |
WO2002062582A1 (en) | 2002-08-15 |
US20020105566A1 (en) | 2002-08-08 |
EP1365918A4 (en) | 2005-03-30 |
KR100553561B1 (ko) | 2006-02-22 |
ATE360529T1 (de) | 2007-05-15 |
US7461918B2 (en) | 2008-12-09 |
AU2002224667B2 (en) | 2005-01-20 |
AUPR292401A0 (en) | 2001-03-01 |
CN1328054C (zh) | 2007-07-25 |
EP1365918B1 (en) | 2007-04-25 |
JP3960918B2 (ja) | 2007-08-15 |
KR20030077608A (ko) | 2003-10-01 |
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