CN1278308A - 通过适度热处理金属沉积物制造材料性能得到改善的结构的方法 - Google Patents

通过适度热处理金属沉积物制造材料性能得到改善的结构的方法 Download PDF

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Publication number
CN1278308A
CN1278308A CN98810843A CN98810843A CN1278308A CN 1278308 A CN1278308 A CN 1278308A CN 98810843 A CN98810843 A CN 98810843A CN 98810843 A CN98810843 A CN 98810843A CN 1278308 A CN1278308 A CN 1278308A
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China
Prior art keywords
coating
additive
settling
shaping
metal
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CN98810843A
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Chinese (zh)
Inventor
J·K·W·陈
B·N·埃尔德里奇
T·H·多齐尔
J·J·叶
G·J·赫尔曼
I·Y·汉德罗斯
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FormFactor Inc
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FormFactor Inc
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Publication of CN1278308A publication Critical patent/CN1278308A/zh
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CN98810843A 1997-09-17 1998-06-11 通过适度热处理金属沉积物制造材料性能得到改善的结构的方法 Pending CN1278308A (zh)

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CN100430513C (zh) * 2003-04-16 2008-11-05 住友电气工业株式会社 金属结构及其制造方法
CN103210123A (zh) * 2010-11-11 2013-07-17 日立金属株式会社 铝箔的制造方法
CN103975094A (zh) * 2011-12-15 2014-08-06 欧姆龙株式会社 接触件制造用组合物、使用有该组合物的接触件、及接触件的制造方法
CN104185504A (zh) * 2011-11-30 2014-12-03 康宁股份有限公司 耐火体中的复杂结构及其形成方法
CN112996864A (zh) * 2018-11-27 2021-06-18 麦克德米德乐思公司 选择性电镀三维表面以产生装饰性和功能性效果
CN113005490A (zh) * 2021-03-16 2021-06-22 昆明理工大学 一种通过热处理提高纳米晶镍腐蚀性能的方法

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WO2001080315A2 (fr) * 2000-04-12 2001-10-25 Formfactor, Inc. Ressorts faconnes et leurs procedes de fabrication et d'utilisation
US7458816B1 (en) 2000-04-12 2008-12-02 Formfactor, Inc. Shaped spring
US6640432B1 (en) 2000-04-12 2003-11-04 Formfactor, Inc. Method of fabricating shaped springs
JP4574145B2 (ja) 2002-09-13 2010-11-04 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. エアギャップ形成
US7354354B2 (en) * 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
JP4762577B2 (ja) * 2005-03-11 2011-08-31 古河電気工業株式会社 ナノ構造体の製造方法
US7521128B2 (en) 2006-05-18 2009-04-21 Xtalic Corporation Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings
US7782072B2 (en) * 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
JP6054258B2 (ja) * 2013-06-17 2016-12-27 名古屋メッキ工業株式会社 電子機器のろう付け接続部
FR3041147B1 (fr) 2015-09-14 2018-02-02 3Dis Tech Procede d'integration d'au moins une interconnexion 3d pour la fabrication de circuit integre
KR101748082B1 (ko) 2016-05-18 2017-06-16 세종대학교산학협력단 비정질 전구체를 이용한 나노결정립 형상기억합금 또는 비정질 합금을 포함하는 프로브 팁, 이를 포함하는 프로브 카드 및 이의 형상 회복 방법
KR102409029B1 (ko) * 2022-04-12 2022-06-14 이시훈 프로브 핀

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DE1696093A1 (de) * 1968-02-03 1971-11-04 Draht Und Federnwerke Veb Verfahren zur Erhoehung der Dauerfestigkeit oberflaechenbehandelter Federn
JPH02221377A (ja) * 1989-02-22 1990-09-04 Toyota Motor Corp Ti合金製コイルバネ
EP1408337A3 (fr) * 1994-11-15 2007-09-19 FormFactor, Inc. Carte à sondes

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100430513C (zh) * 2003-04-16 2008-11-05 住友电气工业株式会社 金属结构及其制造方法
CN103210123A (zh) * 2010-11-11 2013-07-17 日立金属株式会社 铝箔的制造方法
CN103210123B (zh) * 2010-11-11 2016-03-16 日立金属株式会社 铝箔的制造方法
CN104185504A (zh) * 2011-11-30 2014-12-03 康宁股份有限公司 耐火体中的复杂结构及其形成方法
CN104185504B (zh) * 2011-11-30 2016-05-25 康宁股份有限公司 耐火体中的复杂结构及其形成方法
CN103975094A (zh) * 2011-12-15 2014-08-06 欧姆龙株式会社 接触件制造用组合物、使用有该组合物的接触件、及接触件的制造方法
CN112996864A (zh) * 2018-11-27 2021-06-18 麦克德米德乐思公司 选择性电镀三维表面以产生装饰性和功能性效果
CN113005490A (zh) * 2021-03-16 2021-06-22 昆明理工大学 一种通过热处理提高纳米晶镍腐蚀性能的方法

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