TW473562B - Method of making a product with improved material properties by moderate heat treatment of a metal incorporating a dilute additive - Google Patents

Abstract

Deposition of metal in a preferred shape, including coatings (206) on parts (204), or stand-alone materials (300), and subsequent heat treatment (106) to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25 DEG C. this technique involves depositing a material (206) in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment (106). This moderate heat treatment differs from other commonly employed ""stress relief"" heat treatments in using lower temperatures and/or shorter times preferably just enough to reorganize the material to the new, desired form. For example, coating and heat treating a spring-shaped elongate member provides a resilient, conductive contact (212, 920, 1060) useful for electronic applications.

Description

This patent application No. 4 is a part of the pending US patent application filed on September 17, 1997. The serial number of the declaration case is ⑽ / magic,% 3. This application is also part of a series of co-pending US patent applications with serial numbers 08 / 452,255 filed on May 26, 1995. Π. Invention Back 1. Technical Agriculture The present invention is about depositing a material into a selected shape and then modifying the original material to provide the desired mechanical properties. By heating the material with an amorphous structure and a suitable product under moderate conditions, a more ordered structure with higher rebound I · elastic modulus and temperature stability under stress is obtained. In particular, a single forming material or multiple forms can be used, and the new material can be coated and heat-treated to obtain an e, hardened coating, especially in the form of a conductive spring. 2. Fun _ The description of the skill printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). The concept of applying a coating to impart the desired mechanical properties is used in many fields Medium 'from semiconductor to automobile. For example, micro-motor structures, microelectronic packages, and magnetic storage media all use this coating. Various methods' from sputtering to electroforming to chemical vapor deposition are widely used to make such coatings. However, the mechanical properties of many of these coatings are not completely stable, especially at high temperatures. This is 'extremely solid' for deposition methods that cause unbalanced structures. Therefore, the accessories with these coatings have one basic problem in their application. They require stable mechanical properties under load, especially at high temperatures. Tempering or heating the material at a significantly elevated temperature for a long time, Usually 473562 A7 B7 V. Description of the invention (2.In = I · Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs is considered to be a balance of money and more structure-financial. Tempering is often used to reduce brittleness. Brittleness is often Due to the different material forming procedures, for example, when forming a wire, the material is generally extruded through a hole die, which involves various compression and deformation procedures. The newly extruded wire has the desired shape, but the inspection and display of the microstructure of the material shows A large amount of internal stress is used as the stress field. If these internal stress fields are high, the material may be considered fragile and will break under moderately applied stress. Heat treatment of such wires will allow the material to reorganize and relax. These internal stress fields. Heat treatment is also used to redistribute the components in the system. For example, it is generally used in semiconductor processing and silicon-based Dopants are applied on the surface of the material, such as boron or phosphorus. Heating or tempering this product, when the dopant atoms diffuse in the matrix material, will allow redistribution of dopant atoms in the plutonium structure. Metal coating Tempering of layers such as nickel (Ni), # are commonly used in many boat coating operations: it is very common to plate nickel on a substrate and then temper it for example to two hours. This usually releases almost all The stress in the coating, so the tempering system lasts for a relatively long time and / or at a relatively high temperature: f The traditional financial 'nickel system is plated relatively quickly, which obtains a relatively disordered initial structure It therefore provides many sources of residual stress fields. Tempering allows materials to reach a balanced structure, which is relatively stable. It should be noted that typical tempering heat treatment involves time and temperature, and those skilled in the art can use it in a balanced manner. Higher temperature for shorter time, or vice versa. Another traditional method is to prepare a film for hard disks or other recording surfaces. A film such as NiP material is deposited on a substrate and then returned to the Hard Materials Division. -5- Na Scale applicable to China House standard A4 specification (210χ? ^ J ------;-1 sample clothing-(Please read the precautions on the back before filling out this page), 1T 473562 V. Description of the invention (3 Due to advances in semiconductor technology and The density of devices on the chip has increased, so the requirement of adding I is entrusted to + interconnection = dead in microelectronic packaging and microelectronic diagnostics. The mechanical properties of such interconnects are achieving reliable packaging: diagnostic solutions It is very important. For example, 'Typically this type of interconnect is expected to have oblique resilience. At present, on micro-% subpackages (common technology, showing little or no resilience. Bloodline I-line adhesion' tape automated adhesion σΑβ), solder block technology: Pin pins are soldered in holes, pin pins are brazed, and surface soldering is used. Although used in microelectronic diagnostics, " Spring single high pin pins are designed to have The mechanical structure is reversible, but its substantial inductance will suppress the frequency signal through the diagnostic system. Other resilient structures that can be used in the microelectronics industry include a structure called a microelectromechanical structure or a MEMS. Many researchers have created small structures, such as those that are positioned at the same level as other electronic components, to make devices such as relays. A variety of gears and other mechanical structures have been printed on clothing by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs— (Please read the precautions on the back before filling out this page) Microstructures ^ but > technology allows it. The self-resilient material directly forms the microscopic it. It is generally very difficult, if not impossible, because of the resilience. Two: Resistance to specific forming methods. For example, tungsten in conventional probe inserts can be around 90. The corners are bent, positioned, and then cut to a certain length. Exquisite < forming is extremely difficult. It is impossible to plate the coating on small (tens to hundreds of) or even large (millimeters, centimeters or larger) minimum feature sizes before the meter is consumed by employees Cooperative printed 473562 A7 _____ B7 V. Description of the invention (4) Material to provide resilience characteristics, especially in the case of structures with good strength reduction. This limitation is particularly troublesome when the device is intended to be used at moderately high temperatures in excess of 1000C, 85 ° C, or even 50 ° C. Conventional coatings cannot be used to create durable, strong spring structures due to the thermal instability of the coated products formed. The lack of a structure with usable mechanical properties makes it extremely difficult to build a device with a large number of small springs, such as a device for detecting inserts. In the early research work that can form microstructures, it was shown that soft materials such as gold can be easily formed and then plated to obtain hard coatings and resilient structures. See U.S. Patent No. 5,476,211, issued December 19, 1995, which belongs to FormFactor Corporation and is entitled " Method of Manufacturing Electrical Contacts Using Sacrificial Components ". The research work leading to the present invention has shown that the use of improved materials and subsequent heat treatment can provide a strong 'resilient end product. The use of these same or similar materials and proper heat treatment can provide resilient structures in a wide variety of applications. Bonding techniques are generally known. See, for example, U.S. Patent 4,439,284, " Composition Control of Electrodeposited Nickel-Cobalt Alloys. &Quot; However, the choice of plating materials and heat treatment conditions disclosed herein has not been in the past, in the '284 patent, or elsewhere Revealed. Skilled artisans will understand other applications where materials with high drop strength will be beneficial. This is for matrix materials with arbitrary and possibly complex shapes, where maintaining the shape is important, or where matrix materials In terms of not having a sufficiently high yield strength, it is particularly solid. In particular, when manufacturing various spring structures with considerable geometric shapes and dimensions, the Chinese National Standards (CNS) A4 specification (21GX297 Meal) "-~~ (Please read the notes on the back before filling this page) Order 473562 A7 B7 V. The increase in the description of the invention (5) will increase the elasticity proportionally. For fine-pitch interconnects It is advantageous to achieve a large elasticity in a fixed volume. III. Summary of Invention Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the note on the back first) Please fill in this page again) This new invention solves the traditional problem of earlier materials under load, especially at high temperature, which does not provide stable mechanical properties. This general technology allows the manufacture of coatings or isolated coatings on parts, which It has improved mechanical properties, even at high operating temperatures. In particular, this method allows the product to have a relatively high yield strength, a relatively high elastic modulus, and improved temperature stability, which means that Resistance to deformation under high temperature loads. This technique involves depositing a coating in a selected state and then subjecting the coating to a moderate heat treatment. This moderate heat treatment differs from other commonly used " stress relaxation " heat treatments in that Use a combination of significantly lower temperatures and / or times. Traditional tempering heat treatments allow the material to warm to a certain temperature and over a period of time to relieve essentially all stress after subsequent cooling. This new technology makes it just coated Covered materials accept relatively moderate temperatures and / or shorter times, preferably just enough to reconstitute the material into the new desired form. Mechanical properties are in place Improved after treatment. The yielding stress actually increases after this novel heat treatment, but the yielding stress generally decreases after typical stress relaxation heat treatment. See RJ Walter, Hating & Surface Finishing, 1986 for a general description. October, pages 48-53; AJ Dill, Plating, November 1974, pages 1001-1004; and AW Thompson and HJ Saxton, Journal of the Metallurgical Society (Metallurgical Transactions) Volume 4, 1973 June, pp. 1599-1605. Many materials are suitable for use with this novel technology, but a particularly good system includes nickel or chain / alloys, and uses a small amount of sulfur-containing additives, such as saccharin_-8- This paper size applies to China National Standard (CNS) A4 specifications (210X 297 mm) ^ / i562 A7 ------- B7 V. Description of the invention (6). This material is plated on a substrate and then heat treated under moderate conditions. A preferred deposition method is electroplating, but other deposition methods that can be used include chemical vapor deposition (CVD) of metals, physical vapor deposition, electrolytic or electroless aqueous plating, and any material that will cause the material to pass through a gas' liquid or solid precursor. A method of deposition by decomposition or reaction. This new technology for manufacturing coatings with sufficient mechanical properties helps to make resilient structures, which are important structures for many applications such as microelectronic interconnects. In addition to stable mechanical properties, many novel coatings provide structures with rhenium conductivity. Therefore, the present invention can be used to manufacture low-inductance and resilient interconnects. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the notes on the back before filling this page) In a particularly preferred embodiment, the coating is applied to a wire or ribbon to make MicroSpringTM contacts, For example, as described in U.S. Patent No. 5,476,211, the title is " Method of Making Electrical Contacts Using Sacrificial Components ". This technology has been developed in research related to this type of spring contact, especially with a coating of about 1-2 mils (25-50 microns), coating about ι-2 mils (about 25-50 Micron) thick wire. Generally speaking, this technology can be used for thin film coatings of 200 angstroms or thicker, and coatings with thick films of millimeters or even centimeters. Those skilled in the art will appreciate that the teachings of the present invention are applicable to a wide variety of structures. In another particularly preferred embodiment, the coating material is deposited on a shaped article to form useful contacts or other structures with improved material properties. A preferred structure is the lithograph spring of Figures 3B and 3C. Other particularly preferred structures are the lithographic springs exemplified in Figs. 9C and 10K. Other deposition methods can be used. In particular, sputtering can be used to form the paper-a- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 473562 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs An initially formed deposit is prepared, and then the initially formed sinker is heat-treated to obtain a heat-treated formed deposit. The " formed object " to support the deposit obtained by such a deposition method may take a variety of Materials, including: slender members, such as wires or seed layer tracks, which are slender; ditches defined on appropriate removable materials; such ditches optionally include a material, such as a plateable seed layer; in Other shaped articles in or on removable materials; and such shaped articles optionally include two materials, such as a plateable seed layer. One preferred shaped article is a wire frame and the other preferred shaped article is defined. The structure in the masking material has a seed layer in the structure. Another preferred shaped object is a structure defined by the patterned seed layer, located above the masking material, where The shape of the seed layer in the shape of the masking material will affect the first material, where it is deposited. Yet another preferred shaped object is a separate masking material with a shape, according to which, for example, a template or cover The pattern of mesoporosity is the first material. Although the addition of dilute additives can be used in some of the specific examples listed, an important feature of the deposit is the grain texture of the deposited metal. This disclosure is a statement The metal is deposited in an amorphous form and then heat treated to form the crystal structure. Using the correct conditions, as stated in this disclosure, the product formed has better material properties than the initial deposit. Example: A kind of resilient structure is made of a palatal slender member in the following manner, and a coating is deposited on the slender member to obtain a coated γ long member, and the coated heat treatment is performed under a combination of time and temperature The slender member is given a coating with improved material properties. This coating package (210X297 mm) (Please read the precautions on the back before filling this page) Clothing-

'II V. Description of the invention (8) Contains at least one metal and at least one additive. It is made according to another more advanced theory / cl, providing an elongated member, an elongated member covered with a resilient structure in the following manner, and a time: a coating is deposited on the member to obtain a coated elongated member Under the combination of '3' and 'service,' the heat-treated coated (, '. Tianchang member, which will be Wang Shao-a kind of metal and at least-a kind added to a better additive including saccharin mm "alcohol metal includes recording and In addition, it is made according to another preferred method to provide an elongated member. The elastic structure is broadcasted in the following manner: = = :::, and under the combination of time and temperature, The coating is stabilized to induce a transition additive in the metastable coating, and the at least one thin layer of the ferrous layer can co-deposit at least one metal and at least one root-adding agent with the at least one metal. ":: She: '-A kind of resilient structure is described in the following way: a snail is formed on the slender member, and a coating is deposited on the slender member as a nano-junction to obtain a coated slender member, and at A set of crystalline cavities coated with elongated members to induce transformation Ministry of Economic Affairs in the Bureau of prospective employees Jue purlin consumer cooperatives printed: ---- (Please read the Notes on the back page and then fill in}

-, 1T enough disk, :: coating. The coating contains at least one metal, and at least one metal-additive sufficient to co-deposit with at least one metal. According to a preferred embodiment, a resilience knot is thin in the following form: an elongated member, and a coating is deposited on the elongated member to obtain a coated thin part, and the coated part is heat-treated under a combination of time and temperature. Covered parts increase the drop strength of the coating. The few metals and at least one additive. Layer 473562 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (9) According to another preferred embodiment, a structure with improved material properties is made in the following manner, providing a base fitting, which Comprising forming a deposit on which the first material can be deposited, depositing the first material on the formation to obtain an initially formed deposit, and heat-treating the initially formed deposit under a combination of time and temperature, and A heat treated shaped deposit is obtained which has improved material properties. The first material contains at least one metal. The formed article may take various forms as described above. According to another preferred embodiment, a structure is made in the following manner, and a base fitting is provided, which includes a shaped article on which a first material can be deposited, and the first material is deposited on the shaped article, and The initially formed deposit, and the combination of time and temperature, is used to heat treat the initially formed deposit to obtain a heat treated formed deposit having improved material properties. The first material includes at least one metal and at least one additive. Good metals include nickel and lead, and preferred additives include saccharin and 2-butyne-4-diol. The formed article may take various forms as described above. According to another preferred embodiment, a structure is made in the following manner, and a base fitting is provided, which includes a shaped article on which a first material can be deposited, and the first material is deposited on the shaped article, and The first formed deposit is a metastable formed deposit, and the combination of time and temperature is used to heat treat the metastable formed deposit to induce transformation to obtain a heat treated formed deposit, which is mainly a stable formed Deposits with selected material properties. The first material contains at least one metal. The formed article can take various forms as described above. According to another preferred embodiment, a structure is made in the following way. _-12-_ This paper size applies to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling This page) 473562 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (ΊΟ Provides a base accessory that contains the product from which the first material can be deposited, and deposits the first on the formed product This material is initially shaped. It is a nanocrystalline deposit, and the nanocrystalline deposit is heat-treated at a time and temperature by a group of people to initiate a transformation. Shaped deposits' are mainly crystalline deposits and have selected material properties. The first material contains at least one metal. The shaped bodies take various forms as described above. According to another preferred embodiment A product with improved material properties is formed from the following, providing a base fitting that includes a molded article on which the first material can be accumulated, and depositing the first material on the molded article ^ To obtain the initially formed deposit, and to heat-treat the initially formed deposit under a combination of time and temperature to obtain a heat-treated formed deposit ", which has improved material properties. The first material Contains at least one metal. 'The shaped article can take a variety of forms as described above. In another preferred embodiment, a structure has a maximum yield strength close to that structure, and the structure includes an elongated member and an elongated member. A coating on a component. This coating is treated to have a selected yield strength and elastic resilience structure that is approximately close to the highest yield strength of the coating composition. This coating contains at least one metal. In a preferred embodiment, a structure has a maximum yield strength close to that structure. The structure includes an elongated member and a coating on the elongated member. The coating is processed to have a structure that mainly includes a crystal structure. The resilient structure of the coating. This coating contains at least one metal. In another preferred embodiment, a resilient contact Have (Please read the notes on the back of this page and then fill in) order

473562 A7 B7 V. Description of the invention (11) Regarding the highest yield strength of this structure, the structure includes a base fitting and an object connected to the base fitting. This object in turn contains a first material, wherein the first material contains at least one metal, and wherein the object has been processed to obtain an object with improved material properties. In another preferred embodiment, a structure having a mainly crystalline grain structure includes a base fitting and an object connected to the base fitting. The object includes a first material, and the first material in turn includes at least one metal and at least one additive capable of being co-deposited with the at least one metal. This material system is processed to obtain a structure with a selected yield strength, which is approximately close to the highest yield strength in the form of an object for the first material composition. This and other objects and advantages of the present invention, as well as details of illustrative specific embodiments, will be more fully understood from the following patent specification and drawings. IV. Brief Description of the Drawings Fig. 1 is a flowchart illustrating a method of manufacturing a coated wire according to a preferred embodiment of the present invention. FIG. 2A is a cross-sectional view illustrating a skeleton connected to a substrate. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page). Figure 2B is a cross-sectional view of the newly coated wire, which includes an unheated coating covering the skeleton. FIG. 2C is a cross-sectional view illustrating a heat-treated coated wire according to a preferred embodiment of the present invention, which includes a heat-treated coating covering the skeleton. FIG. 3A illustrates an alternative specific embodiment replacing a plated substrate. A cross-sectional view where the spring contact member is positioned on a sacrificial substrate. _-14-_ This paper size applies to China National Standard (CNS) A4 (210X 297 mm) 473562 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs -15- 5. Description of the invention (12 Figure 3B is an explanatory diagram 3A perspective view of spring contact member, omitting the display of sacrificial material. Figure 3C is a cross-sectional view illustrating another example of a spring contact member, which is loaded into another component. Figure 4 is a description Diagram of the differential scanning card meter measurement method of the coated material. Figure 5A is a diagram illustrating the χ_ray diffraction pattern obtained from a sample of the Ni_Co coating material just coated. Figure 5B is a diagram illustrating the heat treatment of the Ni_Co coating. A graph of & ray diffraction patterns of material samples. Figure 6 is a graph illustrating stress versus strain data for freshly coated and heat treated wires. Figure 7 is a graph illustrating the elastic modulus of freshly coated and heat treated wires versus saccharin. Concentration graph. Figure 8 is a graph illustrating the curvature of the wire at different times and temperatures before and after heat treatment. Figure 9A is a side cross-sectional view of the technology for manufacturing spring contact members. Figure 9B is a side view of the spring contact member of Figure 9A Sectional view. Fig. 9C is a perspective view of the spring contact member of Fig. 9B. Fig. 10A is a side cross-sectional view of a step in the first specific embodiment of the method for manufacturing a contact structure. Fig. 10B is a contact structure The first cross-sectional side view of another step in a specific embodiment of the manufacturing method. FIG. 10C is an intermediate product formed in the step shown in FIG. 10B of the first-item specific embodiment of a manufacturing method according to a contact structure. The top plan view of this paper. This paper scale is applicable to Chinese National Standard (CNS) A4 specification (2 丨 0X297 public meals) -----:-; ---- (Please read the precautions on the back before filling this page), vs 473562 Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (13) Figure 10D is a side cross-sectional view of another step in the first example of a specific embodiment of the manufacturing method of the contact structure. 10E is a side cross-sectional view of another step in the first enumerated embodiment of the contact structure manufacturing method. FIG. 10F is shown in FIG. 10E in the first enumerated embodiment of the contact structure manufacturing method. The top plan view of the intermediate product formed in the step. Figure 10G is a side cross-sectional view of another step in the first embodiment of the method for manufacturing the contact structure. Figure 10H is the first step in the method of manufacturing the contact structure. A cross-sectional view of the end of the product formed in the step shown in Fig. 10G of a specific embodiment is shown. Figs. 101 and 10J are perspective views of two of the many possible types of contact structures of the present invention. The bottom of the funnel. Figure 101 illustrates the structure formed by partially coating the side wall of the opening, which is roughly shown in Figures 10E and 10G. Figure 10J shows the structure formed by completely coating the side wall of the opening, as shown in Figures 10E and 10G As shown. Fig. 10K is a top plan view of an intermediate product formed in the step shown in Fig. 10G, which is a first example of a specific embodiment of a manufacturing method of a contact structure. 10L and 10M are cross-sectional and perspective views of individual side surfaces of a completed contact structure formed on an electronic component according to a first specific embodiment of a method for manufacturing a contact structure. Fig. 10N is a side cross-sectional view of the contact structure of Figs. 10L and 10M, the top end of which is in contact with a contact pad of an electronic component. Fig. 100 is a cross-sectional view of J of the contact structure of Figs. 10L and 10M, the top end of which is a contact pad soldered to an electronic component. _-16- This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page).

1T 473562 Patent Application No. 87120343 Amendment Page of Chinese Specification (December 89) A7 B7 V. Description of Invention (Year B ί ;! B9.12. L 6 Figure 11 illustrates the contacts for Figure 10K and related graphics A top plan view of a preferred shaped object for the structure. The symbol indicates the consumer cooperation of the Central Bureau of Standards of the Ministry of Economic Affairs. Du printed 102 indicates the formation of the wire skeleton; 104 indicates the coating deposition; 106 indicates the heat treatment; 202 indicates a base Where: 204 indicates a wire skeleton; 206 indicates a coating; 208 indicates a coated wire; 210 indicates a heat-treated coating; 212 indicates a heat-treated coated wire; 300 indicates a contact structure; 302 indicates a Base part; 304 represents a contact end part; 306 represents a central body part; 308 represents a feature; 310 represents a joint feature of an oblique truncated pyramid; 402 represents a heat-treated curve; 404 represents a coating curve; 460 represents A spring contact member; 462 represents a base end; 470 represents an electronic component; 472 represents a pin; -17- The paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) (please read the precautions on the back before filling this page).-473562 No. 87120343 Patent Application Chinese Correction Sheet (December 89) V. Description of the invention (14a) A7 B7

902 indicates a substrate; 904 indicates a patterned first shielding layer 906 indicates a patterned second shielding layer 908 indicates a patterned third shielding layer 912 indicates a region; 914 indicates a conductive material; 920 indicates a conductive material Metal material; 922 indicates a bottom end; 924 indicates a top end; (Please read the notes on the back before filling this page) indicates openings; indicates inclined areas; indicates prominent features; printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs , 934 and 936 indicate arrows; 1002 indicates a silicon substrate; 1004 indicates a passivation layer; 1006 indicates an opening; 1008, 1008a and 1008b indicate metal contact pads; 1010 indicates a conductive layer; 1020 indicates a shielding layer; 1022, 1022a and 1022b 1023, 1023a and 1023b 1030, 1030a and 1030b 1040 represents a template; 1042, 1042a and 1042b represents an opening; 1050 represents a seed layer; 1050a and 1050b represent a patterned trajectory; 1052a and 1052b represent a bottom End; 1053, 1053a and 1053b indicate slanted area; 17a- This paper size applies Chinese National Standard (CNS) A4 regulations Grid (210X 297 mm) 473562

No. 87120343 Patent Application A7 Revised Chinese Manual (December 89) B7 T ** ^ * nv λ- Λ ^ ·· Year "Η > 't *. ， 一 $ ， 恭 日 日 # Η 日 / μ, WliU 1054a and 1054b represent the top end; 1056a and 1056b represent the central body part; 1060, 1060a and 1060b represent the spring contact structure; 1062, 1062a and 1062b represent the bottom end part; 1063, 1063a and 1063b represent the inclined area; 1064, 1064a and 1064b indicate the top of the contact; 1066, 1066a and 1066b indicate the main part; 1070 indicates an end; 1072 indicates an electronic component; 1080 indicates an end; 1082 indicates an electronic component and 1084 indicates a solder. V. Detailed description of the preferred embodiment Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the notes on the back before filling out this page) The invention can begin with uncoated accessories in almost any shape. In general, the materials of the present invention can be applied to any suitable substrate or shaped article and then heat treated under moderate conditions as described to obtain useful products. This substrate or shaped article may or may not be retained, depending on the particular application. The deposited material will be organized into the desired structure very early in the coating process ^ It may be within the first few hundred angstroms of the deposited material, and the properties shown by a coating of several millimeters or even several centimeters thick, in After heat treatment, materials with improved mechanical properties as discussed herein are provided. When compared with other possible states of materials under study, special improvements in the mechanical properties of heat-treated materials in specific structures may include the addition of -17b- This paper size applies Chinese National Standard (CNS) A4 specifications (210X29 · / Mm) ~ Γ / ~ Γ /

罘 87112〇343 Chinese Application for Correction Sheet of the Patent Application (December 89) " " — ----- V. Description of the Invention (i14e) L: Approximately the highest). (Approximately the highest) = number, and temperature stability. Other possible states include materials that have just been overclad (before heat treatment), and materials that have been extensively tempered (for example, for tempering). The artist can selectively control the quality of the shellfish according to the technique of the present invention. For example, 'heat treatment can be selected to obtain the lowest ductility, or can be selected' to selectively obtain more ductility. 4A similar way, we: = heat treatment 'to obtain lower than the maximum yield strength, or lower than the maximum elasticity =: We may expect, for example, to balance the properties of various materials or to comply with other μ restrictions' but still follow the statements of the present invention to make materials with properties that are better than those that have just been coated but not heat treated. C Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs -17c ------ This paper is suitable for countries and counties (CNS) A4 size (210X 297 public love)

V. Description of the invention (15 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs for use in substrates < A particularly good shaped object is an elongated member, such as a skeleton or a temporary branch. A preferred skeleton is a wire, which in turn can be fixed to The substrate or substrate 'or other support. Another preferred skeleton is horizontal kneading, which is fixed but oriented to avoid the substrate or substrate. Particularly preferred is the use of an elongated member that can be made into a spring shape. This elongated member does not have to be resilient, but in fact can be fully flexible to help shape into any or desired form. The matrix material of the present invention can also be deposited in other ways. For example, the desired shaped article can be used by the application Various materials are defined on substrates such as silicon wafers, as is known in the art. Such materials may include photoresists for certain applications.-Shaped objects can be patterned, etched, etc. Is defined, and then power plating is prepared by depositing a thin seed layer, such as a copper-containing metal layer. This matrix material can be plated onto the seed layer and heat treated as follows. Or even all the materials below it can be easily accepted for selective removal, leaving the material of the present invention deposited, partially or completely free of the original substrate 1. Selective removal can be achieved before or after the heat treatment step, as per It depends on the need. Another preferred method of depositing materials is to deposit the beta material in a suitable form and then heat-treat to improve the material properties. The figure shows a preferred embodiment according to the present invention. A flowchart of a method for coating a wire. First, a small wire frame 204 (see FIG. 2A) is formed on a substrate 200 (see FIG. 10). For example, the wire frame 204 may be made of a gold wire, And the forming action 102 can be completed by using a wire bonding machine. The substrate 202 may include, for example, a semi-conductive paper size of 逋 财 _ 家 揉 准 7 ^ s) A4 specification (2) 0X '~ ^ ------__ H -^^ 1 I ^^ 1 i-....... -ii C Please read the notes on the back teeth first and fill in this note] " •• .II III · 473562 A7 B7 V. Description of the invention (16 ) Bulk substrate. Of course many other substrates 202 are possible, such as substrates including ceramic, plastic or metal substrates Second, a coating 206 (see FIG. 2B) is deposited 104 on the lead frame 204. The coating 206 may be, for example, about 50-50 (atomic percent) nickel-gum (deposited) deposited using a plating bath containing saccharin as an additive. Ni-Co) alloy. The concentration of saccharin in the plating bath is discussed below with reference to Figure 8. This bath can be changed to change the Ni / Co ratio, or different additives can be added instead of saccharin. Variations of various plating baths are Can be used. In an alternative deposition method, no additives are added. Appropriate materials and suitable deposition conditions are selected so that the material is deposited in an amorphous form, which is easy to accept the heat treatment of the present invention. Consumption by employees of the Central Bureau of Standards, Ministry of Economic Affairs Printed by a cooperative (please read the notes on the back before filling out this page) It is generally expected that coatings based on nickel, cobalt, or iron (Ni, Co, Fe) will have roughly similar results. Preferred alloys include Ni-Co, Co-Mn, Ni-Mn, and various ternary alloys, such as Ni-Co-Mn. Alternative coating materials include Ni-W-B and Rh. Other possible coatings include Pd, Pd-Au, Pd-Co, W, W-Co, Ti-N, Cu, Cr, Ti, Ti-W, Al, Au, and Pt. Alternative additives include tea-tri-sulfonic acid (NTSA), 2-butyne-1,4-diol and thiourea. Other possible additives include NiCl, NiBr, and general Type 1 and Type 2 whitening agents. All these coating materials and additives are known in the art of plating. Third, the freshly coated wire 208 (see FIG. 2B) is subjected to heat treatment 106 at a temperature higher than the transition temperature of the coating 206, thereby forming a heat-treated coated wire 212 (see FIG. 2C). For example, the heat treatment 106 of Ni-Co alloy can be completed at 350 ° C for ten minutes or at 300 ° C for sixty minutes. Hot _-19-_ This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) A7 B7 V. Description of invention (17) (Please read the precautions on the back before filling this page) Processing 106 should happen The time and temperature range (meaning heat treatment limit) is described below with reference to FIGS. 4 and 8. Of course, different heat treatment plans may be required for different alloys or additive systems. FIG. 2A is a cross-sectional view of a lead frame 204 connected to a substrate 200. FIG. The skeleton 204 can be formed in various shapes, such as those shown, to make a resilient elastic fitting that can be used. A useful shape is a spring or elastic shape. Different shapes can be used, depending on the desired application of the elastic accessory. Alternatively, the skeleton 204 may be a straight wire. FIG. 2B is a cross-sectional view of a freshly coated wire 208 that includes a coating 206 covering the wire 204. In relation to the thickness of the skeleton 204, the coating 206 has a thickness sufficient to significantly impact the mechanical properties of the freshly coated wire 208. As described below with reference to FIG. 5A, the newly applied coating 206 has an amorphous or nanocrystalline atomic configuration. Printed by the Consumer Cooperatives of the Central Standards Bureau, Ministry of Economic Affairs. Figure 2C shows the heat-treated coated wire 212. A cross-sectional view that includes a heat-treated coating 210 covering the lead frame 204. The heat-treated coated wire 212 is formed by heating the freshly-coated wire 208 at a temperature greater than the transition temperature of the unheated coating 206 for 106, preferably over a relatively short period of time. As described below with reference to FIG. 5B, the heat-treated coating 21 has a crystalline or ordered atomic configuration. Furthermore, as confirmed by the test results described below with reference to FIG. 8, the heat-treated coated wire 212 is resilient, and it retains its resilience much better than just coated after accepting simulated operating conditions. Of the wire 208. Therefore, the thickness of the coating 206 is sufficient to impart resilience to the coated and heat-treated structure. Representative wire can have a diameter of about 1 to 5 mils (25 to 38 microns), with -20- This paper size applies to China National Standard (CNS) A4 specifications (210X297 public attack) 473562 Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Print A7 B7 V. Description of the invention (18 has a spectrum with a coating thickness of 1-5 mils (38 microns) to provide a total diameter of about 4 mils (100 microns). The coating thickness is as low as 2000 to 500. Angstrom shows the properties discussed here. The coating can be relatively thick, of course millimeters and possibly in centimeters or larger spectrum and still shows the properties discussed here. Useful I coatings can be deposited using electroplating. Typical plating baths The method of operation is as follows. This illustrative example, preferably an example, provides an alloy with improved hardness and mechanical properties, and has about a minimum of co-deposited sulfur. A good microcrystalline agent is benzopyrene sulfur Sodium imine s), also known as sodium saccharin. This and other microcrystalline agents are well known to those skilled in the art. Although sulfur-containing materials are used in this preferred embodiment, this does not seem to be absolute:. For example, 2-butyne 4,4-diol has been shown to be effective in practicing the present invention. This additive or deposition conditions should promote the formation of the desired coating structure, as discussed below. The electroplating department is very clear to those skilled in this art. When using the outlined electrolyte composition, electrodes, associated current density, deposit thickness, and specific device conditions, there is no evidence of wind sulfide precipitation at the grain boundaries at the heat treatment temperatures suggested in this disclosure. This precipitation does not exist, which will help prevent the formation of grain boundaries and brittleness, otherwise it may lead to premature product damage. The product properties of success are derived from high drop strength, with appropriate ductility. Experience has shown that " belt-like " (or layered) coating structures can lead to favorable product properties. Addition of grain micronizing additives such as hydrazine_tri_sulfonic acid, NDSA, p-toluenesulfonamide or (preferably To) Sodium saccharin will produce this "band-like effect" to further increase the strength of the drop-off and the desired rebound characteristics in the product (please read the precautions on the back before filling this page)

473562 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Invention Description (19). These additives should generally not be alloyed with the major metal (s) to be deposited, but should be co-deposited with them. Thin deposits of certain alloys, including co-deposition of cobalt and nickel, may not show visible "banding", but provide considerable yield strength. Alloy deposition: Although the following solution composition, control and operating conditions For this preferred embodiment, it is specific, but skilled alloy plating technicians can produce comparable electrodepositions with superior properties for other applications. Approved factors that affect the composition of alloys in electrodeposition include Electrolyte Ni / Co ratio in solution; current density, electrolyte agitation, pH 値, temperature; total concentration of boric acid and metal. Preferred deposit properties: freshly plated (without heat treatment) Composition: 60% ± 2% nickel (weight ratio) , 40% ± 2% cobalt hardness: ~ 550 Knoop ultimate strength: 〇 " u 265 min ksi (ksi = thousand psi) yield strength: cr y 160 min ksi modulus: E22 ± 2 (Msi) (minimum 値) ( Msi = million psi) Elongation 4.5% ± 0.5% Appearance of the sediment: The sediment is smooth and continuous with high spectral reflectance. The conventional Hull Cell Panel test shows that this appearance covers a wide range of plating currents. Typical solution composition: A preferred embodiment of the present invention for producing products with high resilience is shown in Table 1 below. Plating is performed in a conventional plating tank, such as a laminar flow polypropylene tank. Barrels. Plating time and conditions are determined as needed to obtain a satisfactory coating. _-22- This paper size applies to China National Standard (CNS) A4 (210X297 mm) (Please read the note on the back first Please fill in this page again.) Order 473562 A7 B7 V. Description of the invention (2) Table 1-Typical composition of typical chemical group 1) 100 g / l 2) 38 g / l 3) 3-5 ml / l (@ 18% concentrated) 4) 8.3 g / l (8.3 g Co) 5) 25 dyne / cm 6) 100 mg / l I ----.---- (Please read the precautions on the back first Fill out this page) 1) Ni sulfonic acid 2) Boric acid 3) Ni bromide 4) Co sulfamic acid 5) Sodium lauryl sulfate 6) Saccharin Na In a typical method of the present invention, these can be The whole or one part of the substance is replaced by the substitute substance in Table 2 below. Production-substitutes are cleared into typical alternative chemicals 1) Amino sulfonic acid Ni la) Sulfate Ni lb) Acetic acid Ni lc) Fluoroborate Ni ΐφ Of Ni le) sulfate Ni- gasification] STi acid pyrophosphate squatting

Ni 2a) Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economics of the Citric Acid Industry 2) Boric acid 3) Ni bromide 4) Amino acid c 05) Wetting agent 6) Type 1 whitening agent 7) Leveling agent 3a) Ni 3b Chloride 4M) Magnesium Chloride 4a) Co 4b Sulfate Chloride 4 Co) Chlorofluoride Co 5a) Commercially available wetting agents designed for plating applications 6a) p-Toluidine amine 6b) Sodium triphosphate 6c) Perylene dipic acid or a combination of 6a-6c above 7a) Coumarin 7b) Quinoline 7c) 2-Butyl-1,4-diol or a combination of a type 1 whitening agent and a leveling agent. In a preferred embodiment, the coating material is deposited on

Printed by the Employees' Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 473562 A7 ------ -B7 V. Description of the Invention (21): Guide on page form. After proper heating, the heat-treated spring is kept substantially finely elastic after being subjected to simulated operating conditions. This characteristic is highly desirable for horse springs, especially for semiconductor device body packages, semiconductor wafers, electronic devices used to contact-or multiple semiconductor devices, electronic devices used to test-or multiple semiconductor devices, and detection plugs. , Probes, connectors, people or sleeves. This characteristic is highly desirable for springs, and the maintenance of resilience is important to maintain pressure contacts at all times. This same characteristic is also advantageous for pure components with any shape or geometry when subjected to a long period of time under high temperature. The preferred embodiment described herein is based on a coating that covers the wire, which may or may not be made into the desired form. The description of the present invention can also be used for coating other shaped articles. In particular, the object to be coated can be removed from the novel coating before or after the heat treatment step. See, for example, co-pending U.S. Patent Application Serial No. 08 / 802,054, entitled "Microelectronic Contact Structure and Method of Making", which belongs to FormFactor, and is now Livermore (California) with the present invention. This application and its corresponding PCT patent application serial number 97/08271 were filed on May 15, 1997 and published as WO 97/44676 on November 27, 1997, which revealed that a structure was formed on the substrate, The structure is then removed from the substrate, resulting in an unsupported fitting. See, for example, Figures 3A, 3B, and 3C (individually Figures 3A, 3B, and 4E of the reference application), which show a structure formed on a substrate (Figure 3A), an identical structure without a substrate (Figure 3B) 'and a structure connected to different substrates (Figure 3C). Use the statement content of this invention, familiar with this art ___- 9Λ- This paper size is applicable to Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) Order 473562 Economy Printed by A7 B7, Consumer Cooperatives of the Ministry of Standards and Standards of the People's Republic of China 5. Inventors (22) can apply the structure of Figs. 3A, 3B and 3C at an appropriate time to prepare a coating as stated in this disclosure. For example, may The spring contact member 460 (FIG. 3C) is bonded to the electronic component 470, and then coated and heat-treated. Alternatively, the contact structure 300 (FIGS. 3A, 3B) may be coated and heat-treated before the sacrificial substrate 252 is removed. 3A and 3B illustrate another of many possible specific embodiments of the contact structure 300 made by the technology described in the cited application. The sacrificial substrate 252 is used to prepare the contact structure 300. Slightly The truncated pyramid-shaped joint feature (pin) 310 is made at the base portion 302 of the contact structure 300, and is made of attaching features. The rest of the contact structure 300 is the central body portion 306, the contact End part 304 and feature 308, this Is a contact point. W1 and W2 are the widths at the individual ends of the contact structure. Figure 3C illustrates an alternative embodiment of the described invention, wherein the spring contact member 460 is via a pin 472 extending from the surface of the electronic component 470, Loaded into the electronic component 470. The base end 462 of the spring contact member 460 is appropriately brazed to the pin 472. In addition, those skilled in the art can select a material suitable for use as a substrate for coating, and apply the statement of the present invention To apply such a coating, and then remove the substrate, leaving a product formed by the coating itself. In a particularly preferred embodiment, the contact structure, such as 300, can be built on a suitable substrate so that The coating is formed as a whole of the material of the contact structure 300. An alternative substrate may be a conductive layer that covers the desired shape of the material, and the material itself can be easily removed. Such an embodiment may be a wax, photoresist, or other material The formed article starts, and then a thin conductive layer is applied to promote the plating. The coating is as disclosed in the present invention. The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) ( Read the precautions on the back before filling in this page) Clothing. Order 473562 A7 B7 V. Description (23) layer, and then heat treatment to obtain products with the desired shape and properties. Two preferred specific embodiments of this product, It is described in detail at the end of this patent specification. Figure 4 is a chart of the differential scanning card meter measurement of a newly applied coating similar to coating 206. This measurement starts with the material that was just applied initially without heating, The temperature is increased by 10 ° C per minute from room temperature (about 30 ° C) to 500 ° C, and the heat flow is measured. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling in) (In this page) In the graph, the (inverse) absorption peak 602 centered at about 266 ° C indicates that an exothermic transition occurs in the material, especially when the temperature is within the range shown by the width of the absorption peak 602. This exothermic transition is inferred to change the microstructure and atomic configuration from the newly applied coating 206 to the heat-treated coating 210. Since the absorption peak 602 appears to start above about 200 ° C, when using a Ni-Co alloy as a coating material, a heat treatment 106 above about 200 ° C should be able to cause this transformation. However, it is generally preferred to choose a temperature close to or slightly above this peak temperature. In the example shown, the absorption peak occurs at about 266 ° C, and useful and preferred heat treatment conditions include 300 ° C for 60 minutes, or 350 ° C for ten minutes. Generally speaking, the skilled artist will understand that a heating temperature range will achieve the desired effect. In general, the useful temperature range is between 0 and 150 ° C above the absorption peak transfer temperature, and the particularly useful temperature range is between 0 and 100 ° C above the absorption peak transfer temperature. Products that have only been partially converted may also be used. Those skilled in the art can obtain the desired variables according to the content of the present invention. Generally speaking, if a substantial portion of the freshly coated material undergoes a transition to a more orderly state, a useful increase in material properties is visible and useful. A particularly preferred embodiment involves applying the coated _-26- this paper size to the Chinese National Standard (CNS) A4 (210X297 mm) 473562 printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs -27- A7 2. Description of the invention (24 materials are heat-treated at 30 ° C for fifteen minutes. Figure 5A is a chart of the χ_ray diffraction pattern of the coated 2Q6 sample. The two χ_rays shown in Figure 5 The significant width of the diffraction absorption peak indicates a relatively small average grain size of about 16 nanometers in the material. (The average grain size is large! It is determined using the Debye_SchejTer formula known in the art, and the average grain size is obtained. Lower limit). Because it has an average grain size of M nanometers, the characteristics of the newly coated coating ㈣ can be nanocrystalline materials. Figure 5B is a sample of a heat-treated coating according to a preferred embodiment of the present invention. A chart of the X-ray diffraction pattern. In this case, the heat treatment 106 applied is 10 minutes at 33 ° C. The narrowness of the two absorption peaks shown in Figure 5B, Table 7F is relatively large average crystal The particle size is about 78 nm in the material ( The Debye-Scherrer formula is used again) ^ Since the average grain size is 78 nm, the heat-treated coating 21 can be characterized as a crystalline or ordered material. Therefore, as shown in Figures 5A and 5B, this The coating material undergoes a transformation during the heat treatment 10, from nanocrystalline or amorphous to crystalline or ordered. Figure 6 shows the stress versus elongation of the newly coated wire 208 and the heat treated wire 2 丨 2 ( Strain) data. These wires 208 and 212 tested here are straight rather than made in the form of a spring. Therefore, this elongation (strain) measure is 値 and has the same shape as the wires 208 and 212. There is no mechanical significance of the material. 'The data in Figure 6 shows that the heat treated wire 212 has superior mechanical properties compared to the newly coated wire 2㈨. After the heat treatment curve 402, the national standard of the paper that is just coated is applicable to Chinese standards. (CNS) A4 specification (21GX297 mm (please read the precautions on the back before filling this page)

1T 473562 A7 B7 V. Description of the invention (Comparison of 25 curve 404 shows a higher yield stress (defined as the stress against 0.20 /. Strain) than the modulus of resilience. Therefore, the heat-treated wire is elastic and covers transportation Stressing beyond a large range. This indicates the higher resilience of the heat-treated spring, and appears to be due to basic material improvements. Since most mechanical components are designed to operate in elastic systems (meaning to maintain their shape) ), So the more resilient materials are more mechanically stable. The resilient materials in heat-treated springs significantly improve the stability of mechanical properties under high temperature loads. When compared with other possible states of materials under study In comparison, special improvements in heat-treated mechanical properties may include increased (preferably about the highest) drop strength, increased (preferably about the highest) elastic modulus, and improved temperature stability. Others Possible states include materials that have just been coated (before heat treatment), and materials that have been extensively tempered (for example, for stress relief). Improved temperature security Qualitative, confirmed by increasing the lack of resistance to deformation under high temperature loads, where the temperature can be slightly higher than 25 ° C, including 85-ioot, and even 300 C or higher. This shows that the material is a kind of The initial material of the cover is more stable (Please read the precautions on the back before filling this page)

1T printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Figure 7 is just coated (in Figure 7, I original, or, bribe ") wire 208 and heat treated (in Figure 7 " Heat treated " or " ") chart of elastic modulus versus saccharin concentration of the lead 212. This graph shows the elastic modulus of the heat-treated wire 212 for all non-zero (especially 20 mg / L or greater saccharin concentrations tested), which is substantially greater than the elastic modulus of the freshly coated wire 208. When '' When saccharin is used as an additive in the plating bath according to Table 1, the heat-treated wire 212 typically has an elastic modulus of about 32 Msi, and the newly coated wire -28- Wood paper size applies Chinese National Standard (CNS) A4 Specifications (210 X 297 mm • m Hi · 473562 A7 B7 V. Description of the invention (26 208 typically has a modulus of elasticity of about 24 Msi. Msi stands for “Million” psi. Figure 8 shows a bath solution containing saccharin. A graph of the curvature of the wires under a 0.5-inch mandrel test with various wires coated with Ni-Co. This mandrel test includes wrapping a straight plated wire around a mandrel with a specific diameter to produce a fixed Strain (mandrel material is selected to have the same coefficient of thermal expansion as the wire to avoid other stresses due to differences in the coefficient of thermal expansion). The wire is then connected to the mandrel at both ends to maintain this strain. The strain can then be made heart Shaft-wire assembly is exposed to any time / temperature combination. This test is a convenient way to test material properties as a function of time under high temperature loads. It is an extremely useful way to simulate different operating conditions. What happens to specific test conditions The amount of plastic deformation is reflected by the change in the curvature of the formed wire, where the curvature is defined as: curvature = 100 * the edge of the conductor of the conductor _ half printed on the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (Please read the notes on the back before filling this page) Figure 8 shows the effect of different heat treatment temperatures on the curvature of the wire. A group of freshly plated wires has a curvature measured at room temperature. Then, it is accepted at different temperatures 7 minutes heat treatment, cooling to room temperature, and measuring the curvature again. It was subjected to a two-minute mandrel test at room temperature, and the curvature was measured again. Then, it was subjected to a 13-hour mandrel test at 85 ° C. , Cooled to room temperature, and measured the curvature again. Finally, it was subjected to another 24 hours mandrel test at 85 ° C (total duration is 8 37 hours at 5 ° C), cooled to room temperature, and measured curvature. As seen in Figure 8, plastic deformation at room temperature with mechanical load after two minutes at nominal temperature and at different temperatures The heat-treated wires are the same. However, when mechanically used at high temperature 29- This paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm) Α7 Α7 B7, the description of the invention (^ 7 at the higher temperature ('400 C) The wire under heat treatment shows a smaller plastic shape * Ai ~. This is another indication of improved mechanical properties after heat treatment. Itl · * 1/1, the mechanical properties of this temple are under Tg350 ° c For heat-treated coated conductors, the cheat is constant, consistent with the result of Figure 4 (see the relevant monograph above). „^ It is also explained that certain Ni and M / C systems have been discussed in detail, which has a variety of Timing states, especially saccharin. However, these general principles can be used for a wide range of additives and ancient additives System, and then heat treatment under moderate conditions, and suffocate products with the desired properties. Under certain deposition conditions, additives are not required. Can be offended (metal systems are listed in detail above. Additives used so far, 'Large portion contains sulfur, but 2-butyne-1,4-diol has been used to obtain the desired I conversion. In a preferred embodiment, the concentration of the bath is greater than or equal to about 20 = grams per liter. Saccharin is useful. In another preferred embodiment: 2-butyne · M_diol with a bath concentration greater than or equal to about 5 mg / L is useful. Although these physical properties are not Fully understood, but the general theory is that the newly deposited material has an imbalanced nanocrystalline structure. If additives are present, the concentration of the eight series is relatively low, and it is dispersed throughout the newly deposited coating. The coated material has a force of 0 heat for a period of time. Larger crystals are obtained through recombination] The additives will diffuse, and the main metals will be organized in a manner affected by the molecules of the additives. They may become crystals that directly attract the additives, may become crystal grains that conform to the additives, or may be This kind of structure has not been known so far. Further heat treatment will lead to different organizations, and its paper size applies the Chinese National Standard (CNS) A4 specification (21〇x2 = Jj · ------ • "-* ---- (Please read the notes on the back before filling this page)

1T printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 473562 A7 V. Description of the Invention (28) Matrix materials will be organized into a large structure in the printing of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. ^ Collected to separate the precipitate from the main metal. It is a structure caused by traditional tempering (it usually also does not include the additives of the present invention). It is not difficult to determine the amount of additives that can be used and the heat treatment conditions that can be used. Although it is possible to predict the diffusion rate of the matrix metal system by the additives selected by the study, a few experiments will outline the main parameters very quickly. The temperature range at which moderate heat treatment is most likely to occur can be selected by applying the desired metal system to an appropriate substrate and then performing DSC as described above. The transfer temperature can be easily identified, and this tone is a good starting point for subsequent experiments. For this initial experiment, the amount of additive was not important, as the additive had little or no effect on this. @ The usable additive dosage can be confirmed by preparing test products, using different amounts of additives, such as 2.5%, 1%, 〇1%, and 〇01%, based on Mohr, and then lying on or close to Heat treatment at the temperature confirmed by the text: After a short time, such as 5, 10 or 20 minutes. The resulting heat-treated product, <tensile strength, shows that the conditions achieve the desired mechanical properties. In particular, the test structure is a traditional dog bone structure suitable for testing in a conventional tensile strength testing machine. Alternatively, the money-covered wire will provide useful tension information. Using the initial information about the effective amount of the additive, different time and temperature conditions can be evaluated to quickly discriminate-conditions that the group can use. = In terms of the added dose, under different heat treatments, the reduction stress p increases to the maximum 値, but then decreases. —In general, the maximum stress of surrender will be found at the relative financial belt where the material is reduced (Ping and Wen do not include additives ------;-* ---- (Please read the notes on the back before filling (This page)

, 1T

473562 Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of Invention (29) Degree). At this point, the desired extensional properties may not be obtained. Generally speaking, heat treatment beyond this point of maximum yield stress will increase ductility, while a moderate increase in heat treatment will result in a fitting with a maximum yield stress and the desired amount of elongation. Continued heat treatment will eventually reduce the yield stress, usually reducing the resilience of the treated coating. This continuous heat treatment will generally increase ductility. Confirm the heat treatment conditions to give the required degree of yield stress and the required degree of ductility in a specific coating system, subject to the restrictions of the coating system, which are well within the technical park of this technology. Those skilled in the art can use the principles of experimental design to relatively easily identify key ingredients and data. This area is already a subject of considerable academic interest. For example, in the library of the University of California, Berkeley, in September 1997, about 287 references were listed in the e-card catalogue regarding experimental design. See www.lib.berkeley.edu, or especially www.lib.berkeley.edu/ENG/about.html. In particular, factorial experimental designs or fractional factorial studies may be useful. The Berkeley Collection lists approximately fourteen related references. Those who are particularly interested may be the basic reference materials. "Introduction to Statistics, Design, Data Analysis, and Model Building Used by Experimenters, George EP Box, Wiley, New York (1978), and" Empirical Model Building and Response Surfaces' George EP Box and Norman R. Draper, Wiley, New York (1987) o Examples of Resilience Contact Structures Specific Examples Representative specific examples of substrate structures suitable for heat treatment have been accompanied by Figures 2A-2C And Figures 3A-3C are described above. The heat treatment method of the present invention can be -32- This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm) ------, ---- (please first Read the notes on the back and fill in this page), 1473 printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, 473562 A7 -------------- _______ 5. Description of the invention (30) and other resilient contact forming objects—from Uses, in particular the shaped articles of the subject of two other US (and corresponding PCT and other foreign) applications. It may help to consider these examples in some detail.

For the purpose of implementing the present invention, the materials listed above along with FIGS. 2A_2C and 3A_3C are particularly good when manufacturing the resilient contact structures described in these specific embodiments. An application was filed on May 6, 1997, and the co-pending U.S. patent application 08 / 852,152, jointly held, entitled "Microelectronic Spring Contact Member", discloses a useful product, and manufactures similar to the above Discuss methods of building blocks. Its corresponding PCT application was announced on September 20, 1997 as WO 97/43654. The materials as described above can be used in the method of manufacturing the product of application 08 / 852,152, and can be further heat treated to produce superior contact components as disclosed herein. Generally, 1: aligns many shielding layers with openings in them, and injects a layer of conductive material. Then, masses of conductive material can be formed (or deposited) in the inoculated openings, such as by electroplating (or, sputtering, electroless plating, etc.). After the shielding layer is removed, the mass can act as an unsupported resilient contact structure, which can not only extend vertically on the component surface, but can also extend laterally from the loading position. In this way, the contact structure can be easily designed to be compliant on the 2_axis <and on the x_y plane (parallel to the surface of the component: both. Now, it will be more detailed for FIG. 9C (WO 97 / 43654 discloses the content of Figures 1A_1C). Recall that this contact member is resilient, so the "compliance m (adjustment of deformation) will vary with the amount of displacement from the placement position and the elastic constant of the contact member (recovery The scale of this paper is applicable to the Chinese National Standards (CNS) Eighty-fourth Secret (210 x 297 meals) --------- 衿 一 --- (Please read the precautions on the back before filling this page),? Τ Reply Force). The small displacement system is resisted by a relatively small restoring force, but the larger displacement system is resisted by a larger restoring force. Figure 9A illustrates the manufacture of multiple unsupported rebound springs (springs) on the substrate 902. An example of a technology of a point member. The substrate 902 may be an active electronic component, including a semiconductor device, and in particular a semiconductor device (not shown) placed on a semiconductor wafer. The substrate 902 has a plurality of (shown) One of the multiple) area 912 on its surface, can make bombs on its towel Spring contact member. In a preferred embodiment, the substrate 902 is an electronic component, such as a semiconductor device, and the region 912 is the end of the electronic component (such as a bonding pad). In another preferred embodiment, By changing the path, the main end is connected to a conductive material, such as a metal trajectory, and at a different position on the electronic component to the remote end field. Various types of road control changes are used in this technology. It is clear. For a preliminary discussion of the general technology of the present invention and the changing path, please refer to the PCT application PCT / US95 / 14885, published as WO% / 15459 on May 23, 1996. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs This rerouting function can be used to mark a group of ends from the first array to the second array. A useful method of relabeling is to reroute the Zhouyuan bonding pad array to an area array. Another A useful re-marking method is to change the path of the central wire bonding pad array to an area array. The effect of changing the path is usually to make the electrical contacts The following methods provide great flexibility. The following methods can be used to build a contact member on the main end, and equally well to build a contact member on a remote end. Generally speaking, the technique of making the product 900 involves applying a lot (show (3) Patterned masking layers 904, 906, and 908 with openings on the surface of the substrate _____- ru -___ This paper size is suitable for wealth® Sjia County (CNS) A4 size (210X297 mm) Central standard of the Ministry of Economy Printed by the Bureau ’s Consumer Cooperatives. V. Invention Description (32). These layers are patterned to have openings aligned with area 912 (as shown), and these openings are cut to size and shaped, so The openings in one layer (for example, 906) are further extended from the area 912 than the openings in the lower layer (for example, 90 °, 904). In other words, the first layer 904 has an opening directly above the region 912. A part of the openings in the second layer 906 is aligned to cover at least a part of the openings in the first layer 904, and vice versa, a portion of the first layer 904 extends on the second layer. A part of 906 is opened in a square. Similarly, a portion of the openings in the third layer 908 is aligned over at least a portion of the openings in the second layer 906, and vice versa, a portion of the second layer 906 extends in the first One of the three layers 908 is under the opening. The bottom of the L specific overall openings, Shao Shaofen, directly covers the selected area 912, and its top portion is raised and deviates laterally from its bottom portion. As will be discussed in more detail below, the The conductive metal material is deposited, opened in the holes, and the shielding layer is removed, resulting in a ', and support contact structure that has been made directly on the substrate. Its bottom end is fixed to the substrate at area 912, and its The free end extends on the surface of the substrate and is laterally displaced from the region 912. If necessary, such as for electroplating, a layer of conductive material 914 (e.g. 4500 angstroms) &quot; seed &quot; layer, such as titanium / tungsten, can be deposited into the openings. After that, agglomerates of conductive metal material (such as nickel) 92 can be deposited into the openings by electroplating. Metal deposits of about α to 10 mils, preferably about mils, and more preferably about 1 to 3 mils, are particularly preferred. One characteristic is nickel. &quot; Figure culprit and 9C are spring contact members formed with descriptions, the bottom end of which is similar to this paper, and is used in the standard (CNS) A4 specification (21G ^^ ----- ^-i ---- (Please read the notes on the back before filling this page)

, 1T 473562

The adjacent area 912 of the printing department of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, and its free end (top end) 924 is in the z-axis on the surface of the substrate 902, and on the χ_ and y_ axes. Sideways off the bottom. As best seen in FIG. 9C, the contact member 920 will respond to the pressure applied in the Z-axis at its top 924, as indicated by the front 924, For example, due to a temporary pressure electrical connection to the end (not shown) of another electronic component (not shown). Compliance in the z-axis is to ensure that the contact force (pressure) will be maintained and to accommodate non-planarity (if any) between the ends (not shown) of the second paired electronic component (not shown). Such temporary electrical connections can be used to make temporary or even long-term connections to the electronic component 902. The top end 924 also moves freely in the X- and y_ directions, as shown by the arrows 936 and 934, respectively. It is important that the top end 924 is joined (by soldering or brazing, or using a conductive adhesive) to the end (not shown) of another electronic component (not shown), which has Coefficient of thermal expansion different from the substrate (component) 902. This kind of permanent electrical connection can be used for the assembly of electronic components, such as multiple memory chips (each represented by a substrate 902) to another electronic component, such as an interconnect substrate, such as a printed circuit board (&quot; pcB "; (Shown). With the proper selection of materials and geometries, these fabricated masses 92 can be used as unsupported resilient contact structures, which have been made to have extremely precise dimensions and polarities between each other. Precisely spaced. For example, "ten or thousands of such spring contact members (920) are easily and precisely made on a semiconductor device with a corresponding number of ends, and the semiconductor device" Paper size applies Chinese National Standard (CNS) A4 specification (2 丨 〇 &gt; &lt; 297 mm)

From a very general perspective, the patterned openings in the masking material constitute a shaped object in which the material can be deposited and then heat treated later. For electric boat purposes, the seed layer is preferably deposited as described above. This seed layer can also be thought of as a shaped article on which material can be deposited and then heat treated later. The material can be deposited directly into the openings by some other methods, such as through cap sputtering, or other deposition methods, much like those described for the seed layer, but using materials suitable for subsequent heat treatment, and depositing this material to be used for Create useful structure thickness. Here again, the openings in the shielding material form a shaped object that defines the shape of the resulting structure to a significant degree. The second enumerated specific embodiment of the raw contact structure. The method described above with reference to FIGS. 9A-9C uses three layers (904, 906, 908) of masking material, which must be patterned and coated on each other. As a result, a multilayer trench is formed, in which material 920 can be deposited. The Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs has printed a comparable contact structure, which can be made with fewer layers of shielding material (such as photoresist). As mentioned previously, this is particularly useful for microelectronic applications. Figure 10A-10L illustrates a specific embodiment of the technology of the present invention. These figures and accompanying descriptions are taken from the co-pending, jointly-owned US patent application serial number 09 / 032,473, which was filed on February 26, 1998, and its title is "Define Microelectronic Connections with Lithographs" Point structure ", see also the corresponding PCT application PCT / US98 / 09999 filed on May 14, 1998. FIG. 10A shows an example electronic component on which multiple contact structures can be fabricated. In the main content below, the manufacture of a single contact structure (1060) will be described as an example of manufacturing multiple such contact structures, preferably all 473562 printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. Preparation A7 B7 V. Description of the invention (35) Simultaneously on the same electronic component or substrate. Typically, the contact structures manufactured on a single component will be substantially the same as each other (meaning size, shape, etc.), but using techniques known in the art, the size and shape of each contact structure can be individually Control, and the designer decides on the requirements of the specific application. In this preferred embodiment, the electronic component is a semiconductor device, which includes a silicon substrate 1002 and a passivation layer 1004 (for example, polyimide, about 4 microns thick), which is configured on the surface of the silicon substrate 1002, And a plurality of (one of the plurality shown) openings 1006 extend through the passivation layer 1004 to the metal contact pad 1008. Typically, there are multiple such contact pads on an electronic component. In previous techniques, within a complete assembly, each contact pad was typically connected (eg, as with a bonded wire) to a corresponding contact pad on another electronic component (not shown), which another Electronic components such as leadframes, and eventually thin and small profile packages (TSOP). Here, as shown in FIG. 10A, in the first step of this method, a conductive layer 1010 is deposited. The conductive layer 1010 is, for example, titanium-tungsten (Ti-W), which can be deposited to a thickness of about 3000-6000 A (Angstroms) by sputtering, for example, to a thickness of about 4500 A. The conductive layer 1010 substantially conforms to and adjoins the surface of the passivation layer 1004, the side wall of the opening 1006 and the exposed surface of the metal contact pad 1008 (within the opening 1006). The conductive layer 1010 is preferably conductive, and if it is deposited as a continuous "coating" layer, an electrical short will be formed with all the contact pads (1008) of the electronic component. As will be understood from the description below This kind of short-circuiting feature of the conductive layer 1010 can be advantageously used to establish an appropriate potential for the power supply decompression process (such as electroplating) to make contacts on electronic components. _-2ft-_ This paper size is applicable to China Standard (CNS) A4 specification (210X297 mm) (Please read the notes on the back before filling this page) 473562 A7 B7 V. Description of the invention (36) Structure. In a preferred embodiment, the conductive layer 1010 has The pattern is not continuous and can be deposited as multiple non-contiguous areas. In another preferred embodiment, the conductive layer 1010 covers the exposed surface of the end 1008. In an alternative embodiment, the conductive layer 1010 only covers Part of the terminal 1008. In another alternative embodiment, the conductive layer 1010 does not cover the terminal 1008 at all, but is close to the terminal 1008 so that when the seed layer 1050 is applied, it is connected to the conductive layer 1010. In a preferred embodiment, a second conductive layer of another material (such as gold) can be deposited and patterned on the conductive layer 1010. This can be used, for example, to achieve local interconnects, and signal slave connections. The spot gasket 1008 changes the path to the contact structure (1060). In general, the double layer may be better for many applications. The choice of appropriate materials is within the technical scope of this skill. The Central Consumers Bureau of the Ministry of Economic Affairs Consumer Cooperatives Printed (Please read the precautions on the back before filling this page) In a preferred embodiment, the contact pad (1008) is on the surface of the substrate (1002), or on the surface of the substrate itself ( (Exposed), but without a passivation layer (1004), but the passivation layer is usually present on the semiconductor device. Before the conductive layer 1010 is deposited, the passivation layer 1004 (if one exists) may be roughened as appropriate. To enhance the adhesion of the conductive layer 1010 to the passivation layer 1004. This can be achieved simply by exposing the electronic component to an oxygen (02) plasma, using appropriate parameters (which can be easily determined by the skilled person) In The desired surface structure is obtained on the passivation layer. The choice of material will also affect the adhesion of the seed layer to the passivation layer. For example, known as Ti-W or copper, it will adhere well to Polyurethane As shown in Figure 10B, in the next step of this method, a layer is covered. _-39-_ This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) 473562 A7 B7 Central Ministry of Economic Affairs Printed by the Consumer Bureau of the Standards Bureau. 5. Description of the invention (37) A masking material (such as photoresist) 1020 is deposited on the surface of the component 1002 (that is, onto the conductive layer 1010) and patterned (for example, using conventional light lithography). Technique) to join the opening 1022 and extend completely through the shielding layer 1020. The opening 1022 may be located at a position covering the opening 1006 in the passivation layer 1004 (as shown), or may be located far away from the hole 1006, and thus away from the contact pad 1008. As described above, and as described in more detail in the disclosure of reference 09 / 032,473, by positioning the opening 1022 away from the contact pad 1008, multiple contact structures can be fabricated on the electronic component, which The layout is different from that of the contact pads of electronic components. A particularly good form is to locate the openings 1022, so the contact structure established thereon will have a tip in an area array equivalent to a typical ball grid array. The openings can be connected to contact pads on the electronic component, arranged as, for example, surrounding pads. A contact structure that is substantially the same as a contact pad without displacement can be advantageously manufactured. In this case, it is useful to position the openings 1022 in an area array corresponding to the tip array of the last contact structure. Each opening 1022 preferably has a larger area than the area of the opening 1006 above the contact pad 1008. For example, a square contact pad 1008 with a size of 4 mils x 4 mils (meaning 100 micrometers x 100 micrometers) has a square opening 1022 with an exposed area of 10,000 square micrometers and a size of 200 micrometers x 200 micrometers. It has an area of 40,000 (four times the exposed area of the contact pad 1008). A circular opening 1022 having a diameter of 200 micrometers has an area of 31,400 square micrometers (approximately three times the exposed area of the contact cymbal 1008). Generally speaking, the opening is preferably an area exposing a terminal and / or substrate between about 10,000 and about 40,000 square microns, and most preferably more than about 30,000 square microns. Although the following is not this issue-=-40-_ This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling this page) 473562 A7 Central Bureau of Standards, Ministry of Economic Affairs Printed by employee consumer cooperatives B7 V. Main features of the invention description (38), but as a general proposal, the foot area (bottom area) of the contact structure should provide enough area for mechanical fixing (adhesion) of the contact structure to Electronic components. With regard to the opening 1022, it is preferably a push-out shape, and the size at the bottom of the push-out opening is, for a square opening, a spectrum of 200 microns by 200 microns, or for a circular opening, It is 200 microns in diameter. In applications where space is limited and such dimensions are not possible, the available space can be used. For example, when processing an electronic component having a 100 micron x 100 micron spacer on a 125 micron center, the opening 1022 may have dimensions of approximately 105 micron x 105 micron, 110 micron x 110 micron, etc., including non-square dimensions. Alternatively, in applications where space is limited, the bottom of the contact structure can be located away from the pads with which it is electrically connected, and has a larger (eg, 200 micron) preferred size. The push-shaped (inclined) area of the opening 1022 is designated as reference number 1023 in FIG. 10B. The shielding layer 1020 is preferably deposited to a thickness of at least about 50 microns, or to a thickness of at least about 100 microns, at least about 150 microns, and at least about 200 microns. The shielding layer 1020 may be deposited in multiple layers. What will determine the distance between the main part of the contact structure and the surface of the electronic component is mainly the overall thickness of the shielding layer 1020. Note the offset distance &quot; d2 &quot; between the main body portion 1066 and the base portion 1062 of the spring contact member 1060 shown in FIG. 10L. The side wall (side wall) of the opening 1022 is preferably push-shaped, so the opening may be larger at the surface of the shielding layer 1020 than at the conductive layer 1010. This is called &quot; positive &quot; push. No push will result in a steep side wall with a 90 ° angle. The open side wall preferably has an average push angle of about 60-75 °. This can easily use photoresist for shielding The material of layer 1020 is achieved by baking the photoresist and reflowing it. _-41 -_ This paper size applies to China National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back first (Fill in this page again) 473562 A7 Printed B7 by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (39) The person who is most familiar with the relevant arts of the present invention, understands the explanation provided in the disclosure of reference material 09 / 032,473 Later, you will immediately learn how to control the push-out of the side wall. Push-out openings can be formed in any suitable way and can be stepped, in fact, like an inverted stepped truncated pyramid. Control the openings in the shielding layer (1020) ( The shape of 1022) is discussed in more detail in the disclosure of 09 / 032,473. Figure 10C is a top plan view of the electronic component of Figure 10B, showing two openings 1022a and 1022b in the shielding layer 1020. Contact pad 1008a and 1008b (shown in dashed lines) are combined. The push-out areas of the openings 1022a and 1022b are individually referenced in this figure with reference numerals 1023a and 1023b as shown in FIG. 10D. In this method, In the next step, for each selected one of the plurality of openings 1022, a protruding feature 1030 may be deposited on the surface of the shielding layer 1020, the center of which is at a distance "L" from the center of the opening 1022. As will be understood, this feature 1030 will define the contact end (top) (1064) of the formed contact structure (1060) formed on the electronic component, and the distance &quot; L "means that it is made on the electronic component The linear distance between the base (1062) and the top (1064) of the contact structure (1060). The protruding feature 1030 may be a "dot" or "lump" of the material, for example, showing a flattened hemisphere. Useful and preferred features include a small amount of epoxy photoresist or the like, which can be suitably applied through a template or using conventional screen printing techniques. The protruding feature 1030 may also be a conductive material. Appropriate dimensions of the prominent features 1030 in the form of flattened hemispherical dots are about 5-15 mils (125-375 microns) in diameter and about 2 mils (50 microns) in height. In a preferred embodiment, this prominent feature can be eliminated. (_-42- This paper size applies to the Chinese National Standard (CNS) A4 specification (210 × 297 mm). (Please read the precautions on the back before filling in this page. ) Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 4/3562 V. Description of the invention (40, for example, less than about 5 mils wide), 炱 钤 慎 恋 Ｍ 丨 』丄 λ In another specific embodiment, it may It is wider (for example, greater than about 1S mil wide). For the punishment, its degree is preferably within the range of about 2 to 7.5 mils. As far as the earthen road is concerned, it is revealed in more detail in 09 / 032,473 The prominent features used in the content, in a broader sense, can be formed in different shapes, including various shapes of the heart, including ") spherical, and pyramidal, conical, or semi-circular. ® Conical or semi-circular , And cross-shaped generally familiar with this artist, after understanding what is described and explained in this article, he will immediately understand how to apply and control the shape of the prominent feature 1030. And template (not shown) to produce a prominent feature 'σ, using photoresist H, n to characterize 1030, where the template is at If appropriate, the photoresist can be soft-baked to release the prominent features from the template, and then the template is removed for hard baking. At the bottom (ship) and top (delete) of the formed microelectronic spring contact structure The distance, L ", may be, for example, in the range of about 10-face mils, and preferably in the range of about 10-50 mils. As shown in tf in FIG. 10E, in the step below this method, a template (shadow cover) 1040 can be arranged on the surface of the shielding layer 1020. The template 1040 has a plurality of openings 1042 (one of which is shown). As shown, the opening 1042 extends from the opening 1022 to the corresponding protruding feature 1030. The template 1040 may suitably be a thin (e.g., about 2 mil (50 microns) thick) stainless steel foil, which may be perforated or etched to have an opening 1042. The template 1040 can be any suitable material having any suitable thickness that will allow the seed layer 1050 to be deposited on the shielding material 1020 'to have a conductive trace pattern corresponding to the shape of the opening 1042. -43 Applicable to China Paper Standard (CNS) M specifications (2 丨 οχ297 mm) for each paper size H · ——-IJ I-1J-I (Please read the precautions on the back before filling this page) Order 473562 A7 B7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (41) Using a template 1040 placed on the surface of the shielding layer 1020, a "seed" layer 1050 is deposited on the shielding layer 1020 and The protruding features 1030 are on the exposed surface. The seed layer 1050 is deposited in the exposed portion of the opening 1022 and on the surface of the conductive layer 1010 in the opening 1022. The seed layer 1050 has an inclined region 1053, which is deposited on the inclined region 1023 of the opening 1022 in the shielding material 1020. An alternative embodiment of such a 1050 seed layer is deposited by screen printing conductive ink. Suitable conductive inks include face inks or graphite inks. Such materials and methods are used in the manufacture of printed circuit boards and are well known in the art. This seed layer can be thought of as a shaped object on which material is later deposited to form the structure of the present invention. From another perspective, this patterned seed layer is an elongated component that can be coated to form the structure of the present invention. From yet another perspective view, the surface of the shielding material 1020 and the opening 1022 is a shaped object, which is suitable for direct deposition by a method such as sputtered bulk material, which is suitable for the heat treatment of the present invention. This deposition can be appropriately masked and patterned by deposition. The seed layer 1050 can be deposited into a pattern with many "tracks", each of which is a physical writing of a pattern of holes 1042 in the overlying template 1040. The seed layer 1050, after being patterned, acts as a precursor to the contact structure to be fabricated on the electronic component. For example, in the electroplating method, each of the conductive trajectories of the seed layer 1050 will be charged as an electrical formation, so that a substance (lump) of the contact structure (1060) can be manufactured thereon. The selection of the masking material 1020 and the method of depositing the seed layer 1050 must be _-44- This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) € robe. Order 473562 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (42) Consider together. The shielding material must be stable in the environment of the deposition method. For example, a typical positive type photoresist material contains a solvent and can be degassed in a high airspace state. In this case, it is preferable to modify the material ', for example, by baking or exposing it to light to crosslink or otherwise harden the shielding material. Polyimide is a usable shielding material and will tolerate lasing environments without significant degradation. Deposition can also be performed by chemical vapor deposition (CVD) or electron beam methods. These methods require less airspace than sputtering. For these methods, conventional novolak photoresist resins can be used, and some moderate crosslinking may be used. Another consideration is that any modification of the masking material to make it stable in the air may make it more difficult to remove it later in this method. Appropriate materials and methods can be selected by those skilled in the art. A particularly good method is to use a novolac photoresist, pattern it as described above, and then cross-link it by heating it. The seed layer 1050 is deposited using CVD. FIG. 10F illustrates the results of the steps described in FIG. 10E in a top view, and shows two openings 1042a and 1042b. In the template 1040, each of the openings 1042a and 1042b is taken from two contact pads 1008a and 1008b (using (Shown in dashed lines) above the combined one, extending to the selected one of the two prominent features 1030a and 1030b (shown in dashed lines). Figure 10F also illustrates the two patterned trajectories 1050a and 1050b of the seed layer that have been individually deposited through the openings 1042a and 1042b in the template 1040. For the sake of clarity, the trajectories 1050a and 1050b are shown by a hatched net, but it should be clear that the hatched shadows do not represent a cross section in this figure. The trajectories 1050a and 1050b shown in FIG. 10F each have a bottom end 1052a -45- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -.-----τι-I (please first Read the notes on the back and fill in this page) Order 473562 Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 5. Invention Description (43) and 1052b, Top 1054a and 1054b, and Central Body Parts 1056a and 1056b are individual Corresponding to the bottom end (1062), the top end (1064) and the main body (1066) of the contact structure (1060), it will be established on the conductive tracks 1050a and 105b. The sloped areas 1053a and 1053b of the tracks 1050a and 1050b are shown individually in this figure. Figure 10G illustrates the next step of this method, in which the shadow cover 1040 has been removed, and by, for example, plating (such as plating) , A plurality of (one of the plurality is shown) contact structures 1060 are established, and a plurality of (one of the plurality is shown) tracks 1030 are used as a mass of conductive material. Each contact structure 1060 has a bottom portion 1062 (compared to 302 in FIG. 3B), a top portion 1064 (compared to 304 in FIG. 3B), and a main body portion 1066 (compared to 306 in FIG. 3B) at the bottom end The portion 1062 extends between the top portion 1064. As shown, the contact structure 1060 has an inclined region 1063 between its bottom end 1062 and its main portion 1066. The inclined region 1063 is established on the inclined region 1053 of the seed layer 1050, which is sequentially established on the shielding material 1020 On the inclined area 1023 of the opening 1022 in the middle. 10H is a cross-sectional view taken on the line 10H-10H of the electronic component of FIG. 10G, illustrating a cross-section (cross-section) of a contact structure (1060) made according to a preferred embodiment of the present invention. This section is roughly semi-circular or mushroom-shaped. This section obtained through the main body portion 1066 is a representative example of the section of the contact structure over the entire length. This structure is the result of electroplating on an exposed seed layer, and most of the seed layer is approximately planar. Referring to FIG. 10G (see also FIG. 10L), the overall height “H” of the contact structure 1060 is formed, in other words, the height of the top 1064 from the surface of the substrate 1002 _-4fi-_ This paper standard applies Chinese national standards ( CNS) A4 specification (210X 297 mm) ------:-*-clothing-(Please read the precautions on the back before filling out this page) Order 473562 A7 B7 Staff Consumer Cooperatives, Central Standards Bureau, Ministry of Economic Affairs Printed 5. Description of the invention (44, preferably at least about 4.0 mils, and may be about 80 mils or larger. Referring to FIG. 10H, the thickness of the main portion 1066 &quot; t &quot;, in other words, is in orbit The thickness of the mass of conductive material on the trace 1050 is preferably at least about 0.05 mils, and may be about 1.5 mils or more. Referring to FIG. 10 (a), the width of the main part &quot; w &quot;, in other words, For the width &quot; w &quot; of the mass of conductive material on track 1050, it is preferably at least about 0 mils, and may be about 4.0 mils or more. In a preferred embodiment, Keep the width approximately constant along the main body portion. In a particularly preferred embodiment, the main P sting is push-like in width. For example, it is wider from the main part 1066 near the bottom end 1064 to the top near the anvil and narrower. As mentioned above, at the bottom end of the microelectric pre-contact structure (1060) formed ( ι〇62) and the top (the length between the full sentences) is at least about mil, and can be up to about 50 mils or larger, or even much larger. Since very general When viewed from a perspective view, the openings in the masking material have a pattern of 'system composition-a shaped article' in which the material can be deposited and then heat treated later. For electroplating purposes, it is preferred to deposit the seeds as described above This seed layer can also be considered as a shaped object, on which material can be deposited and then heat treated later. This material can be deposited directly into the opening by some other method, such as through a cover Injection or other deposition methods, much like those described for the seed layer, but use materials suitable for subsequent heat treatment and deposit ^ materials to a thickness that can be used to make useful structures. Here again, in the opaque material (open A hole that forms a shaped object that defines the structure that is finally formed The shape has reached a significant level. The general requirements for the design of the spring shape are the Chinese National Standard (CNS) for a paper rule in this technique ---- ------.-- J ---- (Please read the notes on the back before filling out this page) Order 473562 Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (45) It is generally known. For example, the size, bending moment, and shape allow Details such as flexibility in dimensions can be selected by the designer and implemented in accordance with the statements of the present invention. A particularly good shape is a nearly circular cross-section with a push-like inner and outer radius of curvature. This shape is shown in Fig. 11 (Fig. 7 of the disclosure of reference material 09 / 32,473). Figures 101 and 10J are perspective views of two of the many possible forms of the contact structure 1060 of Figure 10G. For clarity, they are separated from the module 1000. These figures illustrate two important variations that can be selected using the present invention. In FIG. 101, the contact structure has a square bottom end 1062. In FIG. 10J, the contact structure has a circular (ring-shaped) bottom end 1062. In these two figures, the funnel shape of the bottom end in the inclined region 1063 is easy to understand, and the shape has been given to the bottom end by the inclined side wall (1023) of the opening 1022 in the shielding layer 1020. In Figure 10J, the sloped area 1063 of the bottom end 1062 is completely covered (360 °), and the small "lip" is extended around the entire bottom end. This complete funnel shape is easy to obtain using the template 1040, which allows shadowing along A seed layer is deposited on all sidewalls and a portion of the surface of layer 1020. Figure 101 shows the result of depositing a seed layer on only a portion of the sidewalls of the opening 1022. This can easily be used to cover a portion of the openings 1022 The template is obtained, as shown in FIG. 10E. More or less sidewalls can be covered according to the selected cover and deposition conditions. This can include only one part of the sidewall, the entire sidewall, as shown in FIG. 101 , More than one part of the side wall (the preferred embodiment), or all the side wall areas, as shown in FIG. 10J, to form a complete funnel (the best embodiment). The structure formed after plating, It is shown in cross-section in Figure 10G. If the base is square, the perspective view of Figure 10G can be similar to the view shown in Figure 101. _-48- This paper size applies Chinese National Standard (CNS) A4 specifications (2 丨0X297 mm) ------.-- ^ ---- (Please read first Note on the back, please fill in this page again.) Order printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 473562 A7 B7 V. Description of the invention (46) For the sake of convenience, the top plan views 10F and 10K show the specific embodiment of the complete funnel, instead of the figure 10E '10G and 10L detailed cross-section specific embodiment of the funnel. Those skilled in the art will understand that Figures 10F and 10K can be slightly modified? The text corresponds to the specific embodiments of Figures 10E, 10G and 10L. The structure is similar to a part of the funnel shown in Figure 101, with a circular base as shown in Figure 10J. Figure 10K is a top plan view of the electronic component of Figure 10G, illustrating two of the multiple contact structures 1060a and 1060b Each of the contact structures 1060a and 1060b is combined with one of two contact pads 1008a and 1008b (shown in dotted lines). The contact structures 1060a and 1060b each have individual bottom ends 1062a and 1062b, and the top ends 1064a and 1064a 1064b, and the central body portions 1066a and 1066b. The sloped areas 1063a and 1063b of the contact structures 1060a and 1060b are shown individually in this figure. As can be seen in Figure 10K, the formed contact structure is properly The ground push (width direction) is individually wider at the bottom ends 1062a and 1062b, and narrower at the top ends 1064a and 1064b, which are equivalent to the pushes explained and described in the 08 / 852,152 application mentioned above. For the sake of clarity, the contact structures 1060a and 1060b are represented by double shadows, but it should be clearly understood that the shadows made by this double shadow are not horizontal. section. As can be understood from the description of FIG. 10G, the bottom portion 1062, and thus the entire contact structure 1060, is electrically connected to the contact pad 1008 of the electronic component via the seed layer 1050 and the conductive layer 1010. Combiner. As can also be understood from the explanations provided above, a group of contact pads 1008 of an electronic component can be short-circuited to each other by the conductive layer 1010 to help the electroplating party. Standard (CNS) A4 specification (210X297 mm) (Please read the notes on the back before filling this page) '? Τ 473562 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (47) Law establishment Contact structure 1060. In the final processing step of this method, the masking layer 1020 can be removed, for example, it can be washed away with a suitable solvent. For example, the photoresist shielding layer 1020 can be selectively washed away with acetone without adversely affecting the other components described above. And finally, all parts of the conductive layer 1010 that are not covered by another material (that is, covered by the seed layer 1050) can be selectively etched using appropriate chemicals. Figures 10L and 10M are shown in cross section and perspective individually. The figure illustrates the final product of the unsupported contact structure 1060, which is connected to the electronic component at its bottom end 1062, its main body portion 1066 is located on the surface away from the electronic component 1002, and its top portion 1064 has a surface shape from the main body Part of the 1066 hierarchy extends further. The sloped area 1063 of the bottom end 1062 of the formed contact structure 1060 can be clearly seen in these figures, as well as in FIGS. 10N and 100 described below. In essence, for each contact structure 1060, an elongated mass of conductive material is deposited on the shielding material to have a bottom end 1062, a top end 1064 opposite the bottom end, and a space between the bottom end 1062 and the top end 1064. The main part 1066. In a preferred embodiment, the main body portion 1066 is on a plane, which is preferably approximately parallel to the surface of the substrate 1002, and is offset (in the z-axis) from the bottom end 1062. The top end 1064 is further deviated from the main body part 1066 due to the protruding feature 1030. When the shielding material 1020 is removed, the formed contact structure 1060 is unsupported and is fixed to the substrate 1002 by its bottom end 1062. The top end 1064 is free to connect with another electronic component (such as 1072 or 1082). , Individually described below) at the end (such as 1070 or 1080) of _-50- This paper size applies to China National Standard (CNS) A4 specifications (210X297 mm) (Please read the precautions on the back before filling this page) Order Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs -51-473562 V. Description of Invention (48) Touch. Example of the Third Array of Denier Structures A useful resilient contact structure can be made by other material deposition methods, especially direct deposition methods, such as sputtering, CVD, pv0, etc. f-In the alternative embodiment, the desired shape is defined by multiple members. Referring to Figures 10A to 10d, the openings are defined in the shielding material, and protruding members can also be added, as described in detail above. This will form a shaped object on which the deposit can be made by a direct deposition method. Material application can be controlled in a number of ways known in the art. The simplest specific embodiment may be the use of a cover, such as a template with an opening 1042, to limit where the material can be deposited, usually as described in the above-mentioned preparation of the seed layer 1050. &lt; Manshi. However, a suitable deposition material may be selected to allow the deposition of the initially formed deposit &apos; to a suitable thickness t for continuous heat treatment procedures, as detailed above. It should be noted that when thick films are sputtered, the final profile of the accessory will be affected by many variables known in the art. In general, the cross-section of a fully lasing accessory will differ from the cross-section of a plating accessory, as shown in Figure 10H. The actual profile will reflect the deposition conditions, including the directionality of the known% sequence. In the highly directional deposition method, the cross section is substantially rectangular. When the material is established at a substantially similar rate across the opening 1042 in the template 1040, and continues to accumulate with a substantially uniform width and approximately the same thickness, the sputtered accessory tends to have a rectangular cross-section. section. Collimation is a technique used to obtain highly oriented deposition methods. If the deposition method is not very directional, this deposition method is easy to obtain a more circular deposition. The paper size is applicable to China National Standards (CNS) Standard 4 (2 丨 〇 &gt; &lt; 297 mm) ----- ^ ------- (Please read the notes on the back before filling this page),? τ 473562 A7 B7 V. Description of the invention (49). These parameters are known in the art. Cross-section geometry can be reasonably and well predicted, and covers and methods can be selected or modified to obtain the appropriate cross-section. In the process of manufacturing the resilient contactor, the cross section of the accessory will impact the elastic behavior, so the cross section can be considered when designing the desired spring shape. The design of this spring is well within the technical park of mechanical engineering skills. Materials and Methods In a manner equivalent to the 08 / 852,152 application, the contact structure of the present invention is mainly preferably completely metallic, and can form (made) a multilayer structure. For the purpose of the heat treatment of the present invention, the alloys and additives detailed above are preferred. Suitable materials for various other components of this structure, including but not limited to: nickel, and its alloys; copper, iron, iron, and their alloys; gold (especially hard gold) and silver, both of which show superior transport current Ability and good contact resistivity characteristics; platinum group elements; precious metals; semi-precious metals and their alloys, especially palladium group elements and their alloys; and tungsten, molybdenum, and other refractory metals and their alloys. The use of nickel and nickel alloys is particularly preferred. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the notes on the back before filling this page) for deposition of conductive layers (such as 1010), seed layers (such as 1050) and contact structures (such as 1060) Suitable methods of materials include, but are not limited to: various methods involving deposition of materials from aqueous solutions; electrolytic plating; electroless plating; sputtering; chemical vapor deposition (CVD); physical vapor deposition (PVD); All the methods for depositing liquid or solid precursors caused by decomposition are generally known. Suitable materials for the conductive layer include titanium-tungsten (Ti-W), which can be deposited by sputtering to a thickness of 3000-6000 A, such as a thickness of 4500 A. A choice but more than _-52- This paper size is applicable to Chinese National Standard (CNS) A4 specifications (210X297 mm) 473562 A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economy The conductive layer is a gold layer, which can be deposited to a thickness of 2500-4500 A, such as 3500 A. An important purpose of the conductive layer is to provide an electrical connection to the conductive tracks to achieve the purpose of depositing a clump of conductive material using an electroplating process, which will become a contact structure formed on the seed layer. However, in a preferred embodiment, the conductive layer is omitted. Another method, such as electroless plating, can be used to deposit clumps of conductive material that will become the contact structure formed. Yet another method, such as sputtering, can be used to deposit clumps of conductive material. The seed layer can be, for example, gold (Au), which can be deposited to a thickness of about 2500-4000 A by sputtering. In another preferred embodiment, the seed layer is copper (Cu), which can be deposited to a thickness of about 1000-3000 A by sputtering. Alternatively, the seed layer may be another suitable material on which agglomerates of the formed contact structures may be deposited. Such materials include aluminum, Ti-W, such as those mentioned for the conductive layer, palladium ink and graphite ink. It should be noted that the seed layer may be an elongated member in some forms. It should also be noted that other elongated members, such as silicon, can be used. Silicon in the form of a micro-cutting axis, as used in MEMS applications, is a useful example. Suitable materials for masking materials (such as 1020) include a variety of lithographic photoresists, varnishes, varnishes, and polyimines. Compliance and Resilience Figure 10N illustrates a situation where it is desired to make a pressure contact between the top 1064 of the contact structure 1060 and a contact pad 1070 of another electronic component 1072, such as a printed circuit board (PCB). connection. In this case, the contact point _-53-_ This paper size applies to China National Standard (CNS) A4 (210X297 mm) ----- L-^ ---- (Please read the note on the back first Please fill in this page again) Order 2 6 5 3 7 A7 B7 V. Description of the invention (51) The structure 1060 should respond elastically (that is, elastically, not plastically) on the "z-axis", which The z-axis is perpendicular (at ninety degrees) to the surface of the substrate 1002. The following is the case. For example, it is generally desirable to make a pluggable and easily removable connector between the substrate 1002 and the electronic component 1072. Figure 100 illustrates a situation where a more permanent connection is desired, such as the use of soft solder 1084 to connect the top 1064 of the contact structure 1060 to another electronic component 1082 (compare 1072) such as a printed circuit board (PCB). Contact pad 1080 (compare 1070). In this case, the contact structure 1060 should respond compliantly in the "X-axis" and / or "y-axis", the two axes being parallel to the substrate 1002 surface. This is the case where it is desirable to adjust the difference in coefficient of thermal expansion between the two electronic components. The contact structure (1060) can react to external forces by resiliently and / or compliantly deflecting on any or all of the X-, y-, and z-axes. The improved material properties due to heat treatment can be exploited to provide useful resilience on each axis. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the notes on the back before filling out this page) This resilient contact structure can be enhanced by adding other components. Co-pending US patent application serial number 08 / 819,464, entitled "Top Structure of Contacts for Microelectronic Interconnect Components and Manufacturing Method", and its corresponding PCT application serial number PCT / US97 / 08606, published on November 20, 1997 as WO 97/43653, describes a method for defining a top structure on a sacrificial substrate and transferring this structure to an electronic component. This top structure can be transferred to the structure of Fig. 10L using the technique described in the application. A general description of the device and method utilizing the present invention and the preferred embodiments of the present invention has been presented above. Those skilled in this art will understand and be able to implement many of the above aspects of the paper size applicable to the Chinese National Standard (CNS) A4 (210X297 mm) 473562 A7 B7 5. Description of the Invention (52) Changes, including variations that fall within the description of the invention. The spirit and scope of the present invention should be limited only by those set forth in the following patent application scope. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs _-55- This paper size applies to China National Standard (CNS) A4 (210X297 mm)

Claims (1)

1. A method of manufacturing a resilient structure, comprising the steps of: forming an elongated member having a base, (b) depositing a coating on the elongated member to obtain a coated elongated member, the coating comprising at least one metal With at least one additive, and (c) 'heat-treating the coated elongated member' at a temperature higher than the absorption peak transfer temperature of the coating by 0 and 50 ° to obtain a coating having improved material properties; wherein The substrate of the elongated member is attached to the contact pad of the electronic substrate before step (b) or after step (c). 2. A method of manufacturing a resilient structure, comprising the steps of: forming an elongated member having a base; and depositing a coating on the elongated member to obtain a coated elongated member, the coating comprising at least one metal and At least one additive, the metal comprising a metal selected from the group consisting of nickel and nickel, and at least one additive selected from the group consisting of saccharin and 2-butan-1,4-diol, and (C) above the absorption peak of the coating The heat treatment of the coated elongated member is performed at a temperature within a temperature range of 0 and 5 ° to increase the drop strength of the coating; wherein the substrate of the elongated member is attached to the electrode before step (i) or after step (c). Pre-contact pads on the substrate. 3. A method for manufacturing a resilient structure, comprising the steps of forming an elongated member with a base, (b) depositing a coating on the elongated member as a metastable coating to obtain the coated elongated member, The coating contains at least one metal and at least one paper size applicable to Chinese National Standard (CNS) A4 specifications (210X 297 mm) =: ,, Γ less—an additive can interact with the at least one metal, high :: coating absorption transfer temperature. And the temperature within: "the coated elongated member to turn in a metastable coating to obtain a stable coating. 4. A method of making a resilient structure, which includes forming a A slender member having a base, a coating is deposited on the slender member as a nanocrystalline material, and the coated (slender member, the coating contains at least one metal disc and at least one additive, and the at least one additive can interact with the Co-deposition of at least one metal, and 'heat-treating the coated elongated member at a temperature that is higher than the absorption peak transfer temperature of the coating between 0 and 15 ° to initiate transformation to obtain a coating comprising a crystalline material Wherein the base of the elongated member is attached to the contact pad of the electronic substrate before step (b) or after step ㈡. 5. If the method of the scope of patent application No. 丨, 2, 3 or 4 is applied, wherein the elongated member is The component includes a lead frame. 6. The method of claim 5 further includes an electronic component having a contact pad, wherein the lead frame is connected to the contact pad, and the electronic component may be Conductor devices, semiconductor packages, semiconductor wafers, electronic devices used to contact one or more semiconductor devices, electronic devices used to test one or more semiconductor devices, probe plugs, probes, connectors, inserts, or sleeves. 2- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ~ VJ B A8 B8 For example, the method of claim 1, 2, 3 or 4 includes sacrificial substrates. Wherein the elongated member includes a method according to item u, 3 or 4 of the scope of the patent application, wherein the elongated member includes a sacrificial substrate coated with a seed layer of material to promote plating. 9. The method according to item U, 3 or 4 of the scope of patent application, wherein the elongated member includes a metal skeleton. Wherein the coating layer is formed by applying electricity according to the method of item 1, 2, 3 or 4 in the scope of patent application. 11. The method of claim 1, 2, 3 or 4, wherein the method of depositing the coating is selected from the group consisting of electroplating of metals, chemical vapor deposition (CVD), physical vapor deposition (PVD), electrolysis or electroless Aqueous solution plating, and any method of material deposition by decomposition or reaction of gas, liquid or solid precursors. 12. The method of claim 1, 2, 3 or 4, wherein the coating is thick enough 'so that the heat-treated coating imparts resilience to the coated elongated member. 13. The method of claim 1, 3 or 4, wherein the at least one metal system comprises one selected from the group consisting of nickel, cobalt, iron, rhodium, palladium, tungsten, copper, chromium, titanium, aluminum, gold, and platinum. Of metal. 14. The method of claim 1, 3 or 4, wherein the at least one metal comprises a metal selected from the group consisting of nickel, cobalt and iron. 15. The method of claim 1, 2, 3 or 4, further comprising a coating having a material containing at least two metals selected from the group consisting of Ni-Co, Co-Mn, Ni -Mn, Pd-Au, Pd-Co, W-Co, Ti-N -3- _______ * This paper size applies to China National Standard (CNS) A4 specifications (210X297 public director) And Ti-w. 16. The method of claim 1, 2, 3 or *, wherein the coating comprises a Ni-Co alloy. I7. If the method of claim 1, 2, 3 or 4 is applied, the method further includes a coating having a material containing at least two metals selected from the group consisting of Ni-Co-Mn and Ni- WB. 18. The method according to claim 1, 2, 3 or 4, wherein the at least one additive is a relatively small component. 19. The method according to claim 1, 3, or 4 in which at least one of the at least one additive or a derivative thereof can be co-deposited with the at least one metal, and can be subjected to the at least one with moderate heat treatment Metals coexist in a 'structured coating structure' to provide an increase in the strength of the honeycomb elongated member. 20. The method of claim 1, 3 or 4, wherein the at least one additive comprises a sulfur-containing compound. 21. The method of claim 1, 3 or 4, wherein the at least one additive is selected from the group consisting of saccharin, tris-trans-acid ^ TSA), 2-butan-1, 4-diol and Thiourea 22. The method according to item 2 of the scope of patent application, which further comprises using a plating bath to deposit the coating, wherein at least one of the additives is saccharin, and the concentration in the plating bath is greater than or equal to 20 mg / liter . 23. The method according to item 2 of the patent application, further comprising using a plating bath to deposit the coating, wherein at least one of the additives is 2_butyne_4, diol, and its concentration in the plating bath Is greater than or equal to 5 mg / L. -4- i Paper size applies to Chinese National Standard (CNS) A4 (210X 297 mm)-473562 A8 B8 24. If the scope of the patent application is No. 丨, 2, 3, or a method selected from the group consisting of 4 items in the presence of a substance including NiCl, NiBr, and further including a type 1 whitening agent and a type 2 whitening agent 25. For example, if the scope of patent application is No. 23 or Gan Shima p ~ H Mawanwanfa, in which the coating system undergoes an exothermic transition on the exposed structure, from a less organized to a more organized ^ t: state, where The exothermic transition has a sharp temperature, and the heat treatment degree is between the peak temperature or or higher than 10 (rc. 26. For example, the scope of patent application i 2 3 or 4; Heat treatment; 刖 之 'The coating contains an amorphous material. 27. If the method of the scope of application for the patent No. 26, the layer causes a transformation, so that at least __ ordered materials. The heat treatment step will be in the coating part Amorphous material transforms into 28. After the method of claim 2, 2, 3 or 4, the coating comprises an ordered material. 29. If the method of the scope of patent application item 込 2, 3 or 4 is used before the step, the coating contains nanocrystalline material, which is in the heat treatment step and in the heat treatment step. Nanocrystalline material in a significant portion of the layer. The heat treatment step will cause the material to change into a crystalline material. In the hot place] 31_ If the method of claim No. 1,2, 3 or 4 is applied after the step, the coating contains a crystalline material. A 32. If the patent application No. I 2, 3 or 4 is applied 7 times, it has a further coating 4 'so that the coated slender member is connected to a larger one and includes a resilient electrical contact. ’° $ -5- Patent application scope A B c D 33. The method of claim 1 or item 21, further comprising removing all or part of the elongated member after the coating step and before or after the heat treatment step. 34. The method of claim i, 2, 3 or 4, wherein the elongated member comprises a material selected from the group consisting of gold, silicon, aluminum, copper and thorium-tungsten. 35. The method of claim 1, 2, 3 or 4 in which the coated elongated member has a higher yield strength after heat treatment than before heat treatment. 36. The method of claim 35, wherein the heat treatment is a combination of time and temperature to obtain a coated slender member having a drop-intensity close to the maximum value of the coating, so that it is significantly Heat treatment significantly reduces the yield strength deviation from this maximum. 37. The method of claim 2, 2, 3 or 4, wherein the coated elongated member is more resilient after heat treatment than before. 38. The method of claiming item Nos. 1,2, 3, or 4 of the patent scope, wherein the improved material properties of the coating are compared with the coating's down-strength before heat treatment, including the increased down-strength. 39. The method of claim 1, 2, 3 or 4 in which the scope of the patent application is applied, wherein the comparison of the improved material properties of the coating 'with the elastic modulus of the coating before heat treatment' includes an increased elastic modulus. 40_ The method according to item 1, 2, 3 or 4 of the scope of patent application, wherein the improved material properties of the coating are compared with the corresponding stability of the coating before heat treatment Increased stability. 41. The method of item 3 in the scope of patent application, in which the stable coating has a large size of -6-paper-size household materials (c Α visual grid (static mm)------ binding AS B8 Lowering strength of Ling Yawen coating. 42. The method of claim 3, wherein the stable coating has a modulus of elasticity greater than that of the metastable coating. 3. The method according to item 3 of Shen Qing's patent scope, wherein the stable coating and the bia coating are more resilient. 44. The method according to item 4 of the patent application, wherein the crystalline material has a lower strength than the microcrystalline material. 45. The method of claim 4 in which the crystalline material has a modulus of elasticity greater than that of the nanocrystalline material. 46. The method of claim 4 in which the crystalline material is more resilient than the nanocrystalline material. 47. A method of manufacturing a structure, comprising the steps of providing a base fitting, the fitting comprising a shaped material on which the first material can be deposited, and depositing the first material on the shaped material to obtain an initial shape The first material comprises at least one metal, and the heat treatment of the initially formed deposit is performed at a temperature higher than the absorption peak transfer temperature of the deposit within 0 and 150 t to obtain an improved ^ Heat treated shaped deposits based on material properties. 48. A method of manufacturing a structure, comprising the steps of providing a base fitting, the fitting comprising a shaped material on which a first material can be deposited, and depositing the first material on the shaped material to obtain an initially shaped deposit , The first material contains at least one metal and at least — this paper size applies Chinese National Standard (CNS) ^ iTiT〇X297 mm) 473562 A8 B8 C8 _________D8 6. The patent application scope of the additive, the metal is selected from the group consisting of nickel and cobalt, and the at least one additive is selected from the group consisting of saccharin and 2-butyne-fluorene, 4-diol, and above The coating absorbed peak transfer temperatures of 0 and 15 °. (; At an internal temperature, heat-treating the initially formed deposit to obtain a heat-treated formed deposit with improved material properties. 49. If the method according to item 48 of the patent application is applied, it further includes the use of a plating bath to deposit The first material, wherein the at least one additive is saccharin, and its concentration in the plating bath is greater than or equal to 20 mg / liter. 50. The method of claim 48, further comprising using plating Bath to deposit the first material, wherein the at least one additive is tintin-1,4-diol, and its concentration in the plating bath is greater than or equal to 5 mg. 51_ —A method for manufacturing a structure, which Including the following steps to provide a substrate accessory 'This accessory includes a shaped material on which the first material can be deposited, depositing the first material on the shaped material to obtain an initially shaped deposit, which is a metastable shaped deposit, The first material contains at least one metal, and the metastable shaped deposit is 'heat-treated' at a temperature higher than the absorption absorption peak transfer temperatures of 0 and 150. To obtain a heat-treated shaped deposit, which is a stable formed deposit and has selected material properties. 52. The method of claim 51 in the scope of patent application, wherein the stable formed deposit-8 CNS A4 specification (21Qx 297) '~ · 473562 AB c D VI. Patent application scope Correction of nasal discharge;. Complementary substance has a drop of 5 degrees greater than metastable formed sediment. 53 If applied The method according to item 51 of the patent, wherein the stablely formed deposit has a modulus of elasticity greater than that of the metastable formed deposit. 54 The method according to item 51 of the patent application, wherein the stablely formed deposit and metastable formed deposit Comparing the temperature stability of the sediment, it has an increased temperature stability under a load at a temperature of 100 ° C. 55 — A method of manufacturing a structure that includes the following steps to provide a substrate accessory that includes a substrate on which it can be deposited. A shaped material, a first material is deposited on the shaped material to obtain an initially shaped deposit The nanomaterial is a nanocrystalline deposit. The first material contains at least one metal, and the nanocrystals are heat-treated at a temperature higher than the absorption peak transfer temperature of 0 and 150 ° C. The sediment is induced to transform to obtain a heat-treated shaped deposit, which is a crystalline deposit and has selected material properties. 56 The method of claim 55, wherein the crystalline deposit has a greater than nanocrystalline Degradation strength of sexual deposits. 57. The method of claim 55, wherein the crystalline deposit has a modulus of elasticity greater than that of the nanocrystalline deposit. 58 If the method according to item 55 of the patent application scope, wherein the temperature stability of the crystalline deposits and the nanocrystalline deposits is compared, the temperature stability is increased under a load of 100 ° C. 59 If the method of applying for the scope of the patent No. 47, 48, 51 or 55, where the formation -9-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) JJOZ AS B8 The object includes a wire skeleton. 60 .: The method of applying for patent No. 47, 48, 51 or 55 of the patent park, which further includes the electronic component of the MU gasket 'where the wire skeleton is connected: two points # pieces' where the electronic component can be a semiconductor device, Semiconductor: An electronic device that is used to contact one or more semiconductor devices. It is used to measure: electronic devices of one or more semiconductor devices, probe plugs, connectors or sleeves. a The method of the 47th, 48th, 51st, or 55th patent, wherein the formed article includes a space defined in the second material, the space contributing to the heat treatment &lt; formed geometries of the deposit. 62. The method of claim 4a to 48 of claim 6a, which is called a sub-item method, wherein the formed article includes a first material that has been coated with a layer of seed material to facilitate plating. 63. The method of claim 62, wherein the second material is selected from the group consisting of photoresist and soil. 64. In the case of a patent application, the method of forming an initial deposit in the method ^ is formed by electroplating. 65. The method according to item 47, 48, 51 or "in the scope of patent application, wherein the deposition method is selected from the group consisting of metal plating, chemical vapor deposition (CVD), physical gas deposition (PVD), electrolytic or electroless aqueous solution plating And any method of material deposition caused by the decomposition or reaction of gas, liquid or solid precursors. 66. A method as claimed in item 47, 48, 51 or 55 of the patent application scope, wherein the heat-treated shaped deposit is sufficient Thick so as to improve the material properties -10- This paper size is suitable for SS Home Standard (CNS) A4 specification (210X2974 ^ ·) to give the heat-treated shaped deposits resilience. 67, such as the scope of application for patent 47 51, 55, or 55, wherein the at least one metal system comprises a metal selected from the group consisting of nickel, cobalt, iron, germanium, palladium, tungsten, steel, chromium, titanium, aluminum, gold, and platinum. The method of the scope of items 47, 51, or 55, wherein the at least one metal system comprises a metal selected from the group consisting of nickel, cobalt, and iron. 69. The method of the scope of claims 47, 48, 51, or 55 of the application, further Including deposits containing at least The first material of the two metals is selected from the group consisting of Ni-Co, Co-Mn, Ni-Mn, Pd-Au, Pd-Co, WC〇, Ή-N and Ti-W. 7〇_ For example, the method of applying scope 47, 48, 51 or 55, wherein the heat-treated shaped deposit comprises a Ni-Co alloy. 71 'According to the method of applying scope 47, 48, 51 or 55, further Including depositing a first material containing at least three metals, the three metals being selected from the group consisting of Ni-Co-Mn and Ni-WB. 72. The method of claim 47, 51 or 55, which is initially formed &quot; L deposit further contains at least one additive, wherein the at least one additive is a relatively small amount of ingredients. 73. The method of claim 47, 51 or 55, which further comprises in the initially formed sediment At least one additive, wherein at least one of the at least one additive or a derivative thereof can be co-deposited with the at least one metal and can coexist with the at least one metal under moderate heat treatment to organize the heat-treated Shape the structure of the deposit relative to that Shaped deposits provide increased drop strength. -11-JJOZ Among them, the method as in the scope of the patent application No. 47, 51 or 55, further comprises at least one additive in the initially formed sediment, wherein the at least one additive includes a sulfur-containing compound. 75. The method of claim 47, 51, or 55, further comprising at least one additive in the initially formed sediment, wherein the at least one additive is selected from the group consisting of saccharin, hydrazone trisulfonic acid, hydrazone Butyl-1,4-diol and sulfur service. The method of Guarullo's patent application No. 47, 48, 51 or 55, further comprising depositing in the presence of a third substance selected from the group consisting of hall, surface Γ, type 丨 whitening agent and type 2 whitening agent. The first material.苁 If the method of the scope of patent application is No. 47, 48, 51 or 55, wherein the initially formed sediment undergoes an exothermic transition on the structure of Wuguan, from a less organized to a more organized state, where the exothermic transition It has a peak temperature 'and wherein the heat treatment temperature is higher than the peak temperature and the contact temperature is higher than 78. For example, the deposit formed by the method of the patent application scope 47, 48, 51 or 包含 includes an amorphous material. 79. For example, the scope of application for the patent is No. 78. This is Z. Wan, where the heat treatment step is caused by Shao Fen's initial formation of the sedimentary material. From a non-crystalline material to an ordered material. Muscle: Patented Method 47, 48, 51 or Ko, where the processed shaped deposits contain ordered material. 81. If the scope of patent application is No. 47,485,000, the deposit formed by the side contains nanocrystalline material. '^ 取 -12- This paper is suitable for financial standards (CNS) Α4 size Hold The method of claim 81 of the second patent claim, wherein the heat treatment step causes a change in Shao's initial forming of the sedimentary material, from nanocrystalline material to crystalline material. 83. The method according to claims 4 to 48, 51 or 55, wherein the heat-treated shaped deposit comprises a crystalline material. 84. For example, please refer to the method of item 47, 48, 51 or 55, which further includes a material, such that the heat-treated shaped deposit is connected to the base septum and includes a back Flexible electrical contacts. 85. The method of claim 48, 51 or 55, further comprising removing all or part of the formed article after the deposition step and before or after the heat treatment step. The method as described in item 85 of the above, wherein the heat-treated formed deposit (the first part is fixed to the base fitting, and the second part of the heat-treated formed deposit is separated from the base fitting, so that if not When restricted, it can be elastically moved in relation to the base fitting. 87. The method of claim 47, 48, 51 or 55, wherein the formed article comprises a member selected from the group consisting of gold, silicon, aluminum, copper and Titanium_tungsten material. 88. The method of claim 47, 48, 51 or 55, wherein the heat-treated deposited deposit has a higher yield strength than the initially formed deposit. 89. If applied The method of item 88 of the patent, wherein the heat treatment is to obtain a heat-treated shaped deposit under a combination of time and temperature, which has a yield strength close to the maximum value of the heat-treated shaped deposit, so that the heat treatment is significantly further Will significantly reduce the yield strength -13- This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) Λ8 Βδ Deviation from this maximum. 9〇 ·: Improved material properties of processed deposited deposits under scope 47,48,51 or 5 of the application for patents, wherein the yield strength of the thermal deposits, including defects relative to the initial formation 91. If applied for scope 47, 48, Increased strength of surrender. An improved method for processing shaped deposits, wherein the elastic modulus of the thermal deposits includes: Material property 1 For the initial forming 〇9, 〇, *, the elastic modulus of the edge selection increases. 92_ If the method of the patent application No. 4 module # ^ 8, 51 or 55, wherein the modified material properties of the warp-shaped deposits are compared with the corresponding stability of the initially formed deposits, including at high temperatures Yu Ezhi's negative ^ 'selected to increase stability. 91 If the scope of the patent application is No. 47, the processed shaped sediment, The method of 48, 51 or 55, wherein the heat is more resilient than the initially formed sediment -14-This paper size applies the Chinese national standard ^^) Α4 size (210X297 mm)