CN1277648C - 激光钻孔加工方法 - Google Patents

激光钻孔加工方法 Download PDF

Info

Publication number
CN1277648C
CN1277648C CNB008195692A CN00819569A CN1277648C CN 1277648 C CN1277648 C CN 1277648C CN B008195692 A CNB008195692 A CN B008195692A CN 00819569 A CN00819569 A CN 00819569A CN 1277648 C CN1277648 C CN 1277648C
Authority
CN
China
Prior art keywords
laser
mentioned
pulse
pulse laser
ylf
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB008195692A
Other languages
English (en)
Other versions
CN1452534A (zh
Inventor
桑原尚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Publication of CN1452534A publication Critical patent/CN1452534A/zh
Application granted granted Critical
Publication of CN1277648C publication Critical patent/CN1277648C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

本发明涉及一种使用激光束对构成印刷电路基板的树脂层进行钻孔加工的激光钻孔加工方法。其使用脉冲宽度为100～300(nsec)的紫外线激光束对印刷电路基板的树脂层进行照射。

Description

激光钻孔加工方法
技术领域
本发明涉及使用激光束对构成印刷电路基板的树脂层进行钻孔加工的激光钻孔加工方法。
背景技术
随着电子设备的小型化、高密度安装化，越来越要求在印刷电路板上的电路高密度化。与上述要求相对应，近年来提供一种由多个印刷电路基板层叠形成的多层印刷电路基板。在如上所述的多层印刷电路基板中的上下层叠的印刷电路基板之间，需要对导电层进行电气的连接。导电层一般使用铜图形(pattern)来实现。如上所述的连接是在印刷电路基板的绝缘树脂层上，通过形成到达下层导电层的被称为过孔的孔、并在形成的孔的内部进行电镀来实现的。通常，绝缘树脂层使用聚酰亚胺、环氧类树脂等聚合物材料。
最近在如上所述的钻孔加工中开始利用脉冲状激光束。利用激光束的激光钻孔加工装置与使用机械的微细钻头的机械加工相比较，在加工速度、孔径微细化等方面具有优势。激光束的产生装置一般采用受激准分子激光器(excimer laser)、二氧化碳激光器(CO2laser)以及钇铝石榴石激光器YAG(yttrium aluminium garnet laser)等。
就受激准分子激光器而言，使用紫外线激光束的发生装置是其主流。可以通过把受激准分子激光器中的气体种类变更成KrF、ArF、XeF、XeCl等来改变其振荡波长。但是，上述激光器都是气体激光器，其振荡时间即脉冲宽度一般在10～20(nsec)左右，非常短。因此，当使用脉冲状激光束照射加工对象物体时，激光束的能量在加工对象物体的表面近处被吸收。这就意味着对于某些较厚的加工对象物体而言，受激准分子激光器的钻孔能力比采用热加工的二氧化碳激光器或YAG激光器低。
因此，与二氧化碳激光器、Nd:YAG(掺钕钇铝石榴石)激光器相比，受激准分子激光器以及Nd:YLF(掺钕氟化锂钇)激光器、Nd:YAG(掺钕钇铝石榴石)激光器、Nd:YVO4(掺钕钒酸钇)激光器的3倍波、4倍波和5倍波(三次谐波、四次谐波和五次谐波)的每1个脉冲的加工速度变低。为此，这类使用激光束发生装置的紫外线激光器，依存于紫外线激光束的波长，所以存在处理能力、特别是加工速度较低的缺点。
发明内容
本发明的目的是提供一种使用紫外线脉冲激光器在印刷电路基板上进行钻孔加工的时候，通过设定适当的脉冲激光束的脉冲宽度使加工速度提高的方法。
本发明是一种在印刷电路基板上照射紫外线激光束对其进行钻孔的钻孔加工方法，其特征在于使用脉冲宽度为100～300(nsec)的紫外线激光束对印刷电路基板的树脂层进行照射。
特别是，在本发明中，作为紫外线激光束的发生源，使用Nd:YLF脉冲激光器或者Nd:YAG脉冲激光器。
附图说明
图1是表示使用本发明的激光钻孔加工装置的系统构成的图。
具体实施方式
以下，对本发明的实施方式进行说明。本发明为了提高使用紫外线激光束进行钻孔加工的加工速度，特别关注由激光振荡器的构成而引起的脉冲宽度。也就是说，通过调整激光振荡器中的构成振荡器的一对反光镜的间隔，来调整脉冲宽度。
在这里，对使用脉冲宽度不同的激光器、即受激准分子激光器的XeF激光器(波长为351nm)和Nd:YLF脉冲激光器的三次谐波(波长为351nm)两者的钻孔加工性能进行过比较。也就是说，XeF激光的脉冲宽度约为20(nsec)，而Nd:YLF脉冲激光器的三次谐波的脉冲宽度约为170(nsec)。
图1所示是实施钻孔加工的系统的构成。激光振荡器11使用的是XeF激光器或者Nd:YLF脉冲激光器。特别是在Nd:YLF脉冲激光器的场合使用其三次谐波。由激光振荡器11产生的激光束，经过反射镜12、衰减器13、以及反射镜14照射在掩膜15上。由掩膜15的开口决定的像经由反射镜16、通过被称为fθ透镜的加工透镜17被缩小投影在加工对象物体18上。加工对象物体18被安放在X-Y载物台19上。X-Y载物台19可以使搭载加工对象物体18的载物台向X轴方向、Y轴方向移动。其结果是，可以利用激光束在加工对象物体18的任意位置上进行钻孔。
另外，衰减器13是为了调整输出较大的XeF激光器的能量而设置的。因此，当使用Nd:YLF脉冲激光器时可以将其除去。如此，则无论是使用XeF激光器还是使用Nd:YLF脉冲激光器的场合，都对加工对象物体18上的光子束的影响(能量密度)进行调整使其几乎相同。
使用聚酰亚胺薄膜(聚酰亚胺薄膜：厚度为100μm)作为加工对象物体18。上述2种激光并非波长不同，其两者的差异仅仅在于脉冲宽度。使用XeF激光器和Nd:YLF脉冲激光器的三次谐波且两者都在加工对象物体的表面采用10(J/cm2)的照射能量进行加工试验。其结果是，每1个脉冲的加工深度在XeF激光器的场合约为2(μm)、在Nd:YLF脉冲激光器的场合约为7(μm)。
从上述结果可以判断出Nd:YLF脉冲激光器的三次谐波的钻孔能力较强。其理由是，当脉冲宽度较小时，激光束的照射在短时间内结束，激光束的能量在加工对象物体的表面近处蓄积，向加工对象物体的能量的渗透较低。相对于此，当激光束的脉冲宽度较宽时，由于向加工对象物体的热扩散较高，所以加速热蚀反应或照射部分的热变质，其结果是推测出钻孔速度被提高。
此点也适用于Nd:YLF脉冲激光器或Nd:YAG脉冲激光器的基波和二次～五次谐波。例如，在Nd:YAG脉冲激光器的三次谐波下即使脉冲宽度为150(nsec)的场合其钻孔速度也有所提高。另外，理想的脉冲宽度的范围被确认为100～300(nsec)。
如上所述，根据本发明在使用紫外线脉冲激光器、特别是Nd:YLF脉冲激光器或Nd:YAG脉冲激光器对印刷电路基板进行钻孔加工的时候，通过适当设定脉冲激光器的脉冲宽度可以实现加工速度(钻孔速度)的提高。
产业上的利用可能性
本发明可以被考虑应用于对印刷电路基板的树脂层进行钻孔加工、以及对聚合物材料进行穿孔等。

Claims (5)

1.一种激光钻孔加工方法，其特征在于：当使用激光束对印刷电路基板进行钻孔加工时，使用Nd:YLF脉冲激光器或者Nd:YAG脉冲激光器的脉冲宽度为100～300nsec的激光束对印刷电路基板的树脂层进行照射。
2.根据权利要求1的激光钻孔加工方法，其特征在于：上述印刷电路基板在树脂层的下层有导电层，上述钻孔加工是指形成到达上述导电层的孔。
3.根据权利要求1或2的激光钻孔加工方法，其特征在于：上述脉冲激光，是上述Nd:YLF脉冲激光器或者上述Nd:YAG脉冲激光器的基波和二次～五次谐波中的任意一种。
4.一种激光钻孔加工装置，在树脂基板上照射激光、来进行钻孔加工，其特征在于：具有作为上述激光的发生装置、产生Nd:YLF脉冲激光或Nd:YAG脉冲激光的高次谐波的装置；该脉冲激光器的脉冲宽度被设定为100～300nsec。
5.根据权利要求4的激光钻孔加工装置，其特征在于：在上述激光的光路上配置掩膜，在该掩膜和上述树脂基板之间的光路上，设置用于把上述掩膜的像缩小投影在上述树脂基板上的fθ透镜。
CNB008195692A 2000-05-23 2000-05-23 激光钻孔加工方法 Expired - Fee Related CN1277648C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/003285 WO2001089756A1 (en) 2000-05-23 2000-05-23 Laser drilling method

Publications (2)

Publication Number Publication Date
CN1452534A CN1452534A (zh) 2003-10-29
CN1277648C true CN1277648C (zh) 2006-10-04

Family

ID=11736057

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008195692A Expired - Fee Related CN1277648C (zh) 2000-05-23 2000-05-23 激光钻孔加工方法

Country Status (6)

Country Link
EP (1) EP1306160A4 (zh)
KR (1) KR100504234B1 (zh)
CN (1) CN1277648C (zh)
HK (1) HK1060085A1 (zh)
NO (1) NO20025633D0 (zh)
WO (1) WO2001089756A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100455228B1 (ko) * 2001-06-23 2004-11-09 주식회사 엘지생활건강 반투명한 치아 미백용 패취
JP4784930B2 (ja) * 2003-09-11 2011-10-05 株式会社ニコン 高分子結晶の加工方法、高分子結晶の加工装置、及び高分子結晶の観察装置
JP2006123004A (ja) * 2004-09-29 2006-05-18 Mitsubishi Materials Corp レーザ加工方法及びレーザ加工装置
WO2006037114A2 (en) 2004-09-28 2006-04-06 Hitachi Via Mechanics, Ltd Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming or milling applications
CN102218606A (zh) * 2011-05-18 2011-10-19 苏州德龙激光有限公司 紫外激光打孔的装置
JP7152426B2 (ja) * 2018-01-24 2022-10-12 ギガフォトン株式会社 レーザ加工方法及びレーザ加工システム
CN111918482A (zh) * 2020-06-05 2020-11-10 江西一诺新材料有限公司 一种fpc微孔的制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4915981A (en) * 1988-08-12 1990-04-10 Rogers Corporation Method of laser drilling fluoropolymer materials
JP2773710B2 (ja) * 1995-10-09 1998-07-09 日立エーアイシー株式会社 多層プリント配線板の製造方法
JPH1196548A (ja) * 1997-09-25 1999-04-09 Showa Denko Kk 磁気記録媒体の製造方法
GB9812725D0 (en) * 1998-06-13 1998-08-12 Exitech Ltd The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages

Also Published As

Publication number Publication date
CN1452534A (zh) 2003-10-29
NO20025633L (no) 2002-11-22
EP1306160A4 (en) 2006-12-27
EP1306160A1 (en) 2003-05-02
WO2001089756A1 (en) 2001-11-29
HK1060085A1 (en) 2004-07-30
KR20020097279A (ko) 2002-12-31
NO20025633D0 (no) 2002-11-22
KR100504234B1 (ko) 2005-07-27

Similar Documents

Publication Publication Date Title
US8415586B2 (en) Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses
EP0430116B1 (en) Method for forming through holes in a polyimide substrate
JP3522654B2 (ja) レーザ加工装置及び加工方法
CN104105569B (zh) 用于在介电基片中形成精细尺度结构的方法和设备
KR20000010674A (ko) 에너지 밀도가 가변적인 자외선 레이저 펄스를 사용하여, 다층으로 된 타깃에 블라인드 공간부를 형성하는 방법b
CN1938837A (zh) 在无源电子元件衬底上形成划线的方法
CN102218606A (zh) 紫外激光打孔的装置
CN1277648C (zh) 激光钻孔加工方法
CN202123320U (zh) 紫外激光打孔的装置
JP2002517315A (ja) 電気回路配線パッケージにマイクロビアホールを穿孔するための装置及び方法
Zheng et al. Investigation of laser via formation technology for the manufacturing of high density substrates
JPH11277272A (ja) レーザドリル装置及びレーザ穴あけ加工方法
KR100752831B1 (ko) 유기 재료의 레이저 드릴링을 위한 방법 및 장치
JP3199653B2 (ja) 多層プリント配線板の製造装置及び製造方法
JPH11277273A (ja) レーザドリル装置及びレーザ穴あけ加工方法
JP2000202664A (ja) レ―ザ穴あけ加工方法
Morrison et al. A Large Format Modified TEA CO/sub 2/Laser Based Process for Cost Effective Small Via Generation
JP2002126886A (ja) レーザ穴あけ加工装置
CN100490607C (zh) 软性印刷电路板的激光钻孔系统及方法
Illyefalvi-Vitéz et al. Recent advancements in MCM-L imaging and via generation by laser direct writing
JP3245820B2 (ja) レーザ穴あけ加工方法
CN214392880U (zh) 一种双头激光光路系统
JPH11333585A (ja) レーザ穴あけ加工装置用のデスミア装置及びデスミア方法
JP2003053580A (ja) レーザ加工方法、プリント配線基板の製造方法及びプリント配線基板の製造装置
Corboline et al. Laser machining of silicon using diode-pumped solid state & CO2 lasers

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1060085

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20061004

Termination date: 20150523

EXPY Termination of patent right or utility model