NO20025633L - Laserdrillemetode - Google Patents

Laserdrillemetode

Info

Publication number
NO20025633L
NO20025633L NO20025633A NO20025633A NO20025633L NO 20025633 L NO20025633 L NO 20025633L NO 20025633 A NO20025633 A NO 20025633A NO 20025633 A NO20025633 A NO 20025633A NO 20025633 L NO20025633 L NO 20025633L
Authority
NO
Norway
Prior art keywords
laser drill
drill method
laser
drill
Prior art date
Application number
NO20025633A
Other languages
English (en)
Other versions
NO20025633D0 (no
Inventor
Takashi Kuwabara
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of NO20025633L publication Critical patent/NO20025633L/no
Publication of NO20025633D0 publication Critical patent/NO20025633D0/no

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
NO20025633A 2000-05-23 2002-11-22 Laserdrillemetode NO20025633D0 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/003285 WO2001089756A1 (en) 2000-05-23 2000-05-23 Laser drilling method

Publications (2)

Publication Number Publication Date
NO20025633L true NO20025633L (no) 2002-11-22
NO20025633D0 NO20025633D0 (no) 2002-11-22

Family

ID=11736057

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20025633A NO20025633D0 (no) 2000-05-23 2002-11-22 Laserdrillemetode

Country Status (6)

Country Link
EP (1) EP1306160A4 (no)
KR (1) KR100504234B1 (no)
CN (1) CN1277648C (no)
HK (1) HK1060085A1 (no)
NO (1) NO20025633D0 (no)
WO (1) WO2001089756A1 (no)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100455228B1 (ko) * 2001-06-23 2004-11-09 주식회사 엘지생활건강 반투명한 치아 미백용 패취
EP1666520B1 (en) * 2003-09-11 2013-11-13 Nikon Corporation A macromolecular crystral working apparatus ; A macromolecular crystal evaluating device with such apparatus
JP2006123004A (ja) * 2004-09-29 2006-05-18 Mitsubishi Materials Corp レーザ加工方法及びレーザ加工装置
US7602822B2 (en) 2004-09-28 2009-10-13 Hitachi Via Mechanics, Ltd Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming of milling applications
CN102218606A (zh) * 2011-05-18 2011-10-19 苏州德龙激光有限公司 紫外激光打孔的装置
WO2019146021A1 (ja) * 2018-01-24 2019-08-01 ギガフォトン株式会社 レーザ加工方法及びレーザ加工システム
CN111918482A (zh) * 2020-06-05 2020-11-10 江西一诺新材料有限公司 一种fpc微孔的制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4915981A (en) * 1988-08-12 1990-04-10 Rogers Corporation Method of laser drilling fluoropolymer materials
JP2773710B2 (ja) * 1995-10-09 1998-07-09 日立エーアイシー株式会社 多層プリント配線板の製造方法
JPH1196548A (ja) * 1997-09-25 1999-04-09 Showa Denko Kk 磁気記録媒体の製造方法
GB9812725D0 (en) * 1998-06-13 1998-08-12 Exitech Ltd The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages

Also Published As

Publication number Publication date
CN1277648C (zh) 2006-10-04
KR100504234B1 (ko) 2005-07-27
CN1452534A (zh) 2003-10-29
WO2001089756A1 (en) 2001-11-29
EP1306160A4 (en) 2006-12-27
NO20025633D0 (no) 2002-11-22
HK1060085A1 (en) 2004-07-30
KR20020097279A (ko) 2002-12-31
EP1306160A1 (en) 2003-05-02

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application