ATA9992001A - Greifwerkzeug - Google Patents
GreifwerkzeugInfo
- Publication number
- ATA9992001A ATA9992001A AT0099901A AT9992001A ATA9992001A AT A9992001 A ATA9992001 A AT A9992001A AT 0099901 A AT0099901 A AT 0099901A AT 9992001 A AT9992001 A AT 9992001A AT A9992001 A ATA9992001 A AT A9992001A
- Authority
- AT
- Austria
- Prior art keywords
- cross tool
- tool
- cross
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH13092000 | 2000-07-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA9992001A true ATA9992001A (de) | 2004-09-15 |
AT412553B AT412553B (de) | 2005-04-25 |
Family
ID=4565364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT0099901A AT412553B (de) | 2000-07-03 | 2001-06-27 | Greifwerkzeug |
Country Status (8)
Country | Link |
---|---|
US (1) | US6675465B2 (de) |
KR (1) | KR20020004830A (de) |
CN (1) | CN1206714C (de) |
AT (1) | AT412553B (de) |
CH (1) | CH695075A5 (de) |
HK (1) | HK1041560A1 (de) |
SG (1) | SG97183A1 (de) |
TW (1) | TW503456B (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE526666C2 (sv) * | 2002-12-30 | 2005-10-25 | Nobel Biocare Ab | Anordning och arrangemang för fixturinstallation |
DE10309879B4 (de) * | 2003-03-06 | 2006-08-31 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
WO2005061188A1 (ja) * | 2003-12-19 | 2005-07-07 | Matsushita Electric Industrial Co., Ltd. | 部品装着ヘッド、吸着ノズル、及び吸着ノズルの製造方法 |
CN101172539B (zh) * | 2006-11-03 | 2011-05-04 | 鸿富锦精密工业(深圳)有限公司 | 吸附拾取装置 |
US7927976B2 (en) * | 2008-07-23 | 2011-04-19 | Semprius, Inc. | Reinforced composite stamp for dry transfer printing of semiconductor elements |
WO2010059781A1 (en) * | 2008-11-19 | 2010-05-27 | Semprius, Inc. | Printing semiconductor elements by shear-assisted elastomeric stamp transfer |
US8261660B2 (en) * | 2009-07-22 | 2012-09-11 | Semprius, Inc. | Vacuum coupled tool apparatus for dry transfer printing semiconductor elements |
FR2967292B1 (fr) | 2010-11-05 | 2012-10-26 | Legrand France | Commutateur electrique de type push-push |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5804814A (en) * | 1994-05-20 | 1998-09-08 | Musha; Toru | Optical pick-up head and integrated type optical unit for use in optical pick-up head |
JPS5537283A (en) * | 1978-09-08 | 1980-03-15 | Matsushita Electric Ind Co Ltd | Article shifter |
US4763941A (en) * | 1987-06-11 | 1988-08-16 | Unisys Corporation | Automatic vacuum gripper |
NL8701603A (nl) | 1987-07-08 | 1989-02-01 | Philips & Du Pont Optical | Vacuuminrichting voor het vastzuigen van werkstukken. |
JPH02246233A (ja) * | 1989-03-20 | 1990-10-02 | Fujitsu Ltd | ダイボンダ |
DE69133413D1 (de) | 1990-05-07 | 2004-10-21 | Canon Kk | Substratträger des Vakuumtyps |
JPH04188840A (ja) * | 1990-11-22 | 1992-07-07 | Toshiba Corp | ダイボンディング方法 |
JPH0521584A (ja) * | 1991-07-16 | 1993-01-29 | Nikon Corp | 保持装置 |
JPH06244269A (ja) * | 1992-09-07 | 1994-09-02 | Mitsubishi Electric Corp | 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法 |
JPH0831910A (ja) * | 1994-07-18 | 1996-02-02 | Hitachi Ltd | 静電防止機能付き吸着パッドおよびその被吸着物離脱方法、ならびに静電防止機能付き吸着パッドを用いた半導体製造装置 |
DE19530858C1 (de) * | 1995-08-22 | 1997-01-23 | Siemens Ag | Ansaugplatte für Wafer |
CH695405A5 (de) * | 1999-12-14 | 2006-04-28 | Esec Trading Sa | Die Bonder und Wire Bonder mit einer Ansaugvorrichtung zum Flachziehen und Niederhalten eines gewölbten Substrats. |
-
2001
- 2001-06-14 CH CH01070/01A patent/CH695075A5/de not_active IP Right Cessation
- 2001-06-22 KR KR1020010035800A patent/KR20020004830A/ko not_active Application Discontinuation
- 2001-06-26 SG SG200103977A patent/SG97183A1/en unknown
- 2001-06-27 AT AT0099901A patent/AT412553B/de not_active IP Right Cessation
- 2001-06-28 US US09/896,372 patent/US6675465B2/en not_active Expired - Fee Related
- 2001-06-29 TW TW090115934A patent/TW503456B/zh active
- 2001-07-03 CN CNB011175729A patent/CN1206714C/zh not_active Expired - Fee Related
-
2002
- 2002-04-30 HK HK02103210.6A patent/HK1041560A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
HK1041560A1 (zh) | 2002-07-12 |
CN1206714C (zh) | 2005-06-15 |
CN1330399A (zh) | 2002-01-09 |
SG97183A1 (en) | 2003-07-18 |
KR20020004830A (ko) | 2002-01-16 |
AT412553B (de) | 2005-04-25 |
US20030029029A1 (en) | 2003-02-13 |
TW503456B (en) | 2002-09-21 |
US6675465B2 (en) | 2004-01-13 |
CH695075A5 (de) | 2005-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |