CN1270211C - 连接软性印刷电路和接线板的结构和方法、液晶显示器件及其制造方法 - Google Patents
连接软性印刷电路和接线板的结构和方法、液晶显示器件及其制造方法 Download PDFInfo
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- CN1270211C CN1270211C CN 02128516 CN02128516A CN1270211C CN 1270211 C CN1270211 C CN 1270211C CN 02128516 CN02128516 CN 02128516 CN 02128516 A CN02128516 A CN 02128516A CN 1270211 C CN1270211 C CN 1270211C
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- 238000000034 method Methods 0.000 title claims description 33
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 12
- 230000004807 localization Effects 0.000 claims description 136
- 210000002469 basement membrane Anatomy 0.000 claims description 46
- 238000009413 insulation Methods 0.000 claims description 42
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 abstract description 5
- 101100206196 Arabidopsis thaliana TCP3 gene Proteins 0.000 description 48
- 101100260060 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CCT3 gene Proteins 0.000 description 48
- 230000003321 amplification Effects 0.000 description 23
- 238000003199 nucleic acid amplification method Methods 0.000 description 23
- 101100206197 Arabidopsis thaliana TCP4 gene Proteins 0.000 description 11
- 101100313194 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CCT4 gene Proteins 0.000 description 11
- 210000003141 lower extremity Anatomy 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 02128516 CN1270211C (zh) | 2002-08-09 | 2002-08-09 | 连接软性印刷电路和接线板的结构和方法、液晶显示器件及其制造方法 |
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CN 02128516 CN1270211C (zh) | 2002-08-09 | 2002-08-09 | 连接软性印刷电路和接线板的结构和方法、液晶显示器件及其制造方法 |
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Publication Number | Publication Date |
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CN1474479A CN1474479A (zh) | 2004-02-11 |
CN1270211C true CN1270211C (zh) | 2006-08-16 |
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CN 02128516 Expired - Lifetime CN1270211C (zh) | 2002-08-09 | 2002-08-09 | 连接软性印刷电路和接线板的结构和方法、液晶显示器件及其制造方法 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100684793B1 (ko) | 2004-12-07 | 2007-02-20 | 삼성에스디아이 주식회사 | 릴상의 테이프 캐리어 패키지와 이를 적용한 플라즈마디스플레이 장치 |
CN100495147C (zh) * | 2005-11-01 | 2009-06-03 | 中华映管股份有限公司 | 液晶显示面板装置及该液晶显示面板装置用的卷带型封装 |
CN111602189B (zh) * | 2018-01-24 | 2022-03-22 | 堺显示器制品株式会社 | 布线基板的电连接结构及显示装置 |
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- 2002-08-09 CN CN 02128516 patent/CN1270211C/zh not_active Expired - Lifetime
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Owner name: NIPPON ELECTRIC CO., LTD. Free format text: FORMER OWNER: NEC LCD TECHNOLOGY CO.,LTD Effective date: 20100608 |
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