CN1268038C - 成批式电连接片 - Google Patents

成批式电连接片 Download PDF

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Publication number
CN1268038C
CN1268038C CN02815349.9A CN02815349A CN1268038C CN 1268038 C CN1268038 C CN 1268038C CN 02815349 A CN02815349 A CN 02815349A CN 1268038 C CN1268038 C CN 1268038C
Authority
CN
China
Prior art keywords
conductive
heat
sheet
batch
conductive block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN02815349.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN1539179A (zh
Inventor
川手恒一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1539179A publication Critical patent/CN1539179A/zh
Application granted granted Critical
Publication of CN1268038C publication Critical patent/CN1268038C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Cable Accessories (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN02815349.9A 2001-08-08 2002-08-06 成批式电连接片 Expired - Fee Related CN1268038C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP240533/2001 2001-08-08
JP2001240533A JP2003069198A (ja) 2001-08-08 2001-08-08 一括電気接続用シート

Publications (2)

Publication Number Publication Date
CN1539179A CN1539179A (zh) 2004-10-20
CN1268038C true CN1268038C (zh) 2006-08-02

Family

ID=19071130

Family Applications (1)

Application Number Title Priority Date Filing Date
CN02815349.9A Expired - Fee Related CN1268038C (zh) 2001-08-08 2002-08-06 成批式电连接片

Country Status (9)

Country Link
EP (1) EP1415369B1 (enExample)
JP (1) JP2003069198A (enExample)
CN (1) CN1268038C (enExample)
AT (1) ATE307393T1 (enExample)
BR (1) BR0211504A (enExample)
CA (1) CA2453336A1 (enExample)
DE (1) DE60206776T2 (enExample)
MX (1) MXPA04001119A (enExample)
WO (1) WO2003015218A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101212085B (zh) * 2006-12-29 2012-01-18 鸿富锦精密工业（深圳）有限公司 导电元件之粘合结构组合

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006026510B3 (de) * 2006-06-06 2007-05-24 Leinemann Gmbh & Co. Kg Flammensperreinsatz und Verfahren zu seiner Herstellung
CN102169760B (zh) * 2010-12-17 2013-08-14 南通万德电子工业有限公司 复合导电片材
JP2012131921A (ja) * 2010-12-22 2012-07-12 Nitto Denko Corp 導電性接着テープ
JP5667490B2 (ja) * 2011-03-24 2015-02-12 日本航空電子工業株式会社 コネクタ
CN102354629B (zh) * 2011-07-12 2014-02-05 南通万德科技有限公司 麻面金属与橡胶复合导电粒
CN108878756B (zh) * 2018-06-28 2023-12-19 郑州正方科技有限公司 电池汇流连接板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1184622A (en) * 1981-12-28 1985-03-26 James G. Berg Insulated connector sheet
JPH0294492A (ja) * 1988-09-30 1990-04-05 Hitachi Ltd 回路基板の接続部構造
JP2811811B2 (ja) * 1989-10-03 1998-10-15 三菱電機株式会社 液晶表示装置
JP3352705B2 (ja) * 1991-06-07 2002-12-03 日東電工株式会社 異方導電性接着フィルムを用いた実装構造
US5275856A (en) * 1991-11-12 1994-01-04 Minnesota Mining And Manufacturing Company Electrically conductive adhesive web
JPH06168626A (ja) * 1992-11-26 1994-06-14 Toppan Printing Co Ltd 封止済集積回路接続部材とその製造方法ならびに実装基板とその製造方法
JPH09314353A (ja) * 1996-05-23 1997-12-09 Toyota Autom Loom Works Ltd 抵抗溶接方法及び被溶接体の構造
JPH1079570A (ja) * 1996-09-03 1998-03-24 Haisoole Kk 電子素子チップと配線回路の電気的接合方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101212085B (zh) * 2006-12-29 2012-01-18 鸿富锦精密工业（深圳）有限公司 导电元件之粘合结构组合

Also Published As

Publication number Publication date
DE60206776D1 (de) 2005-11-24
CN1539179A (zh) 2004-10-20
CA2453336A1 (en) 2003-02-20
WO2003015218A1 (en) 2003-02-20
EP1415369B1 (en) 2005-10-19
ATE307393T1 (de) 2005-11-15
EP1415369A1 (en) 2004-05-06
MXPA04001119A (es) 2004-07-08
JP2003069198A (ja) 2003-03-07
BR0211504A (pt) 2004-09-14
DE60206776T2 (de) 2006-12-07

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060802

Termination date: 20090806