BR0211504A - Folha de conexão elétrica por lote, processo para conexão elétrica por lote, e, estrutura conectada - Google Patents
Folha de conexão elétrica por lote, processo para conexão elétrica por lote, e, estrutura conectadaInfo
- Publication number
- BR0211504A BR0211504A BR0211504-2A BR0211504A BR0211504A BR 0211504 A BR0211504 A BR 0211504A BR 0211504 A BR0211504 A BR 0211504A BR 0211504 A BR0211504 A BR 0211504A
- Authority
- BR
- Brazil
- Prior art keywords
- electrical connection
- batch
- heat
- batch electrical
- projections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cable Accessories (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
"FOLHA DE CONEXãO ELéTRICA POR LOTE, PROCESSO PARA CONEXãO ELéTRICA POR LOTE, E, ESTRUTURA CONECTADA". Uma folha de conexão elétrica por lote toma possível formar uma conexão elétrica com estabilidade mecânica, térmica, e elétrica em vários pontos de contato. Uma folha de conexão elétrica por lote inclui uma folha termorresistente tendo varias perfurações, blocos condutivos, inseridos nas perfurações, tendo cristas incluindo endentações e projeções; as projeções são salientes das perfurações, e os blocos condutivos são mais grossos do que a folha termorresistente, e a folha termorresistente tem uma camada adesiva composta de um agente adesivo termocurável aplicado sobre pelo menos uma superfície dela, cobrindo as projeções dos blocos condutivos.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001240533A JP2003069198A (ja) | 2001-08-08 | 2001-08-08 | 一括電気接続用シート |
PCT/US2002/024790 WO2003015218A1 (en) | 2001-08-08 | 2002-08-06 | Batch electrically connecting sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0211504A true BR0211504A (pt) | 2004-09-14 |
Family
ID=19071130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0211504-2A Withdrawn BR0211504A (pt) | 2001-08-08 | 2002-08-06 | Folha de conexão elétrica por lote, processo para conexão elétrica por lote, e, estrutura conectada |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1415369B1 (pt) |
JP (1) | JP2003069198A (pt) |
CN (1) | CN1268038C (pt) |
AT (1) | ATE307393T1 (pt) |
BR (1) | BR0211504A (pt) |
CA (1) | CA2453336A1 (pt) |
DE (1) | DE60206776T2 (pt) |
MX (1) | MXPA04001119A (pt) |
WO (1) | WO2003015218A1 (pt) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006026510B3 (de) * | 2006-06-06 | 2007-05-24 | Leinemann Gmbh & Co. Kg | Flammensperreinsatz und Verfahren zu seiner Herstellung |
CN101212085B (zh) * | 2006-12-29 | 2012-01-18 | 鸿富锦精密工业(深圳)有限公司 | 导电元件之粘合结构组合 |
CN102169760B (zh) * | 2010-12-17 | 2013-08-14 | 南通万德电子工业有限公司 | 复合导电片材 |
JP2012131921A (ja) * | 2010-12-22 | 2012-07-12 | Nitto Denko Corp | 導電性接着テープ |
JP5667490B2 (ja) * | 2011-03-24 | 2015-02-12 | 日本航空電子工業株式会社 | コネクタ |
CN102354629B (zh) * | 2011-07-12 | 2014-02-05 | 南通万德科技有限公司 | 麻面金属与橡胶复合导电粒 |
CN108878756B (zh) * | 2018-06-28 | 2023-12-19 | 郑州正方科技有限公司 | 电池汇流连接板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1184622A (en) * | 1981-12-28 | 1985-03-26 | James G. Berg | Insulated connector sheet |
JP2811811B2 (ja) * | 1989-10-03 | 1998-10-15 | 三菱電機株式会社 | 液晶表示装置 |
US5275856A (en) * | 1991-11-12 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
-
2001
- 2001-08-08 JP JP2001240533A patent/JP2003069198A/ja active Pending
-
2002
- 2002-08-06 AT AT02759265T patent/ATE307393T1/de not_active IP Right Cessation
- 2002-08-06 CN CN02815349.9A patent/CN1268038C/zh not_active Expired - Fee Related
- 2002-08-06 BR BR0211504-2A patent/BR0211504A/pt not_active Withdrawn
- 2002-08-06 EP EP02759265A patent/EP1415369B1/en not_active Expired - Lifetime
- 2002-08-06 WO PCT/US2002/024790 patent/WO2003015218A1/en active IP Right Grant
- 2002-08-06 CA CA002453336A patent/CA2453336A1/en not_active Abandoned
- 2002-08-06 DE DE60206776T patent/DE60206776T2/de not_active Expired - Fee Related
- 2002-08-06 MX MXPA04001119A patent/MXPA04001119A/es active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN1539179A (zh) | 2004-10-20 |
ATE307393T1 (de) | 2005-11-15 |
CA2453336A1 (en) | 2003-02-20 |
EP1415369A1 (en) | 2004-05-06 |
MXPA04001119A (es) | 2004-07-08 |
JP2003069198A (ja) | 2003-03-07 |
WO2003015218A1 (en) | 2003-02-20 |
EP1415369B1 (en) | 2005-10-19 |
DE60206776T2 (de) | 2006-12-07 |
DE60206776D1 (de) | 2005-11-24 |
CN1268038C (zh) | 2006-08-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 7A E 8A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 DA RPI 2060 DE 29/06/2010. |