CN1252802C - 刻蚀含铋氧化物膜的方法 - Google Patents
刻蚀含铋氧化物膜的方法 Download PDFInfo
- Publication number
- CN1252802C CN1252802C CNB008114781A CN00811478A CN1252802C CN 1252802 C CN1252802 C CN 1252802C CN B008114781 A CNB008114781 A CN B008114781A CN 00811478 A CN00811478 A CN 00811478A CN 1252802 C CN1252802 C CN 1252802C
- Authority
- CN
- China
- Prior art keywords
- etching liquid
- acid
- oxide
- bismuth
- oxidation film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 109
- 238000005530 etching Methods 0.000 title claims abstract description 108
- 229910052797 bismuth Inorganic materials 0.000 title claims abstract description 20
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 229910000416 bismuth oxide Inorganic materials 0.000 claims abstract description 19
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 81
- 230000003647 oxidation Effects 0.000 claims description 36
- 238000007254 oxidation reaction Methods 0.000 claims description 36
- 150000007522 mineralic acids Chemical class 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 19
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 18
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 18
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 16
- VNSWULZVUKFJHK-UHFFFAOYSA-N [Sr].[Bi] Chemical compound [Sr].[Bi] VNSWULZVUKFJHK-UHFFFAOYSA-N 0.000 claims description 15
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 13
- 238000000137 annealing Methods 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 12
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 150000007513 acids Chemical class 0.000 claims description 10
- 150000001298 alcohols Chemical class 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011149 active material Substances 0.000 claims description 9
- 150000003839 salts Chemical class 0.000 claims description 9
- 229910002115 bismuth titanate Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 7
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical group S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 6
- KVBCYCWRDBDGBG-UHFFFAOYSA-N azane;dihydrofluoride Chemical group [NH4+].F.[F-] KVBCYCWRDBDGBG-UHFFFAOYSA-N 0.000 claims description 6
- 235000019260 propionic acid Nutrition 0.000 claims description 6
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 6
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 claims description 5
- 235000019270 ammonium chloride Nutrition 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 229910052747 lanthanoid Inorganic materials 0.000 claims description 4
- 150000002602 lanthanoids Chemical class 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 4
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 4
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims 2
- 239000010408 film Substances 0.000 description 40
- 238000010790 dilution Methods 0.000 description 7
- 239000012895 dilution Substances 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000009533 lab test Methods 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- AHKZTVQIVOEVFO-UHFFFAOYSA-N oxide(2-) Chemical compound [O-2] AHKZTVQIVOEVFO-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Weting (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Semiconductor Memories (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
刻蚀液1 | 刻蚀液1a | 刻蚀液1b | 刻蚀液2 | 刻蚀液2a | 刻蚀液2b | |
HNO3(g) | 4.42 | 4.42 | 4.42 | 4.55 | 4.55 | 4.55 |
HNO3(重量%) | 54.9 | 27.5 | 18.3 | 51.1 | 25.6 | 17.0 |
NH4F(g) | 1.25 | 1.25 | 1.25 | --- | --- | --- |
NH4F(重量%) | 15.5 | 7.8 | 5.2 | --- | --- | --- |
NH4HF2(g) | --- | --- | --- | 1.9 | 1.9 | 1.9 |
NH4HF2(重量%) | --- | --- | --- | 21.4 | 10.7 | 7.1 |
H2O (g) | 2.38 | 10.43 | 18.48 | 2.45 | 11.35 | 20.25 |
H2O(重量%) | 29.6 | 64.8 | 76.5 | 27.5 | 63.8 | 75.8 |
溶液 | 刻蚀时间(sec.) | 说明 |
1 | 10 | 残余物 |
1a | 30 | |
1b | 90 | |
2 | 5 | 残余物 |
2a | 20 | |
2b | 60 |
Claims (54)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19937503A DE19937503C1 (de) | 1999-08-09 | 1999-08-09 | Verfahren zum Ätzen von wismuthaltigen Oxidfilmen |
DE19937503.8 | 1999-08-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1399792A CN1399792A (zh) | 2003-02-26 |
CN1252802C true CN1252802C (zh) | 2006-04-19 |
Family
ID=7917703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB008114781A Expired - Fee Related CN1252802C (zh) | 1999-08-09 | 2000-08-09 | 刻蚀含铋氧化物膜的方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6669857B2 (zh) |
EP (1) | EP1203405A2 (zh) |
JP (1) | JP2003506895A (zh) |
KR (1) | KR100463364B1 (zh) |
CN (1) | CN1252802C (zh) |
DE (1) | DE19937503C1 (zh) |
TW (1) | TW466635B (zh) |
WO (1) | WO2001011673A2 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10244862B4 (de) * | 2002-09-23 | 2006-09-14 | IHP GmbH - Innovations for High Performance Microelectronics/Institut für innovative Mikroelektronik | Verfahren zur Herstellung eines elektronischen Bauelements mit einer Praseodymoxid-Schicht |
US20040188385A1 (en) * | 2003-03-26 | 2004-09-30 | Kenji Yamada | Etching agent composition for thin films having high permittivity and process for etching |
US20090212021A1 (en) * | 2005-06-13 | 2009-08-27 | Advanced Technology Materials, Inc. | Compositions and methods for selective removal of metal or metal alloy after metal silicide formation |
KR101294906B1 (ko) | 2006-11-16 | 2013-08-08 | 동우 화인켐 주식회사 | 반도체 소자 제조공정의 선택적 식각액 |
TW200833871A (en) * | 2006-11-17 | 2008-08-16 | Sachem Inc | Selective metal wet etch composition and process |
WO2010086745A1 (en) * | 2009-02-02 | 2010-08-05 | Atmi Taiwan Co., Ltd. | Method of etching lanthanum-containing oxide layers |
JP2013102089A (ja) * | 2011-11-09 | 2013-05-23 | Adeka Corp | チタン酸鉛系材料用エッチング剤組成物 |
KR20140086669A (ko) * | 2012-12-28 | 2014-07-08 | 동우 화인켐 주식회사 | 금속 산화물막의 식각액 조성물 |
KR20140086668A (ko) * | 2012-12-28 | 2014-07-08 | 동우 화인켐 주식회사 | 금속 산화물막의 식각액 조성물 |
KR20140086666A (ko) * | 2012-12-28 | 2014-07-08 | 동우 화인켐 주식회사 | 금속 산화물막의 식각액 조성물 |
KR102456079B1 (ko) * | 2014-12-24 | 2022-11-21 | 삼성디스플레이 주식회사 | 산화물 제거용 세정 조성물 및 이를 이용한 세정 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3925079A (en) * | 1972-06-16 | 1975-12-09 | Richard W F Hager | Decorative article and method of making same |
JPS5810852A (ja) * | 1981-07-10 | 1983-01-21 | Fujitsu Ltd | 半導体装置 |
US4759823A (en) | 1987-06-02 | 1988-07-26 | Krysalis Corporation | Method for patterning PLZT thin films |
US5407855A (en) * | 1993-06-07 | 1995-04-18 | Motorola, Inc. | Process for forming a semiconductor device having a reducing/oxidizing conductive material |
US5873977A (en) * | 1994-09-02 | 1999-02-23 | Sharp Kabushiki Kaisha | Dry etching of layer structure oxides |
US5708302A (en) * | 1995-04-26 | 1998-01-13 | Symetrix Corporation | Bottom electrode structure for dielectric capacitors |
EP0968979A1 (en) * | 1998-06-30 | 2000-01-05 | Siemens Aktiengesellschaft | Etching of Bi-based metal oxides ceramics |
-
1999
- 1999-08-09 DE DE19937503A patent/DE19937503C1/de not_active Expired - Fee Related
-
2000
- 2000-08-09 EP EP00958225A patent/EP1203405A2/de not_active Withdrawn
- 2000-08-09 CN CNB008114781A patent/CN1252802C/zh not_active Expired - Fee Related
- 2000-08-09 JP JP2001516233A patent/JP2003506895A/ja active Pending
- 2000-08-09 KR KR10-2002-7001722A patent/KR100463364B1/ko not_active IP Right Cessation
- 2000-08-09 WO PCT/DE2000/002652 patent/WO2001011673A2/de not_active Application Discontinuation
- 2000-08-10 TW TW089115935A patent/TW466635B/zh not_active IP Right Cessation
-
2002
- 2002-02-11 US US10/073,829 patent/US6669857B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2001011673A2 (de) | 2001-02-15 |
WO2001011673A3 (de) | 2001-07-05 |
EP1203405A2 (de) | 2002-05-08 |
US20020130105A1 (en) | 2002-09-19 |
KR20020027531A (ko) | 2002-04-13 |
JP2003506895A (ja) | 2003-02-18 |
CN1399792A (zh) | 2003-02-26 |
DE19937503C1 (de) | 2001-01-04 |
TW466635B (en) | 2001-12-01 |
US6669857B2 (en) | 2003-12-30 |
KR100463364B1 (ko) | 2004-12-29 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Owner name: INFINEON TECHNOLOGIES AG Free format text: FORMER NAME: INFENNIAN TECHNOLOGIES AG |
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CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: INFINEON TECHNOLOGIES AG |
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