CN1250777C - 局部电镀带状金属基材的方法 - Google Patents

局部电镀带状金属基材的方法 Download PDF

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Publication number
CN1250777C
CN1250777C CNB02814614XA CN02814614A CN1250777C CN 1250777 C CN1250777 C CN 1250777C CN B02814614X A CNB02814614X A CN B02814614XA CN 02814614 A CN02814614 A CN 02814614A CN 1250777 C CN1250777 C CN 1250777C
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CN
China
Prior art keywords
paint
lacquer
strip
banding substrate
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB02814614XA
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English (en)
Chinese (zh)
Other versions
CN1533449A (zh
Inventor
M·科特西亚斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INGO MITLER IMO AG
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INGO MITLER IMO AG
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Publication date
Application filed by INGO MITLER IMO AG filed Critical INGO MITLER IMO AG
Publication of CN1533449A publication Critical patent/CN1533449A/zh
Application granted granted Critical
Publication of CN1250777C publication Critical patent/CN1250777C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
CNB02814614XA 2001-07-20 2002-06-20 局部电镀带状金属基材的方法 Expired - Fee Related CN1250777C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10135349.9 2001-07-20
DE10135349A DE10135349A1 (de) 2001-07-20 2001-07-20 Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials

Publications (2)

Publication Number Publication Date
CN1533449A CN1533449A (zh) 2004-09-29
CN1250777C true CN1250777C (zh) 2006-04-12

Family

ID=7692468

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB02814614XA Expired - Fee Related CN1250777C (zh) 2001-07-20 2002-06-20 局部电镀带状金属基材的方法

Country Status (7)

Country Link
US (1) US6972082B2 (https=)
EP (1) EP1409772B2 (https=)
JP (1) JP2004536971A (https=)
CN (1) CN1250777C (https=)
AT (1) ATE291110T1 (https=)
DE (2) DE10135349A1 (https=)
WO (1) WO2003012175A2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4660231B2 (ja) * 2005-03-10 2011-03-30 株式会社シミズ 表面処理方法およびそれを用いる電子部品の製造方法
SG191114A1 (en) * 2010-12-23 2013-07-31 Framatome Connectors Int Plating method and apparatus, and strip obtained by this method
CN102888632B (zh) * 2012-09-14 2014-12-03 艾蒂盟斯（苏州）压铸电子技术有限公司 一种选择性电镀的防护工装和方法
CN103173839B (zh) * 2013-03-22 2015-11-18 湖南永盛新材料股份有限公司 一种金属带材单面连续电泳沉积的方法及装置
CN105239118B (zh) * 2014-06-17 2017-10-31 于长弘 电镀治具
CN107059078B (zh) * 2017-04-21 2020-02-18 东莞领益精密制造科技有限公司 一种金属零件局部精密镀锡加工工艺
JP7221003B2 (ja) * 2017-08-31 2023-02-13 Ｄｏｗａメタルテック株式会社 部分めっき方法
CN110923783B (zh) * 2019-11-20 2021-05-25 娄底市安地亚斯电子陶瓷有限公司 一种轮毂型电镀超薄金刚石切割片的制作方法
FR3117131B1 (fr) * 2020-12-03 2022-12-09 Safran Electronics & Defense Procede de protection d’une piece en alliage a base d’aluminium
CN112934582B (zh) * 2021-02-08 2022-04-26 浙江东尼电子股份有限公司 一种毛毡涂漆装置及漆包线
CN113089063A (zh) * 2021-04-14 2021-07-09 王曼曼 连续电镀装置及连续电镀方法
CN116180175A (zh) * 2023-01-06 2023-05-30 长春捷翼汽车科技股份有限公司 一种插拔件端子的孔内局部电镀工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4432855A (en) † 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
DD246575A1 (de) † 1986-03-14 1987-06-10 Seghers A Mikroelektronik Veb Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern
US4877644A (en) † 1988-04-12 1989-10-31 Amp Incorporated Selective plating by laser ablation
US5035918A (en) * 1989-04-26 1991-07-30 Amp Incorporated Non-flammable and strippable plating resist and method of using same
NL9300174A (nl) † 1993-01-28 1994-08-16 Meco Equip Eng Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.
US6143145A (en) * 1997-10-02 2000-11-07 Precious Plate Inc. Apparatus for continuous masking for selective electroplating and method
SG76591A1 (en) 1999-02-27 2000-11-21 Aem Tech Engineers Pte Ltd Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
DE19934584A1 (de) 1999-07-23 2001-01-25 Inovan Stroebe Verfahren zum Herstellen von Kontakten

Also Published As

Publication number Publication date
DE10135349A1 (de) 2003-02-06
JP2004536971A (ja) 2004-12-09
WO2003012175A3 (de) 2003-10-30
CN1533449A (zh) 2004-09-29
EP1409772B1 (de) 2005-03-16
EP1409772A2 (de) 2004-04-21
US20040206629A1 (en) 2004-10-21
US6972082B2 (en) 2005-12-06
HK1069607A1 (en) 2005-05-27
WO2003012175A2 (de) 2003-02-13
DE50202493D1 (de) 2005-04-21
ATE291110T1 (de) 2005-04-15
EP1409772B2 (de) 2008-08-13

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