JP2004536971A - ストリップ形状の金属製支持材料に対する選択的電気めっき方法 - Google Patents
ストリップ形状の金属製支持材料に対する選択的電気めっき方法 Download PDFInfo
- Publication number
- JP2004536971A JP2004536971A JP2003517344A JP2003517344A JP2004536971A JP 2004536971 A JP2004536971 A JP 2004536971A JP 2003517344 A JP2003517344 A JP 2003517344A JP 2003517344 A JP2003517344 A JP 2003517344A JP 2004536971 A JP2004536971 A JP 2004536971A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- substrate material
- coating
- strip
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000009713 electroplating Methods 0.000 title claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 9
- 239000002184 metal Substances 0.000 title claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 75
- 239000008199 coating composition Substances 0.000 claims description 66
- 239000000203 mixture Substances 0.000 claims description 56
- 238000000151 deposition Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000000873 masking effect Effects 0.000 claims description 3
- 239000003792 electrolyte Substances 0.000 claims description 2
- 239000003929 acidic solution Substances 0.000 claims 1
- 239000012670 alkaline solution Substances 0.000 claims 1
- 238000009987 spinning Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 239000003973 paint Substances 0.000 abstract 6
- 238000010924 continuous production Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001652 electrophoretic deposition Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002783 friction material Substances 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/917—Treatment of workpiece between coating steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10135349A DE10135349A1 (de) | 2001-07-20 | 2001-07-20 | Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials |
| PCT/EP2002/006824 WO2003012175A2 (de) | 2001-07-20 | 2002-06-20 | Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004536971A true JP2004536971A (ja) | 2004-12-09 |
| JP2004536971A5 JP2004536971A5 (https=) | 2005-12-22 |
Family
ID=7692468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003517344A Pending JP2004536971A (ja) | 2001-07-20 | 2002-06-20 | ストリップ形状の金属製支持材料に対する選択的電気めっき方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6972082B2 (https=) |
| EP (1) | EP1409772B2 (https=) |
| JP (1) | JP2004536971A (https=) |
| CN (1) | CN1250777C (https=) |
| AT (1) | ATE291110T1 (https=) |
| DE (2) | DE10135349A1 (https=) |
| WO (1) | WO2003012175A2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006249509A (ja) * | 2005-03-10 | 2006-09-21 | Shimizu:Kk | 表面処理方法およびそれを用いる電子部品の製造方法 |
| JP2019044262A (ja) * | 2017-08-31 | 2019-03-22 | Ｄｏｗａメタルテック株式会社 | 部分めっき方法 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG191114A1 (en) * | 2010-12-23 | 2013-07-31 | Framatome Connectors Int | Plating method and apparatus, and strip obtained by this method |
| CN102888632B (zh) * | 2012-09-14 | 2014-12-03 | 艾蒂盟斯（苏州）压铸电子技术有限公司 | 一种选择性电镀的防护工装和方法 |
| CN103173839B (zh) * | 2013-03-22 | 2015-11-18 | 湖南永盛新材料股份有限公司 | 一种金属带材单面连续电泳沉积的方法及装置 |
| CN105239118B (zh) * | 2014-06-17 | 2017-10-31 | 于长弘 | 电镀治具 |
| CN107059078B (zh) * | 2017-04-21 | 2020-02-18 | 东莞领益精密制造科技有限公司 | 一种金属零件局部精密镀锡加工工艺 |
| CN110923783B (zh) * | 2019-11-20 | 2021-05-25 | 娄底市安地亚斯电子陶瓷有限公司 | 一种轮毂型电镀超薄金刚石切割片的制作方法 |
| FR3117131B1 (fr) * | 2020-12-03 | 2022-12-09 | Safran Electronics & Defense | Procede de protection d’une piece en alliage a base d’aluminium |
| CN112934582B (zh) * | 2021-02-08 | 2022-04-26 | 浙江东尼电子股份有限公司 | 一种毛毡涂漆装置及漆包线 |
| CN113089063A (zh) * | 2021-04-14 | 2021-07-09 | 王曼曼 | 连续电镀装置及连续电镀方法 |
| CN116180175A (zh) * | 2023-01-06 | 2023-05-30 | 长春捷翼汽车科技股份有限公司 | 一种插拔件端子的孔内局部电镀工艺 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4432855A (en) † | 1982-09-30 | 1984-02-21 | International Business Machines Corporation | Automated system for laser mask definition for laser enhanced and conventional plating and etching |
| DD246575A1 (de) † | 1986-03-14 | 1987-06-10 | Seghers A Mikroelektronik Veb | Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern |
| US4877644A (en) † | 1988-04-12 | 1989-10-31 | Amp Incorporated | Selective plating by laser ablation |
| US5035918A (en) * | 1989-04-26 | 1991-07-30 | Amp Incorporated | Non-flammable and strippable plating resist and method of using same |
| NL9300174A (nl) † | 1993-01-28 | 1994-08-16 | Meco Equip Eng | Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten. |
| US6143145A (en) * | 1997-10-02 | 2000-11-07 | Precious Plate Inc. | Apparatus for continuous masking for selective electroplating and method |
| SG76591A1 (en) | 1999-02-27 | 2000-11-21 | Aem Tech Engineers Pte Ltd | Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
| DE19934584A1 (de) | 1999-07-23 | 2001-01-25 | Inovan Stroebe | Verfahren zum Herstellen von Kontakten |
-
2001
- 2001-07-20 DE DE10135349A patent/DE10135349A1/de not_active Withdrawn
-
2002
- 2002-06-20 JP JP2003517344A patent/JP2004536971A/ja active Pending
- 2002-06-20 AT AT02754718T patent/ATE291110T1/de active
- 2002-06-20 DE DE50202493T patent/DE50202493D1/de not_active Expired - Lifetime
- 2002-06-20 US US10/484,205 patent/US6972082B2/en not_active Expired - Fee Related
- 2002-06-20 WO PCT/EP2002/006824 patent/WO2003012175A2/de not_active Ceased
- 2002-06-20 CN CNB02814614XA patent/CN1250777C/zh not_active Expired - Fee Related
- 2002-06-20 EP EP02754718A patent/EP1409772B2/de not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006249509A (ja) * | 2005-03-10 | 2006-09-21 | Shimizu:Kk | 表面処理方法およびそれを用いる電子部品の製造方法 |
| JP2019044262A (ja) * | 2017-08-31 | 2019-03-22 | Ｄｏｗａメタルテック株式会社 | 部分めっき方法 |
| JP7221003B2 (ja) | 2017-08-31 | 2023-02-13 | Ｄｏｗａメタルテック株式会社 | 部分めっき方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE10135349A1 (de) | 2003-02-06 |
| WO2003012175A3 (de) | 2003-10-30 |
| CN1533449A (zh) | 2004-09-29 |
| EP1409772B1 (de) | 2005-03-16 |
| EP1409772A2 (de) | 2004-04-21 |
| US20040206629A1 (en) | 2004-10-21 |
| US6972082B2 (en) | 2005-12-06 |
| HK1069607A1 (en) | 2005-05-27 |
| WO2003012175A2 (de) | 2003-02-13 |
| DE50202493D1 (de) | 2005-04-21 |
| ATE291110T1 (de) | 2005-04-15 |
| CN1250777C (zh) | 2006-04-12 |
| EP1409772B2 (de) | 2008-08-13 |
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