CN1250777C - 局部电镀带状金属基材的方法 - Google Patents

局部电镀带状金属基材的方法 Download PDF

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Publication number
CN1250777C
CN1250777C CNB02814614XA CN02814614A CN1250777C CN 1250777 C CN1250777 C CN 1250777C CN B02814614X A CNB02814614X A CN B02814614XA CN 02814614 A CN02814614 A CN 02814614A CN 1250777 C CN1250777 C CN 1250777C
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CN
China
Prior art keywords
lacquer
bar
plating
paint
banding substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB02814614XA
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English (en)
Chinese (zh)
Other versions
CN1533449A (zh
Inventor
M·科特西亚斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INGO MITLER IMO AG
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INGO MITLER IMO AG
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Publication date
Application filed by INGO MITLER IMO AG filed Critical INGO MITLER IMO AG
Publication of CN1533449A publication Critical patent/CN1533449A/zh
Application granted granted Critical
Publication of CN1250777C publication Critical patent/CN1250777C/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
CNB02814614XA 2001-07-20 2002-06-20 局部电镀带状金属基材的方法 Expired - Fee Related CN1250777C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10135349.9 2001-07-20
DE10135349A DE10135349A1 (de) 2001-07-20 2001-07-20 Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials

Publications (2)

Publication Number Publication Date
CN1533449A CN1533449A (zh) 2004-09-29
CN1250777C true CN1250777C (zh) 2006-04-12

Family

ID=7692468

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB02814614XA Expired - Fee Related CN1250777C (zh) 2001-07-20 2002-06-20 局部电镀带状金属基材的方法

Country Status (7)

Country Link
US (1) US6972082B2 (enExample)
EP (1) EP1409772B2 (enExample)
JP (1) JP2004536971A (enExample)
CN (1) CN1250777C (enExample)
AT (1) ATE291110T1 (enExample)
DE (2) DE10135349A1 (enExample)
WO (1) WO2003012175A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4660231B2 (ja) * 2005-03-10 2011-03-30 株式会社シミズ 表面処理方法およびそれを用いる電子部品の製造方法
SG191114A1 (en) * 2010-12-23 2013-07-31 Framatome Connectors Int Plating method and apparatus, and strip obtained by this method
CN102888632B (zh) * 2012-09-14 2014-12-03 艾蒂盟斯（苏州）压铸电子技术有限公司 一种选择性电镀的防护工装和方法
CN103173839B (zh) * 2013-03-22 2015-11-18 湖南永盛新材料股份有限公司 一种金属带材单面连续电泳沉积的方法及装置
CN105239118B (zh) * 2014-06-17 2017-10-31 于长弘 电镀治具
CN107059078B (zh) * 2017-04-21 2020-02-18 东莞领益精密制造科技有限公司 一种金属零件局部精密镀锡加工工艺
JP7221003B2 (ja) * 2017-08-31 2023-02-13 Ｄｏｗａメタルテック株式会社 部分めっき方法
CN110923783B (zh) * 2019-11-20 2021-05-25 娄底市安地亚斯电子陶瓷有限公司 一种轮毂型电镀超薄金刚石切割片的制作方法
FR3117131B1 (fr) * 2020-12-03 2022-12-09 Safran Electronics & Defense Procede de protection d’une piece en alliage a base d’aluminium
CN112934582B (zh) * 2021-02-08 2022-04-26 浙江东尼电子股份有限公司 一种毛毡涂漆装置及漆包线
CN113089063A (zh) * 2021-04-14 2021-07-09 王曼曼 连续电镀装置及连续电镀方法
CN116180175A (zh) * 2023-01-06 2023-05-30 长春捷翼汽车科技股份有限公司 一种插拔件端子的孔内局部电镀工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4432855A (en) † 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
DD246575A1 (de) † 1986-03-14 1987-06-10 Seghers A Mikroelektronik Veb Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern
US4877644A (en) † 1988-04-12 1989-10-31 Amp Incorporated Selective plating by laser ablation
US5035918A (en) * 1989-04-26 1991-07-30 Amp Incorporated Non-flammable and strippable plating resist and method of using same
NL9300174A (nl) † 1993-01-28 1994-08-16 Meco Equip Eng Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.
US6143145A (en) * 1997-10-02 2000-11-07 Precious Plate Inc. Apparatus for continuous masking for selective electroplating and method
SG76591A1 (en) 1999-02-27 2000-11-21 Aem Tech Engineers Pte Ltd Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
DE19934584A1 (de) 1999-07-23 2001-01-25 Inovan Stroebe Verfahren zum Herstellen von Kontakten

Also Published As

Publication number Publication date
EP1409772B1 (de) 2005-03-16
DE10135349A1 (de) 2003-02-06
CN1533449A (zh) 2004-09-29
US6972082B2 (en) 2005-12-06
DE50202493D1 (de) 2005-04-21
EP1409772A2 (de) 2004-04-21
JP2004536971A (ja) 2004-12-09
HK1069607A1 (en) 2005-05-27
ATE291110T1 (de) 2005-04-15
EP1409772B2 (de) 2008-08-13
WO2003012175A3 (de) 2003-10-30
WO2003012175A2 (de) 2003-02-13
US20040206629A1 (en) 2004-10-21

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