JP2004536971A - ストリップ形状の金属製支持材料に対する選択的電気めっき方法 - Google Patents
ストリップ形状の金属製支持材料に対する選択的電気めっき方法 Download PDFInfo
- Publication number
- JP2004536971A JP2004536971A JP2003517344A JP2003517344A JP2004536971A JP 2004536971 A JP2004536971 A JP 2004536971A JP 2003517344 A JP2003517344 A JP 2003517344A JP 2003517344 A JP2003517344 A JP 2003517344A JP 2004536971 A JP2004536971 A JP 2004536971A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- substrate material
- coating
- strip
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000009713 electroplating Methods 0.000 title claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 9
- 239000002184 metal Substances 0.000 title claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 75
- 239000008199 coating composition Substances 0.000 claims description 66
- 239000000203 mixture Substances 0.000 claims description 56
- 238000000151 deposition Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000000873 masking effect Effects 0.000 claims description 3
- 239000003792 electrolyte Substances 0.000 claims description 2
- 239000003929 acidic solution Substances 0.000 claims 1
- 239000012670 alkaline solution Substances 0.000 claims 1
- 238000009987 spinning Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 239000003973 paint Substances 0.000 abstract 6
- 238000010924 continuous production Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001652 electrophoretic deposition Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002783 friction material Substances 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/917—Treatment of workpiece between coating steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10135349A DE10135349A1 (de) | 2001-07-20 | 2001-07-20 | Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials |
| PCT/EP2002/006824 WO2003012175A2 (de) | 2001-07-20 | 2002-06-20 | Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004536971A true JP2004536971A (ja) | 2004-12-09 |
| JP2004536971A5 JP2004536971A5 (enExample) | 2005-12-22 |
Family
ID=7692468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003517344A Pending JP2004536971A (ja) | 2001-07-20 | 2002-06-20 | ストリップ形状の金属製支持材料に対する選択的電気めっき方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6972082B2 (enExample) |
| EP (1) | EP1409772B2 (enExample) |
| JP (1) | JP2004536971A (enExample) |
| CN (1) | CN1250777C (enExample) |
| AT (1) | ATE291110T1 (enExample) |
| DE (2) | DE10135349A1 (enExample) |
| WO (1) | WO2003012175A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006249509A (ja) * | 2005-03-10 | 2006-09-21 | Shimizu:Kk | 表面処理方法およびそれを用いる電子部品の製造方法 |
| JP2019044262A (ja) * | 2017-08-31 | 2019-03-22 | Ｄｏｗａメタルテック株式会社 | 部分めっき方法 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG191114A1 (en) * | 2010-12-23 | 2013-07-31 | Framatome Connectors Int | Plating method and apparatus, and strip obtained by this method |
| CN102888632B (zh) * | 2012-09-14 | 2014-12-03 | 艾蒂盟斯（苏州）压铸电子技术有限公司 | 一种选择性电镀的防护工装和方法 |
| CN103173839B (zh) * | 2013-03-22 | 2015-11-18 | 湖南永盛新材料股份有限公司 | 一种金属带材单面连续电泳沉积的方法及装置 |
| CN105239118B (zh) * | 2014-06-17 | 2017-10-31 | 于长弘 | 电镀治具 |
| CN107059078B (zh) * | 2017-04-21 | 2020-02-18 | 东莞领益精密制造科技有限公司 | 一种金属零件局部精密镀锡加工工艺 |
| CN110923783B (zh) * | 2019-11-20 | 2021-05-25 | 娄底市安地亚斯电子陶瓷有限公司 | 一种轮毂型电镀超薄金刚石切割片的制作方法 |
| FR3117131B1 (fr) * | 2020-12-03 | 2022-12-09 | Safran Electronics & Defense | Procede de protection d’une piece en alliage a base d’aluminium |
| CN112934582B (zh) * | 2021-02-08 | 2022-04-26 | 浙江东尼电子股份有限公司 | 一种毛毡涂漆装置及漆包线 |
| CN113089063A (zh) * | 2021-04-14 | 2021-07-09 | 王曼曼 | 连续电镀装置及连续电镀方法 |
| CN116180175A (zh) * | 2023-01-06 | 2023-05-30 | 长春捷翼汽车科技股份有限公司 | 一种插拔件端子的孔内局部电镀工艺 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4432855A (en) † | 1982-09-30 | 1984-02-21 | International Business Machines Corporation | Automated system for laser mask definition for laser enhanced and conventional plating and etching |
| DD246575A1 (de) † | 1986-03-14 | 1987-06-10 | Seghers A Mikroelektronik Veb | Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern |
| US4877644A (en) † | 1988-04-12 | 1989-10-31 | Amp Incorporated | Selective plating by laser ablation |
| US5035918A (en) * | 1989-04-26 | 1991-07-30 | Amp Incorporated | Non-flammable and strippable plating resist and method of using same |
| NL9300174A (nl) † | 1993-01-28 | 1994-08-16 | Meco Equip Eng | Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten. |
| US6143145A (en) * | 1997-10-02 | 2000-11-07 | Precious Plate Inc. | Apparatus for continuous masking for selective electroplating and method |
| SG76591A1 (en) | 1999-02-27 | 2000-11-21 | Aem Tech Engineers Pte Ltd | Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
| DE19934584A1 (de) | 1999-07-23 | 2001-01-25 | Inovan Stroebe | Verfahren zum Herstellen von Kontakten |
-
2001
- 2001-07-20 DE DE10135349A patent/DE10135349A1/de not_active Withdrawn
-
2002
- 2002-06-20 EP EP02754718A patent/EP1409772B2/de not_active Expired - Lifetime
- 2002-06-20 CN CNB02814614XA patent/CN1250777C/zh not_active Expired - Fee Related
- 2002-06-20 JP JP2003517344A patent/JP2004536971A/ja active Pending
- 2002-06-20 US US10/484,205 patent/US6972082B2/en not_active Expired - Fee Related
- 2002-06-20 AT AT02754718T patent/ATE291110T1/de active
- 2002-06-20 DE DE50202493T patent/DE50202493D1/de not_active Expired - Lifetime
- 2002-06-20 WO PCT/EP2002/006824 patent/WO2003012175A2/de not_active Ceased
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006249509A (ja) * | 2005-03-10 | 2006-09-21 | Shimizu:Kk | 表面処理方法およびそれを用いる電子部品の製造方法 |
| JP2019044262A (ja) * | 2017-08-31 | 2019-03-22 | Ｄｏｗａメタルテック株式会社 | 部分めっき方法 |
| JP7221003B2 (ja) | 2017-08-31 | 2023-02-13 | Ｄｏｗａメタルテック株式会社 | 部分めっき方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1409772B1 (de) | 2005-03-16 |
| DE10135349A1 (de) | 2003-02-06 |
| CN1533449A (zh) | 2004-09-29 |
| CN1250777C (zh) | 2006-04-12 |
| US6972082B2 (en) | 2005-12-06 |
| DE50202493D1 (de) | 2005-04-21 |
| EP1409772A2 (de) | 2004-04-21 |
| HK1069607A1 (en) | 2005-05-27 |
| ATE291110T1 (de) | 2005-04-15 |
| EP1409772B2 (de) | 2008-08-13 |
| WO2003012175A3 (de) | 2003-10-30 |
| WO2003012175A2 (de) | 2003-02-13 |
| US20040206629A1 (en) | 2004-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004536971A (ja) | ストリップ形状の金属製支持材料に対する選択的電気めっき方法 | |
| US8529738B2 (en) | In situ plating and etching of materials covered with a surface film | |
| US4264416A (en) | Method for continuous application of strip ribbon or patch-shaped coatings to a metal tape | |
| JPH024678B2 (enExample) | ||
| JPH0149795B2 (enExample) | ||
| JP4521146B2 (ja) | 電気絶縁の箔材料の表面上で電気的に互いに絶縁された導電性構造を電解処理するための方法及び装置並びに上記方法の使用法 | |
| US4132617A (en) | Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape | |
| JP2004536971A5 (enExample) | ||
| JPH0246677B2 (enExample) | ||
| CA2403116A1 (en) | Electro-plating apparatus and a method of electro-plating | |
| JPH09217191A (ja) | 電鋳による貴金属の精密加工方法 | |
| HK1069607B (en) | Method for selectively electroplating a strip-shaped, metal support material | |
| JPH0577748B2 (enExample) | ||
| JPH0534428B2 (enExample) | ||
| JPH08225986A (ja) | 電着方法とその装置 | |
| US12351935B2 (en) | Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate | |
| JP2023028718A (ja) | メッキ方法 | |
| US3808107A (en) | Method of reducing the diameter of apertures | |
| NL8200758A (nl) | Werkwijze en inrichting voor het selectief bekleden. | |
| JPH08269783A (ja) | 電着方法とその装置 | |
| KR20240025040A (ko) | 기판 액 처리 장치 및 기판 액 처리 방법 | |
| JPH0317298A (ja) | 均一部分電気メッキ法 | |
| KR20110029899A (ko) | 도금방지막을 이용한 부분 도금 장치 및 부분 도금 방법 | |
| JPS61295395A (ja) | コネクタ端子のブラシメツキ方法 | |
| JP2004289015A (ja) | 三次元回路基板の製造方法及び三次元回路基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050427 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050427 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080519 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080527 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080826 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080924 |