CN1242480A - 滑动轴承及其制造方法 - Google Patents
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Abstract
描述了一种滑动轴承,其表层(3)就耐磨性来说与用电镀和传统的电子束气相沉积方法涂覆的表层相比具有显著地改善了的性能。表层(3)的表面包括圆形凸起部分(4)和凹陷部分(6),其中,就水平截平面(7)来说,其凸起部分(4)占滑动轴承整个表面面积的比例等于30%～50%,该截平面(7)处于这样的高度,即在垂直截面内得到的由凸起部分(4)构成的表面面积的总比例等于由凹陷部分(6)构成的相应的总比例。圆形凸起部分在平面图上具有直径D=3～8μm,其中,在凸起部分(4)和凹陷部分(6)在平面图中不是圆形的情况下,该直径值指的是最大直径。该表面具有粗糙度Rz=3～7μm。制造这种滑动轴承的方法是基于电子束气相沉积,其中采用粗糙度RZ≤2μm的支承件并且表层的气相沉积在压力< 0.1Pa下进行。
Description
本发明涉及滑动轴承，它包括一支承件和至少一个金属表层，该表层借助电子束气相沉积加以涂覆。本发明还涉及按权利要求4所表征的内容制造具有这样表层的滑动轴承的方法。
滑动轴承是例如径向轴承、止推轴承和径向止推轴承，其功能区域为平面或曲面形式，涂覆在成品状态或在中间阶段，例如半成品阶段(平面形式的带或带部分)来施行。
通常，这种用途的滑动轴承包括下列结构的多层复合层系：用作支承材料的钢支承件，Cu、Al或白金属合金的轴承金属层和所谓滑动层或第三层或表层；该表层的涂覆可采用电镀法(E.Rmer：GLYCO 40的三元合金轴承；GLYCO工程报告8/67)或采用阴极溅射法如欧洲专利EP 0 256 226 B1中所述。电镀涂覆层一般是以Pb或Sn为基础，其缺点是耐腐蚀性常常不足和耐磨性低。并且电镀本身由环境观点看是不利的。
采用溅射法涂覆表层，由于其可达到的低的沉积率和需要的设备的高度技术复杂性对整个滑动轴承带来相当大的成本指数。
此外，由DE 43 90 686 T1已知：这些具有特殊表面结构(在用电镀沉积的Pb层表面上的棱锥体形晶粒)的表层具有优越的粘结强度和疲劳强度。这种情况可归因于通过表面的棱锥体形晶粒对油的良好保存和对集中施加的载荷的分散与减缓。该方法的缺点是：采用电镀法同样具有所有伴随的缺点，并且制造这样的特殊的表面结构是很昂贵的，由于这是一多阶段过程并具有附加的热处理。并且，该表面层由有争议的毒性的铅合金组成。
DE 196 08 028 A1同样描述了一种特殊滑动表面结构，它对滑动性能具有有利的影响。表面腐蚀敏感性的克服通过表面上的六角棱锥体形金属晶体或通过将氧和磷等嵌入棱锥体的侧面(硬化效应)。该方法只用于铁基合金，其特别构造的滑动表面由Fe晶体组成。一典型的应用是活塞销的涂覆。它们的摩擦学性能使这样的合金不适用于滑动轴承。
还由DE 195 14 835 A1和195 14 836 A1已知借助电子束气相沉积在凹曲面的滑动轴承上沉积表层。采用这种方法有可能通过调整某些方法参数沿滑动轴承全圆周产生特定层厚的外形。在这些文件中没有提到用这种方法可以产生的特殊表面形貌。然而，对于许多应用其可达到的摩擦学性能是不足的。
由DE 36 06 529 A1已知通过将至少一种金属材料气相沉积在一金属基底上制造多层材料或多层工件的方法，同样采用电子束气相沉积法涂覆表层。该方法在10-2～10-3毫巴(mbar)范围的压力下的残余气体气氛中进行，其中材料随着气相沉积同时被弥散硬化或弥散强化。涂覆率设定在约0.3μm/s。在气相沉积过程中，基底保持在200℃与800℃之间的温度。对铝合金的气相沉积，基底的温度为200℃～300℃；对铜-铅合金的气相沉积，基底的温度在500℃至700℃的范围内。没有提到采用这种方法产生的表层形貌。按这种方法制造的层的承载能力显著好于由粉末冶金法制造的表层的承载能力。在许多应用情况下，按这种方法制造滑动轴承并不具有满意的耐磨性。该申请的优先考虑在于通过弥散强化，例如通过气相沉积时产生的氧化物在表层中产生一确定的硬相含量。没有提到表面形状的优化。
本发明的目的是提供一种滑动轴承，其表层的性能就耐磨性方面与电镀和传统的电子束气相沉积法涂覆的表层相比显著得到改善。本发明另一目的是提供制造这样的滑动轴承的方法，该方法简单、经济和对环境无害。
滑动轴承的特征在于表层的表面包括圆形凸起的和凹陷的部分，其中，就一水平截平面来说，其凸起部分占滑动轴承的整个表面面积的比例等于30～50％，该截平面处于这样的高度，即在垂直截面内得到的由凸起部分构成的表面面积的总比例等于由凹陷部分构成的相应的总比例，其特征在于在平面图上该圆形凸起部分具有直径D＝3～8μm，其中，在凸起的和凹陷的部分在平面图中不是圆形的情况下，该直径值指的是最大直径，并且在于其表面具有粗糙度Rz＝3～7μm。
凸起的部分为圆形到椭圆形结构是有利的。术语“圆形的”不仅指凸起部分和凹陷部分在平面图上的形状也指凸起部分和凹陷部分在垂直截面上的形状。
已显示出，初始就是圆形的凸起部分具有胜过已知的棱锥体形状尖的凸起部分的优点，因为对对偶件的磨合过程更为缓和地进行。其中一个原因是圆形凸起部分的压强小于尖的棱锥体形状凸起部分的，因为圆形凸起部分的表面面积的很大部分是承载的。圆形凸起部分远没有尖的凸起部分那样容易磨损，其结果是在磨合期凹陷的深度只有很小的降低，并且在正常工况下，可保持较长时期，由此油在凹陷内的存留也能保证较长时期。这些有利的影响对改善磨损性能具有相当大的帮助。
这样的形貌的另外一些优点在于这样的事实，即在滑动轴承工作于混合摩擦(固体/固体接触)区域的场合，仅仅凸起面积而不是整个轴承表面为固体接触从而降低了摩擦损失。这个优点得到由圆形凸起部分构成的表面面积的比例只等于30～50％这一事实的支持。
对其涂覆表层的支承件有利地由复合材料构成，它包括一钢背和用烧结、铸造或电镀法在其上贴附的一轴承金属合金。还可以任选地设置扩散阻挡层。
表层可由铜合金或铝合金构成。
按照本发明的方法，其特征在于，采用粗糙度为Rz≤2μm的支承件，气相沉积在压力＜0.1Pa下进行，对垂直在蒸发源以上的滑动轴承上的气相沉积率至少为100nm/s以及待涂覆的支承件的温度在表层合金最低熔点的组分的绝对熔点的75％与95％之间。
惊人地显示出，以设定的诸参数，获得了按本发明的形貌。
如果基底的温度提高到最低熔点的合金相的95％的值以上则发生干扰作用，因为最低熔点相的扩散如此显著地增加以致出现表面的光滑性。如果该温度在最低熔点合金相的75％以下，则形成不希望有的柱状结构，因为其承载表面面积的比例显著地小，这种结构导致较高的磨损率。
支承材料的粗糙度可能对形貌有影响只要支承件的凸起部分能形成凝固点，这些凝固点影响涂层的生长。表层的厚度越小，支承件粗糙度的影响越大，用作支承件的材料在这方面也是一个重要的因素。支承件的表面优选在涂覆表层以前经机加工使其粗糙度为Rz＜2μm。
然而，制造滑动轴承的方法不限于用钢/CuPbSn复合材料制造的支承件。钢/铝或钢/白金属复合物也可以同样的方法涂覆。可借助电子束气相沉积涂覆的合适的合金系是例如AlSnPb或AlSnSi和其他铝基合金。同样，CuPb合金也是适用的。
按本发明的方法比例如溅射法是特别经济而更简单的。
以下借助附图更详细地描述本发明的示例性实施方案，其中：
图1为采用本发明的方法涂覆的表层的电子显微镜下的显微图，
图2示出通过图1所示表面的截面，也示出了支承件，以及
图3示出轴承材料的磨损性能图。
按照一优选的示例性实施方案，CuPbSn合金用铸造或烧结方法贴附到一钢带(含碳量在0.03％与0.3％之间)上。在本来已知的各种退火和成形工艺以后，将该带冲压出规定长度的带段来制造轴瓦。用钻孔或拉削对这些轴承进行表面加工以后，通过电镀或物理气相沉积法(PVD)给轴瓦设置镍或镍合金扩散阻挡层。之后将支承件脱脂并放入真空蒸发装置。在该装置中通过溅射和侵蚀方法进行进一步的清洁或活化。接着将支承件由蒸发器坩埚借助轴向电子用电子束气相沉积法涂覆AlSn20Cu。沉积的AlSn20Cu层的厚度为(16±4)μm。
为了确保该AlSn20Cu层采取上述特别优越的表面形貌，在气相沉积的过程中必须遵守以下沉积参数：操作室内的压力在气相沉积过程中不得超过0.1Pa；支承件的温度在涂覆过程中必须处于190℃与200℃之间；电子的功率必须能使沉积率等于至少100nm/s。如果遵守了这些方法参数，则获得的表层如图1用扫描电子显微镜在平面图中所示的那样。
图2示意表示出通过图1所示表层3的截面，其中也示出具有钢背1的支承件和用铸造或烧结方法贴附到支承件1上的CuPbSn合金2。截线7标明水平面的位置，在该水平面位置位于该平面以上的凸起部分4的垂直表面面积的总和等于凹陷部分6的垂直表面面积的总和。
截线5表示在磨合过程中凸起部分4被磨掉的量。凹陷6的深度T1从T1值降至T2值，但仍显著地大于具有棱锥体结构的表层所达到的。
图3示出各种轴承材料在Underwood试验台上确定的磨损性能。图3中号数I-IV表示：
I CuPbSn 电子沉积的
PbSn10Cu2
II CuPbSn 电子沉积的
PbSn10Cu5
III AlSn20Cu0.25 溅射的
IV AlSn20Cu0.25 按本发明气相沉积的
如图3所示，用电子沉积的表层(PbSn10Cu2或PbSn10Cu5)分别在压强50和65MPa下产生显著的磨损。另一方面，溅射的层在整个载荷范围内呈现线性磨损。仍如图3所示，按本发明气相沉积的层就耐磨性来说，特别是在载荷＜50Mpa下，要比电子沉积的层好得多而比溅射的层只稍差一些。
Claims (4)
1.滑动轴承，它包括一支承件和至少一个金属表层，该表层借助电子束气相沉积加以涂覆，其特征在于，表层(3)的表面包括圆形的凸起部分(4)和凹陷部分(6)，其中，就一水平截面(7)来说，其凸起部分(4)占滑动轴承整个表面面积的比例等于30～50％，该截平面(7)处于这样的高度，即在垂直截面内得到的由凸起部分(4)构成的表面面积的总比例等于由凹陷部分(6)构成的相应的总比例，其特征在于在平面图上该圆形凸起部分(4)具有直径D＝3～8μm，其中，在凸起部分(4)和凹陷部分(6)在平面图中不是圆形的情况下，该直径值指的是最大直径，并且在于其表面具有粗糙度Rz＝3～7μm。
2.按照权利要求1的滑动轴承，其特征在于，所述支承件由复合材料构成，它包括一钢背(1)和一轴承金属合金(2)，该轴承金属合金用烧结、铸造或电镀法贴附到钢背(1)上。
3.按照权利要求1或2的滑动轴承，其特征在于表层(3)由铜合金或铝合金构成。
4.对包括至少一个用电子束气相沉积涂覆到支承件的金属合金表层的滑动轴承的制造方法，其特征在于
采用一支承件，其粗糙度Rz≤2μm，
表层的气相沉积在压力＜0.1Pa下进行，
对垂直在蒸发源以上的滑动轴承上的气相沉积率至少为100nm/s，以及
待涂覆的支承件的温度在表层合金的最低熔点组分的绝对熔点的75％与95％之间。
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| DE19824310A DE19824310C1 (de) | 1998-06-02 | 1998-06-02 | Gleitlager und Verfahren zu seiner Herstellung |
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| PL (1) | PL191011B1 (zh) |
| RU (1) | RU2244856C2 (zh) |
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| CN103492738A (zh) * | 2011-04-26 | 2014-01-01 | 千住金属工业株式会社 | 滑动构件 |
| CN104169599A (zh) * | 2012-03-27 | 2014-11-26 | 千住金属工业株式会社 | 滑动构件 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103492738A (zh) * | 2011-04-26 | 2014-01-01 | 千住金属工业株式会社 | 滑动构件 |
| CN103492738B (zh) * | 2011-04-26 | 2014-11-05 | 千住金属工业株式会社 | 滑动构件 |
| CN104169599A (zh) * | 2012-03-27 | 2014-11-26 | 千住金属工业株式会社 | 滑动构件 |
| CN104169599B (zh) * | 2012-03-27 | 2015-08-26 | 千住金属工业株式会社 | 滑动构件 |
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| Publication number | Publication date |
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| JP2000039022A (ja) | 2000-02-08 |
| CN1105833C (zh) | 2003-04-16 |
| EP0962674A2 (de) | 1999-12-08 |
| CZ9901941A3 (cs) | 2001-02-14 |
| EP0962674B1 (de) | 2004-08-04 |
| CZ293778B6 (cs) | 2004-07-14 |
| ES2224493T3 (es) | 2005-03-01 |
| EP0962674A3 (de) | 2000-12-06 |
| DE19824310C1 (de) | 1999-08-12 |
| ATA94399A (de) | 2002-10-15 |
| BR9901757A (pt) | 1999-12-28 |
| ATE272803T1 (de) | 2004-08-15 |
| TR199901221A3 (tr) | 2001-01-22 |
| US6146019A (en) | 2000-11-14 |
| SK72899A3 (en) | 1999-12-10 |
| PL191011B1 (pl) | 2006-03-31 |
| TR199901221A2 (xx) | 2001-01-22 |
| PL333497A1 (en) | 1999-12-06 |
| KR100613017B1 (ko) | 2006-08-14 |
| DE59910103D1 (de) | 2004-09-09 |
| SK285646B6 (sk) | 2007-05-03 |
| RU2244856C2 (ru) | 2005-01-20 |
| US6263575B1 (en) | 2001-07-24 |
| AT410580B (de) | 2003-06-25 |
| KR20000005819A (ko) | 2000-01-25 |
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