CN1220729C - 环氧树脂组合物及其生产方法 - Google Patents

环氧树脂组合物及其生产方法 Download PDF

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Publication number
CN1220729C
CN1220729C CNB011415789A CN01141578A CN1220729C CN 1220729 C CN1220729 C CN 1220729C CN B011415789 A CNB011415789 A CN B011415789A CN 01141578 A CN01141578 A CN 01141578A CN 1220729 C CN1220729 C CN 1220729C
Authority
CN
China
Prior art keywords
epoxy resin
resin composition
tetramethylbiphenyl
weight
tetramethyldiphenoquinone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB011415789A
Other languages
English (en)
Chinese (zh)
Other versions
CN1350032A (zh
Inventor
村田保幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
NIPPON EPOXY RESIN CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON EPOXY RESIN CO Ltd filed Critical NIPPON EPOXY RESIN CO Ltd
Publication of CN1350032A publication Critical patent/CN1350032A/zh
Application granted granted Critical
Publication of CN1220729C publication Critical patent/CN1220729C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145—Compounds containing one epoxy group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Emergency Medicine (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epoxy Resins (AREA)
CNB011415789A 2000-10-23 2001-10-22 环氧树脂组合物及其生产方法 Expired - Lifetime CN1220729C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000322630A JP2002128861A (ja) 2000-10-23 2000-10-23 エポキシ樹脂組成物及びその製法
JP322630/2000 2000-10-23

Publications (2)

Publication Number Publication Date
CN1350032A CN1350032A (zh) 2002-05-22
CN1220729C true CN1220729C (zh) 2005-09-28

Family

ID=18800475

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011415789A Expired - Lifetime CN1220729C (zh) 2000-10-23 2001-10-22 环氧树脂组合物及其生产方法

Country Status (7)

Country Link
US (1) US6548620B2 (enExample)
JP (1) JP2002128861A (enExample)
KR (1) KR20020031316A (enExample)
CN (1) CN1220729C (enExample)
MY (1) MY117629A (enExample)
SG (1) SG102009A1 (enExample)
TW (1) TW555777B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002363254A (ja) * 2001-06-06 2002-12-18 Nippon Kayaku Co Ltd エポキシ化合物、エポキシ樹脂組成物及びその硬化物
JP4433368B2 (ja) * 2003-04-08 2010-03-17 ジャパンエポキシレジン株式会社 エポキシ樹脂粒状化物及びその製造方法
JP5607447B2 (ja) * 2010-07-22 2014-10-15 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置
JP6507506B2 (ja) * 2014-07-16 2019-05-08 住友ベークライト株式会社 封止用樹脂組成物及び半導体装置
JP6607009B2 (ja) * 2014-12-04 2019-11-20 三菱ケミカル株式会社 テトラメチルビフェノール型エポキシ樹脂、エポキシ樹脂組成物、硬化物及び半導体封止材
JP2019104906A (ja) * 2017-12-12 2019-06-27 三菱ケミカル株式会社 エポキシ樹脂組成物、硬化物及び電気・電子部品
WO2023002902A1 (ja) * 2021-07-19 2023-01-26 三菱ケミカル株式会社 フェノール混合物、エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子部品
TWI866272B (zh) * 2022-06-14 2024-12-11 南韓商新亚Ｔ&Ｃ公司 四甲基雙酚型環氧樹脂以及其製備方法，四甲基雙酚型環氧樹脂組成物，固化物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817077A (ja) * 1981-07-22 1983-02-01 株式会社東芝 エレベ−タの群管理制御方法
JPS6147725A (ja) 1984-08-16 1986-03-08 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JPH0621086B2 (ja) 1985-05-23 1994-03-23 三菱油化株式会社 ３，３’，５，５’‐テトラメチル‐４，４’‐ジヒドロキシジフェニルの製造法
JPH0212225A (ja) 1988-06-30 1990-01-17 Nippon Mektron Ltd 電気泳動表示素子
US5844062A (en) * 1997-04-29 1998-12-01 Industrial Technology Research Institute Process for preparing phenolepoxy resins in the absence of an aqueous phase

Also Published As

Publication number Publication date
JP2002128861A (ja) 2002-05-09
KR20020031316A (ko) 2002-05-01
MY117629A (en) 2004-07-31
US6548620B2 (en) 2003-04-15
US20020077422A1 (en) 2002-06-20
SG102009A1 (en) 2004-02-27
CN1350032A (zh) 2002-05-22
TW555777B (en) 2003-10-01

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: MITSUBISHI CHEMICAL Corp.

Address before: Tokyo, Japan

Patentee before: MITSUBISHI RAYON Co.,Ltd.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20181228

Address after: Tokyo, Japan

Patentee after: MITSUBISHI RAYON Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: MITSUBISHI CHEMICAL Corp.

Effective date of registration: 20181228

Address after: Tokyo, Japan

Patentee after: MITSUBISHI CHEMICAL Corp.

Address before: Tokyo, Japan

Patentee before: Japan Epoxy Resins Co.,Ltd.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20050928

CX01 Expiry of patent term