CN121748920A - 光源模块 - Google Patents
光源模块Info
- Publication number
- CN121748920A CN121748920A CN202512021796.XA CN202512021796A CN121748920A CN 121748920 A CN121748920 A CN 121748920A CN 202512021796 A CN202512021796 A CN 202512021796A CN 121748920 A CN121748920 A CN 121748920A
- Authority
- CN
- China
- Prior art keywords
- semiconductor laser
- laser beam
- optical
- optical element
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1092—Multi-wavelength lasing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18386—Details of the emission surface for influencing the near- or far-field, e.g. a grating on the surface
- H01S5/18388—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4062—Edge-emitting structures with an external cavity or using internal filters, e.g. Talbot filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020085548 | 2020-05-14 | ||
| JP2020-085548 | 2020-05-14 | ||
| CN202180033867.5A CN115552743B (zh) | 2020-05-14 | 2021-05-12 | 光源模块 |
| PCT/JP2021/018078 WO2021230294A1 (ja) | 2020-05-14 | 2021-05-12 | 光源モジュール |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180033867.5A Division CN115552743B (zh) | 2020-05-14 | 2021-05-12 | 光源模块 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN121748920A true CN121748920A (zh) | 2026-03-27 |
Family
ID=78524457
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202512021796.XA Pending CN121748920A (zh) | 2020-05-14 | 2021-05-12 | 光源模块 |
| CN202512021804.0A Pending CN121790908A (zh) | 2020-05-14 | 2021-05-12 | 半导体激光模块 |
| CN202180033867.5A Active CN115552743B (zh) | 2020-05-14 | 2021-05-12 | 光源模块 |
| CN202512021801.7A Pending CN121748921A (zh) | 2020-05-14 | 2021-05-12 | 光源模块 |
| CN202512021803.6A Pending CN121790909A (zh) | 2020-05-14 | 2021-05-12 | 半导体激光模块 |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202512021804.0A Pending CN121790908A (zh) | 2020-05-14 | 2021-05-12 | 半导体激光模块 |
| CN202180033867.5A Active CN115552743B (zh) | 2020-05-14 | 2021-05-12 | 光源模块 |
| CN202512021801.7A Pending CN121748921A (zh) | 2020-05-14 | 2021-05-12 | 光源模块 |
| CN202512021803.6A Pending CN121790909A (zh) | 2020-05-14 | 2021-05-12 | 半导体激光模块 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230059013A1 (https=) |
| JP (2) | JP7820293B2 (https=) |
| CN (5) | CN121748920A (https=) |
| WO (1) | WO2021230294A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020118421B4 (de) * | 2020-07-13 | 2023-08-03 | Focuslight Technologies Inc. | Laservorrichtung |
| JP7723266B2 (ja) * | 2021-10-19 | 2025-08-14 | 日亜化学工業株式会社 | 光源装置 |
| JP7803192B2 (ja) * | 2022-03-30 | 2026-01-21 | 住友大阪セメント株式会社 | 光デバイスとそれを用いた光送信装置 |
| US20260106431A1 (en) * | 2022-09-29 | 2026-04-16 | Nichia Corporation | Light emitting device and light emitting module |
| CN116086776B (zh) * | 2023-01-19 | 2026-02-17 | 南京理工大学 | 一种准直光束发散角检测装置及发散角检测方法 |
| US20250098378A1 (en) * | 2023-09-15 | 2025-03-20 | Advanced Semiconductor Engineering, Inc. | Method for manufacturing optoelectronic structure and a package structure |
| WO2025173756A1 (ja) * | 2024-02-13 | 2025-08-21 | ヌヴォトンテクノロジージャパン株式会社 | 半導体レーザ装置及び半導体レーザ装置の製造方法 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4986634A (en) * | 1988-08-26 | 1991-01-22 | Fuji Photo Film Co., Ltd. | Beam-combining laser beam source device |
| US6546030B2 (en) * | 2000-06-29 | 2003-04-08 | Fuji Photo Film Co., Ltd. | Semiconductor laser unit employing an inorganic adhesive |
| JP2004253783A (ja) * | 2003-01-31 | 2004-09-09 | Fuji Photo Film Co Ltd | レーザモジュール |
| JP2005203940A (ja) * | 2004-01-14 | 2005-07-28 | Matsushita Electric Ind Co Ltd | 通信装置およびプログラム |
| JP2006066875A (ja) * | 2004-07-26 | 2006-03-09 | Fuji Photo Film Co Ltd | レーザモジュール |
| JP2006054366A (ja) * | 2004-08-13 | 2006-02-23 | Fuji Photo Film Co Ltd | レーザモジュール |
| JP2006126272A (ja) * | 2004-10-26 | 2006-05-18 | Nippon Electric Glass Co Ltd | 光学用キャップ部品 |
| JP2006171348A (ja) * | 2004-12-15 | 2006-06-29 | Nippon Steel Corp | 半導体レーザ装置 |
| JP2006301352A (ja) * | 2005-04-21 | 2006-11-02 | Moritex Corp | レンズキャップ |
| JP2007025431A (ja) * | 2005-07-20 | 2007-02-01 | Fujifilm Holdings Corp | レーザモジュール |
| JP2007163947A (ja) * | 2005-12-15 | 2007-06-28 | Fujifilm Corp | 合波光学系 |
| JP5042580B2 (ja) * | 2006-09-29 | 2012-10-03 | 富士フイルム株式会社 | 半導体レーザ光源ユニット |
| EP2287644B1 (en) * | 2009-08-18 | 2014-04-09 | Mitsubishi Electric Corporation | Light source device and method of producing the same |
| JP5730814B2 (ja) * | 2012-05-08 | 2015-06-10 | 古河電気工業株式会社 | 半導体レーザモジュール |
| US9437508B2 (en) * | 2012-05-15 | 2016-09-06 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing semiconductor device and semiconductor device |
| WO2014087726A1 (ja) * | 2012-12-03 | 2014-06-12 | 三菱電機株式会社 | 半導体レーザ装置 |
| JP5892918B2 (ja) * | 2012-12-14 | 2016-03-23 | 三菱電機株式会社 | 半導体レーザ装置およびレーザ光発生方法 |
| JP5920254B2 (ja) * | 2013-03-13 | 2016-05-18 | ウシオ電機株式会社 | 半導体レーザ装置 |
| DE102013209919B4 (de) * | 2013-05-28 | 2025-06-26 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement mit einem Gehäuse mit mehreren Öffnungen |
| US9525269B2 (en) * | 2014-11-22 | 2016-12-20 | TeraDiode, Inc. | Wavelength beam combining laser systems utilizing etalons |
| CN104808299A (zh) * | 2015-05-08 | 2015-07-29 | 福州宏旭科技有限公司 | 一种用于光纤通讯的多波长组件 |
| JP6288132B2 (ja) * | 2015-05-20 | 2018-03-07 | 日亜化学工業株式会社 | 発光装置 |
| JP6635725B2 (ja) * | 2015-09-08 | 2020-01-29 | シャープ株式会社 | 投影装置 |
| JP6648712B2 (ja) * | 2016-04-28 | 2020-02-14 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| EP4350405A3 (en) * | 2017-06-16 | 2024-10-09 | Kyocera Corporation | Optical connector module |
| CN107526134A (zh) * | 2017-07-21 | 2017-12-29 | 成都聚芯光科通信设备有限责任公司 | 适用于光纤通讯技术领域的多波长复用结构 |
| CN107479145A (zh) * | 2017-07-21 | 2017-12-15 | 成都聚芯光科通信设备有限责任公司 | 利于提高耦合效率的光收发模块组件 |
| WO2019207976A1 (ja) * | 2018-04-26 | 2019-10-31 | ソニー株式会社 | 光通信コネクタ、光送信器、光受信器、光通信システム及び光通信ケーブル |
| WO2020036053A1 (ja) * | 2018-08-15 | 2020-02-20 | ソニー株式会社 | 発光装置および投射型表示装置 |
| JP7277737B2 (ja) * | 2018-09-06 | 2023-05-19 | 日亜化学工業株式会社 | 発光装置 |
| US20220026648A1 (en) * | 2018-12-13 | 2022-01-27 | Sony Group Corporation | Optical connector, optical cable, and electronic device |
| US11296481B2 (en) * | 2019-01-09 | 2022-04-05 | Leonardo Electronics Us Inc. | Divergence reshaping array |
| EP3687008B1 (en) * | 2019-01-24 | 2022-01-19 | Nichia Corporation | Light source unit |
| CN113348547B (zh) * | 2019-02-04 | 2025-01-21 | 索尼集团公司 | 半导体发光装置 |
| JP7488445B2 (ja) * | 2019-05-22 | 2024-05-22 | 日亜化学工業株式会社 | 光源ユニット |
| WO2021112248A1 (ja) * | 2019-12-06 | 2021-06-10 | 古河電気工業株式会社 | 発光装置、光源ユニット、光源装置、および光ファイバレーザ |
| EP4084239A4 (en) * | 2019-12-26 | 2024-01-10 | Nichia Corporation | Laser light source |
-
2021
- 2021-05-12 CN CN202512021796.XA patent/CN121748920A/zh active Pending
- 2021-05-12 CN CN202512021804.0A patent/CN121790908A/zh active Pending
- 2021-05-12 JP JP2022522181A patent/JP7820293B2/ja active Active
- 2021-05-12 CN CN202180033867.5A patent/CN115552743B/zh active Active
- 2021-05-12 CN CN202512021801.7A patent/CN121748921A/zh active Pending
- 2021-05-12 CN CN202512021803.6A patent/CN121790909A/zh active Pending
- 2021-05-12 WO PCT/JP2021/018078 patent/WO2021230294A1/ja not_active Ceased
-
2022
- 2022-11-08 US US17/982,886 patent/US20230059013A1/en active Pending
-
2026
- 2026-02-12 JP JP2026020939A patent/JP2026066357A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021230294A1 (https=) | 2021-11-18 |
| CN115552743B (zh) | 2026-01-13 |
| WO2021230294A1 (ja) | 2021-11-18 |
| CN121748921A (zh) | 2026-03-27 |
| CN121790909A (zh) | 2026-04-03 |
| US20230059013A1 (en) | 2023-02-23 |
| JP7820293B2 (ja) | 2026-02-25 |
| CN115552743A (zh) | 2022-12-30 |
| JP2026066357A (ja) | 2026-04-16 |
| CN121790908A (zh) | 2026-04-03 |
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