CN1216402A - 低噪声的球栅阵列封装 - Google Patents

低噪声的球栅阵列封装 Download PDF

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CN1216402A
CN1216402A CN98121431A CN98121431A CN1216402A CN 1216402 A CN1216402 A CN 1216402A CN 98121431 A CN98121431 A CN 98121431A CN 98121431 A CN98121431 A CN 98121431A CN 1216402 A CN1216402 A CN 1216402A
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integrated circuit
emi
power supply
tube core
earth connection
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T·J·胡姆夫雷
J·C·胡德森
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HP Inc
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Abstract

一种低电感集成电路封装(10)例如球栅阵列。为了减少由安装在封装内的集成电路引起的电磁干扰(EMI),滤波器件(30)连接到至少一个连通集成电路的电源线和接地线(40,42)。在优选实施例中,多个滤波电容(30)连接在封装的腔(20)内或附近的电源线和接地线(40,42)之间。

Description

低噪声的球栅阵列封装
本发明涉及球栅阵列，更具体地涉及减少其中不需要的噪声。
球栅阵列(BGA)等为已知类型的集成电路封装。典型的球栅阵列包括管芯安装区提供于其上的平台。管芯安装区位于其中的区域通常称做腔，而腔的周边区域通常称做边界。多个接触焊盘经常沿管芯安装区的边缘设置，接触焊盘通过平台内部的导体连接到平台背侧(安装时为下面)上的导电“球”。这些导电性球通常排列为栅格图形，由此得名球栅阵列。导电球形成球栅阵列封装和印刷电路板之间的低电感电连接。
通常称做“噪声”的电磁干扰(EMI)为与包括封装在球栅阵列中那些小规模、高速电路相关的问题。现有技术在球栅阵列的环境中减少EMI的尝试包括将电容器放置在安装有球栅阵列的印刷电路板上并在平台的背侧形成电容器。就安装了电容器的印刷电路板的安排而论，这种安排的缺点在于电容器远离EMI源(封装的集成电路)设置，因此在电容器试图抑制噪声之前，不希望的噪声已相当广泛地分布了。就背侧电容器的安排而言，这些安排的缺点在于它们的制造趋于复杂和昂贵，并且需要提高球栅阵列的高度以容纳它们的尺寸。
因此，本发明的一个目的是提供一种能在靠近噪声源的点处在板(on-board)减少EMI和相关噪声的球栅阵列。
本发明的另一目的是提供一种球栅阵列，在它的腔内存在噪声减少机构。
本发明的再一目的是提供一种可以抑制EMI和相关的噪声并且制造上经济的球栅阵列。
可以使用下面介绍的球栅阵列获得本发明的这些和相关的目的。
在一个实施例中，本发明包括：平台，具有多个低电感安装导体形成在它的第一面上；腔，形成在所述平台的第二面并包括一个管芯安装区；多个电接触，形成在所述腔内靠近所述管芯安装区，用于接收安装在所述管芯安装区的集成电路的焊盘，至少一些所述电接触由所述平台内的导体连接到一些所述安装导体；连接到至少一个所述电接触的电源线；连接到至少另一个所述电接触的接地线；以及提供在所述平台的第二侧上并连接到至少一个所述电源和接地线的装置，用于减少由安装在所述管芯安装区的集成电路产生的EMI。在优选实施例中，EMI减少装置连接在电源和地线之间并包括滤波电容器。EMI减少装置也优选表面安装在邻近管芯安装区处。
在另一实施例中，本发明包括：平台，具有多个低电感安装导体形成在它的底面；腔，形成在所述平台的顶面并包括一个管芯安装区；电源线，形成在所述腔内用于向所述腔内安装的集成电路提供电源；接地线，形成在所述腔内用于将所述腔内安装的集成电路接地；以及滤波器件，连接到至少一个所述电源和接地线，用于滤波由安装在所述管芯安装区的集成电路产生的噪声。
考察下面结合附图进行的本发明的详尽的介绍后，对本领域的技术人员来说，显然很容易达到本发明的以上和有关的优点。
图1为根据本发明的球栅阵列的透视图。
图2为根据本发明图1的球栅阵列的腔内导体的平面图。
参考图1，示出了根据本发明的球栅阵列10的透视图。球栅阵列10包括平台12、边界14和腔20。腔20包括一个或多个集成电路(未显示)或相关器件位于其中的管芯安装区22。
腔20也包括集成电路的焊盘安装其上的多个导电条24(图2更详细地示出)。腔内集成电路与导电条的接合在本领域内是公知的。导电条24由球栅阵列10内的导体连接到表面安装的低电感导电突点或球18。导电球优选设置在平台12底部的栅格图形内，并且优选由焊料或导电的环氧树脂或类似导电材料制成。信号条24和导电球17-19之间导体的布局和形成在本领域内是公知的。
图1还示出了连通到球17的电源线16和连通到球19的接地线28。电源线26和接地线28分别连接到腔内的电源和接地回路40,42。多个滤波电容器30优选连接在电源和接地回路之间，如下面所详细介绍的，以减少由腔内的集成电路产生的EMI。虽然优选的实施例连接电源线和接地线之间的滤波电容器，但也可以采用在不同的电源线之间或电源线和带电公用线之间的其它有利方式。此外，在另一实施例中，滤波电容器可以提供在边界区内，由滤波电容器31代表。虽然这种安排降低了噪声，但必需形成通孔用于表面安装的电容器和掩埋的电源和接地导体之间的连接。
参考图2，显示出了根据本发明图1的球栅阵列10的腔20内导体的平面图。多个接触焊盘32提供在管芯安装区22附近。要安装在区域22内的集成电路的焊盘通常通过低电感倒装或其它公知的技术连接到接触焊盘。一些导电条24连接到接触焊盘32和接触焊盘36之间，而接触焊盘32和36连接到球栅阵列10的内部导体(如上面所讨论的)。其它导电条24连接在电源和接地回路以及接触焊盘32之间。由于接触焊盘32、导电条24和接触焊盘36的数量很多，所以这些部件的一部分代表性地由它们对应的参考数字标识。
连接到输入电源线26的电源回路40提供在管芯安装区22的周围。连接到输入接地线28的接地回路42类似地提供在管芯安装区22的周围。
在图2的实施例中，四个滤波电容器30连接在电源和接地回路40,42之间。这些电容器在集成电路周围立即提供滤波由此获得EMI减少很接近源。EMI减少接近源是希望的，因为它可减少噪声信号对其它部件的传播并减少噪声的寄生效应。此外，图2的安排可允许滤波电容器直接表面安装到露出的电源和接地回路。表面安装优选由标准的表面安装装配工艺获得，并且是安装滤波电容器的方便和经济的方式。
在生产中，优选地在导电条24的连线键合形成之前安装电容器。电容器优选范围约0.1到0.001微法拉的电容，尺寸标识为0402。
虽然图2示出电容器30位于管芯安装区的四角，但应该明白滤波器可以放置在其中的任何地方。虽然对于某些应用放置在角落比较方便，但主要的目的是在集成电路附近滤波以减少噪声。因此电容器应提供在相邻导电条之间，和示出的相比其数量可多可少，并且可以为获得滤波EMI和有关噪声的其它布局。
虽然结合具体的实施例介绍了本发明，但应该理解本发明能进行进一步的修改，并且本申请覆盖通常根据本发明的基本原则作出的、并包括脱离本发明的公开但为本领域的公知或惯常做法属于本发明、并适用于以上说明的基本特征的任何变形、用途、或适当修改，落入本发明的范围和附带的权利要求书的限制。

Claims (10)

1．一种低电感的集成电路封装，包括：
平台(12)，具有多个低电感安装导体(18)形成在它的第一面；
腔(20)，形成在所述平台的第二面并包括一个管芯安装区(22)；
多个电接触(32)，形成在所述腔内靠近所述管芯安装区，用于接收安装在所述管芯安装区的集成电路的焊盘，至少一些所述电接触由所述平台内的导体连接到一些所述安装导体；
连接到至少一个所述电接触的电源线(40)；
连接到至少另一个所述电接触的接地线(42)；以及
提供在所述平台的第二侧上并连接到至少一个所述电源和接地线(40,42)的装置(30)，用于减少由安装在所述管芯安装区(22)的集成电路产生的电磁干扰(EMI)。
2．根据权利要求1的集成电路，其中所述EMI减少装置(30)连接到其它的所述电源和接地线(40,42)。
3．根据权利要求1的集成电路，其中所述EMI减少装置(30)连接在所述电源和接地线(40,42)之间。
4．根据权利要求3的集成电路，其中所述EMI减少装置(30)提供在所述腔(20)内。
5．根据权利要求1的集成电路，还包括形成在所述平台上所述腔(12)周围的边界区(14)，其中所述EMI减少装置(30)提供在所述边界区内。
6．根据权利要求1的集成电路，其中所述低电感安装导体为导电球(18)。
7．根据权利要求1的集成电路，其中所述EMI减少装置包括滤波电容(30)。
8．根据权利要求1的集成电路，其中每个所述电源和接地线(40,42)分别包括环绕所述管芯安装区的电源线回路和接地线回路。
9．根据权利要求8的集成电路，其中所述EMI减少装置包括多个滤波电容(30)，每个连接在电源和接地回路之间。
10．根据权利要求9的集成电路，其中所述多个滤波电容(30)表面安装到所述电源和接地回路(40,42)。
CN98121431A 1997-10-30 1998-10-30 低噪声的球栅阵列封装 Pending CN1216402A (zh)

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