CN121260718A - 等离子体处理系统和边缘环的更换方法 - Google Patents

等离子体处理系统和边缘环的更换方法

Info

Publication number
CN121260718A
CN121260718A CN202511317268.2A CN202511317268A CN121260718A CN 121260718 A CN121260718 A CN 121260718A CN 202511317268 A CN202511317268 A CN 202511317268A CN 121260718 A CN121260718 A CN 121260718A
Authority
CN
China
Prior art keywords
edge ring
ring
supporting
lifting
lifting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202511317268.2A
Other languages
English (en)
Chinese (zh)
Inventor
松浦伸
加藤健一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020178354A external-priority patent/JP7550603B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN121260718A publication Critical patent/CN121260718A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
CN202511317268.2A 2020-03-03 2021-02-20 等离子体处理系统和边缘环的更换方法 Pending CN121260718A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020-035948 2020-03-03
JP2020035948 2020-03-03
JP2020-178354 2020-10-23
JP2020178354A JP7550603B2 (ja) 2020-03-03 2020-10-23 プラズマ処理システム及びエッジリングの交換方法
CN202110191972.3A CN113345786B (zh) 2020-03-03 2021-02-20 等离子体处理系统和边缘环的更换方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202110191972.3A Division CN113345786B (zh) 2020-03-03 2021-02-20 等离子体处理系统和边缘环的更换方法

Publications (1)

Publication Number Publication Date
CN121260718A true CN121260718A (zh) 2026-01-02

Family

ID=77467842

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202511317268.2A Pending CN121260718A (zh) 2020-03-03 2021-02-20 等离子体处理系统和边缘环的更换方法
CN202110191972.3A Active CN113345786B (zh) 2020-03-03 2021-02-20 等离子体处理系统和边缘环的更换方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202110191972.3A Active CN113345786B (zh) 2020-03-03 2021-02-20 等离子体处理系统和边缘环的更换方法

Country Status (4)

Country Link
US (2) US11901163B2 (https=)
JP (1) JP7727792B2 (https=)
CN (2) CN121260718A (https=)
TW (2) TWI871434B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134104B2 (ja) * 2019-01-09 2022-09-09 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理装置の載置台
TWI871434B (zh) * 2020-03-03 2025-02-01 日商東京威力科創股份有限公司 電漿處理系統及邊緣環的更換方法
TW202531381A (zh) * 2020-03-03 2025-08-01 日商東京威力科創股份有限公司 基板支持台、電漿處理系統及環狀構件之安裝方法
CN115440558A (zh) * 2021-06-03 2022-12-06 长鑫存储技术有限公司 半导体蚀刻设备
WO2023021372A1 (en) * 2021-08-16 2023-02-23 AddOn Optics Ltd. Apparatus and methods for applying vacuum-plasma treatment
US20250361614A1 (en) * 2024-05-21 2025-11-27 Applied Materials, Inc. Increased life substrate support assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230239A (ja) * 2000-02-15 2001-08-24 Tokyo Electron Ltd 処理装置及び処理方法
JP4104111B2 (ja) * 2002-01-29 2008-06-18 東京エレクトロン株式会社 被処理体の載置台及び被処理体の吸着方法
JP4687534B2 (ja) 2005-09-30 2011-05-25 東京エレクトロン株式会社 基板の載置機構及び基板処理装置
JP5650935B2 (ja) * 2009-08-07 2015-01-07 東京エレクトロン株式会社 基板処理装置及び位置決め方法並びにフォーカスリング配置方法
JP5584517B2 (ja) * 2010-05-12 2014-09-03 東京エレクトロン株式会社 プラズマ処理装置及び半導体装置の製造方法
JP6003011B2 (ja) * 2011-03-31 2016-10-05 東京エレクトロン株式会社 基板処理装置
JP5948026B2 (ja) * 2011-08-17 2016-07-06 東京エレクトロン株式会社 半導体製造装置及び処理方法
JP6285620B2 (ja) 2011-08-26 2018-02-28 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
US20140311676A1 (en) 2012-01-17 2014-10-23 Tokyo Electron Limited Substrate mounting table and plasma treatment device
JP2016046451A (ja) * 2014-08-26 2016-04-04 株式会社アルバック 基板処理装置及び基板処理方法
US20170263478A1 (en) * 2015-01-16 2017-09-14 Lam Research Corporation Detection System for Tunable/Replaceable Edge Coupling Ring
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US10062599B2 (en) * 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
CN108369922B (zh) * 2016-01-26 2023-03-21 应用材料公司 晶片边缘环升降解决方案
CN116110846A (zh) 2016-01-26 2023-05-12 应用材料公司 晶片边缘环升降解决方案
JP6812264B2 (ja) * 2017-02-16 2021-01-13 東京エレクトロン株式会社 真空処理装置、及びメンテナンス装置
JP7055039B2 (ja) 2017-03-22 2022-04-15 東京エレクトロン株式会社 基板処理装置
US11043400B2 (en) 2017-12-21 2021-06-22 Applied Materials, Inc. Movable and removable process kit
JP7110020B2 (ja) 2018-07-24 2022-08-01 キオクシア株式会社 基板支持装置およびプラズマ処理装置
CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
KR102134391B1 (ko) 2018-10-18 2020-07-15 세메스 주식회사 기판 처리 장치
KR20220044356A (ko) * 2019-08-14 2022-04-07 램 리써치 코포레이션 기판 프로세싱 시스템들을 위한 이동 가능한 에지 링들
JP2021040011A (ja) * 2019-09-02 2021-03-11 キオクシア株式会社 プラズマ処理装置
TWI871434B (zh) * 2020-03-03 2025-02-01 日商東京威力科創股份有限公司 電漿處理系統及邊緣環的更換方法

Also Published As

Publication number Publication date
US20240136158A1 (en) 2024-04-25
TW202137325A (zh) 2021-10-01
US11901163B2 (en) 2024-02-13
CN113345786A (zh) 2021-09-03
US20240234102A9 (en) 2024-07-11
JP7727792B2 (ja) 2025-08-21
US12394605B2 (en) 2025-08-19
JP2024105634A (ja) 2024-08-06
US20210280395A1 (en) 2021-09-09
CN113345786B (zh) 2025-10-03
TWI871434B (zh) 2025-02-01
TW202516684A (zh) 2025-04-16

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