CN1211000C - 刚性挠性基板及使用该基板的照相机 - Google Patents

刚性挠性基板及使用该基板的照相机 Download PDF

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Publication number
CN1211000C
CN1211000C CN 03123690 CN03123690A CN1211000C CN 1211000 C CN1211000 C CN 1211000C CN 03123690 CN03123690 CN 03123690 CN 03123690 A CN03123690 A CN 03123690A CN 1211000 C CN1211000 C CN 1211000C
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CN
China
Prior art keywords
flexible substrate
notch part
substrate
display device
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 03123690
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English (en)
Chinese (zh)
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CN1461182A (zh
Inventor
本田澄人
大久保光将
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
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Olympus Corp
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Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of CN1461182A publication Critical patent/CN1461182A/zh
Application granted granted Critical
Publication of CN1211000C publication Critical patent/CN1211000C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
CN 03123690 2002-05-14 2003-05-13 刚性挠性基板及使用该基板的照相机 Expired - Fee Related CN1211000C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002139051A JP2003332743A (ja) 2002-05-14 2002-05-14 リジットフレキシブル基板
JP139051/2002 2002-05-14

Publications (2)

Publication Number Publication Date
CN1461182A CN1461182A (zh) 2003-12-10
CN1211000C true CN1211000C (zh) 2005-07-13

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN 03257559 Expired - Lifetime CN2626186Y (zh) 2002-05-14 2003-05-13 刚性挠性基板及使用该基板的照相机
CN 03123690 Expired - Fee Related CN1211000C (zh) 2002-05-14 2003-05-13 刚性挠性基板及使用该基板的照相机

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN 03257559 Expired - Lifetime CN2626186Y (zh) 2002-05-14 2003-05-13 刚性挠性基板及使用该基板的照相机

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JP (1) JP2003332743A (ja)
CN (2) CN2626186Y (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100661297B1 (ko) * 2005-09-14 2006-12-26 삼성전기주식회사 리지드-플렉시블 패키지 온 패키지용 인쇄회로기판 및 그제조방법
JP2007180240A (ja) * 2005-12-27 2007-07-12 Sharp Corp 多層配線基板と、それを備えた電子モジュールおよび電子機器
JP5168838B2 (ja) * 2006-07-28 2013-03-27 大日本印刷株式会社 多層プリント配線板及びその製造方法
EP2034810B1 (en) * 2006-10-24 2011-12-14 Ibiden Co., Ltd. Flex rigid wiring board
JPWO2010013366A1 (ja) 2008-07-30 2012-01-05 イビデン株式会社 フレックスリジッド配線板及びその製造方法
JP4676013B2 (ja) 2009-06-30 2011-04-27 株式会社東芝 電子機器
CN103648404B (zh) * 2012-07-04 2015-06-17 奥林巴斯医疗株式会社 超声波内窥镜
CN104218015A (zh) * 2013-05-30 2014-12-17 宏启胜精密电子(秦皇岛)有限公司 封装结构及其制作方法
CN105578761B (zh) * 2016-02-25 2018-09-04 广东欧珀移动通信有限公司 软硬结合板及移动终端
JP6637847B2 (ja) 2016-06-24 2020-01-29 新光電気工業株式会社 配線基板、配線基板の製造方法
CN105934095B (zh) * 2016-06-28 2019-02-05 Oppo广东移动通信有限公司 Pcb板及具有其的移动终端
KR102494328B1 (ko) * 2017-09-28 2023-02-02 삼성전기주식회사 리지드 플렉서블 인쇄회로기판, 디스플레이 장치 및 리지드 플렉서블 인쇄회로기판의 제조방법
JP7286899B2 (ja) * 2019-02-11 2023-06-06 サムソン エレクトロ-メカニックス カンパニーリミテッド. プリント回路基板(printed circuit board)
CN111146194A (zh) * 2019-12-30 2020-05-12 华进半导体封装先导技术研发中心有限公司 一种系统级封装结构及制造方法

Also Published As

Publication number Publication date
CN2626186Y (zh) 2004-07-14
CN1461182A (zh) 2003-12-10
JP2003332743A (ja) 2003-11-21

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CF01 Termination of patent right due to non-payment of annual fee