CN120981501A - 多液型固化性树脂组合物、干膜、固化物和电子部件 - Google Patents

多液型固化性树脂组合物、干膜、固化物和电子部件

Info

Publication number
CN120981501A
CN120981501A CN202480021886.XA CN202480021886A CN120981501A CN 120981501 A CN120981501 A CN 120981501A CN 202480021886 A CN202480021886 A CN 202480021886A CN 120981501 A CN120981501 A CN 120981501A
Authority
CN
China
Prior art keywords
curable resin
resin composition
component curable
weight
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480021886.XA
Other languages
English (en)
Chinese (zh)
Inventor
横山裕
米田一善
木之瀬葵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of CN120981501A publication Critical patent/CN120981501A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
CN202480021886.XA 2023-03-31 2024-03-28 多液型固化性树脂组合物、干膜、固化物和电子部件 Pending CN120981501A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-058584 2023-03-31
JP2023058584 2023-03-31
PCT/JP2024/012888 WO2024204644A1 (ja) 2023-03-31 2024-03-28 多液型硬化性樹脂組成物、ドライフィルム、硬化物、および電子部品

Publications (1)

Publication Number Publication Date
CN120981501A true CN120981501A (zh) 2025-11-18

Family

ID=92905901

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480021886.XA Pending CN120981501A (zh) 2023-03-31 2024-03-28 多液型固化性树脂组合物、干膜、固化物和电子部件

Country Status (4)

Country Link
JP (1) JPWO2024204644A1 (https=)
KR (1) KR20250159191A (https=)
CN (1) CN120981501A (https=)
WO (1) WO2024204644A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200417294A (en) 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP6525305B2 (ja) * 2014-09-19 2019-06-05 互応化学工業株式会社 硬化性組成物及び被覆配線板の製造方法
JP7330719B2 (ja) 2019-03-01 2023-08-22 太陽ホールディングス株式会社 アルカリ現像型光硬化性熱硬化性樹脂組成物
JP7333506B2 (ja) * 2021-03-30 2023-08-25 互応化学工業株式会社 黒色感光性樹脂組成物、ドライフィルム、ソルダーレジスト及びプリント配線板

Also Published As

Publication number Publication date
KR20250159191A (ko) 2025-11-10
WO2024204644A1 (ja) 2024-10-03
JPWO2024204644A1 (https=) 2024-10-03

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