KR20250159191A - 다액형 경화성 수지 조성물, 드라이 필름, 경화물 및 전자부품 - Google Patents

다액형 경화성 수지 조성물, 드라이 필름, 경화물 및 전자부품

Info

Publication number
KR20250159191A
KR20250159191A KR1020257032125A KR20257032125A KR20250159191A KR 20250159191 A KR20250159191 A KR 20250159191A KR 1020257032125 A KR1020257032125 A KR 1020257032125A KR 20257032125 A KR20257032125 A KR 20257032125A KR 20250159191 A KR20250159191 A KR 20250159191A
Authority
KR
South Korea
Prior art keywords
curable resin
resin composition
composition
amine
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257032125A
Other languages
English (en)
Korean (ko)
Inventor
유타카 요코야마
카즈요시 요네다
아오이 키노세
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20250159191A publication Critical patent/KR20250159191A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
KR1020257032125A 2023-03-31 2024-03-28 다액형 경화성 수지 조성물, 드라이 필름, 경화물 및 전자부품 Pending KR20250159191A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023058584 2023-03-31
JPJP-P-2023-058584 2023-03-31
PCT/JP2024/012888 WO2024204644A1 (ja) 2023-03-31 2024-03-28 多液型硬化性樹脂組成物、ドライフィルム、硬化物、および電子部品

Publications (1)

Publication Number Publication Date
KR20250159191A true KR20250159191A (ko) 2025-11-10

Family

ID=92905901

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257032125A Pending KR20250159191A (ko) 2023-03-31 2024-03-28 다액형 경화성 수지 조성물, 드라이 필름, 경화물 및 전자부품

Country Status (4)

Country Link
JP (1) JPWO2024204644A1 (https=)
KR (1) KR20250159191A (https=)
CN (1) CN120981501A (https=)
WO (1) WO2024204644A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004048434A1 (ja) 2002-11-28 2004-06-10 Taiyo Ink Manufacturing Co., Ltd. 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板
JP2020140161A (ja) 2019-03-01 2020-09-03 太陽インキ製造株式会社 アルカリ現像型光硬化性熱硬化性樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6525305B2 (ja) * 2014-09-19 2019-06-05 互応化学工業株式会社 硬化性組成物及び被覆配線板の製造方法
JP7333506B2 (ja) * 2021-03-30 2023-08-25 互応化学工業株式会社 黒色感光性樹脂組成物、ドライフィルム、ソルダーレジスト及びプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004048434A1 (ja) 2002-11-28 2004-06-10 Taiyo Ink Manufacturing Co., Ltd. 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板
JP2020140161A (ja) 2019-03-01 2020-09-03 太陽インキ製造株式会社 アルカリ現像型光硬化性熱硬化性樹脂組成物

Also Published As

Publication number Publication date
WO2024204644A1 (ja) 2024-10-03
JPWO2024204644A1 (https=) 2024-10-03
CN120981501A (zh) 2025-11-18

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