CN120753017A - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法

Info

Publication number
CN120753017A
CN120753017A CN202480014051.1A CN202480014051A CN120753017A CN 120753017 A CN120753017 A CN 120753017A CN 202480014051 A CN202480014051 A CN 202480014051A CN 120753017 A CN120753017 A CN 120753017A
Authority
CN
China
Prior art keywords
insulating layer
oxide
region
layer
oxide semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480014051.1A
Other languages
English (en)
Chinese (zh)
Inventor
渡壁创
津吹将志
佐佐木俊成
花田明纮
田丸尊也
望月真里奈
小野寺凉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Publication of CN120753017A publication Critical patent/CN120753017A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6723Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having light shields
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0314Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6731Top-gate only TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60Impurity distributions or concentrations

Landscapes

  • Thin Film Transistor (AREA)
CN202480014051.1A 2023-03-16 2024-01-29 半导体装置及其制造方法 Pending CN120753017A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-041930 2023-03-16
JP2023041930 2023-03-16
PCT/JP2024/002595 WO2024190116A1 (ja) 2023-03-16 2024-01-29 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
CN120753017A true CN120753017A (zh) 2025-10-03

Family

ID=92754751

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480014051.1A Pending CN120753017A (zh) 2023-03-16 2024-01-29 半导体装置及其制造方法

Country Status (4)

Country Link
US (1) US20260006828A1 (https=)
JP (1) JPWO2024190116A1 (https=)
CN (1) CN120753017A (https=)
WO (1) WO2024190116A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4869509B2 (ja) * 2001-07-17 2012-02-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2007294491A (ja) * 2006-04-20 2007-11-08 Mitsubishi Electric Corp 薄膜トランジスタ、及びその製造方法、並びに、アクティブマトリクス型表示装置及びその製造方法
US8247273B2 (en) * 2007-07-17 2012-08-21 Sharp Kabushiki Kaisha Semiconductor device provided with thin film transistor and method for manufacturing the semiconductor device
JP2009135448A (ja) * 2007-11-01 2009-06-18 Semiconductor Energy Lab Co Ltd 半導体基板の作製方法及び半導体装置の作製方法
JP2009123732A (ja) * 2007-11-12 2009-06-04 Seiko Epson Corp 半導体装置の製造方法、電気光学装置の製造方法
KR101806271B1 (ko) * 2010-05-14 2017-12-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
CN102760697B (zh) * 2011-04-27 2016-08-03 株式会社半导体能源研究所 半导体装置的制造方法
US9960280B2 (en) * 2013-12-26 2018-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2017107913A (ja) * 2015-12-07 2017-06-15 株式会社ジャパンディスプレイ 薄膜トランジスタ及び薄膜トランジスタの製造方法
WO2019166906A1 (ja) * 2018-02-28 2019-09-06 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法

Also Published As

Publication number Publication date
WO2024190116A1 (ja) 2024-09-19
US20260006828A1 (en) 2026-01-01
JPWO2024190116A1 (https=) 2024-09-19

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