JPWO2024190116A1 - - Google Patents

Info

Publication number
JPWO2024190116A1
JPWO2024190116A1 JP2025506537A JP2025506537A JPWO2024190116A1 JP WO2024190116 A1 JPWO2024190116 A1 JP WO2024190116A1 JP 2025506537 A JP2025506537 A JP 2025506537A JP 2025506537 A JP2025506537 A JP 2025506537A JP WO2024190116 A1 JPWO2024190116 A1 JP WO2024190116A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025506537A
Other languages
Japanese (ja)
Other versions
JPWO2024190116A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024190116A1 publication Critical patent/JPWO2024190116A1/ja
Publication of JPWO2024190116A5 publication Critical patent/JPWO2024190116A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6723Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having light shields
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0314Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6731Top-gate only TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60Impurity distributions or concentrations
JP2025506537A 2023-03-16 2024-01-29 Pending JPWO2024190116A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023041930 2023-03-16
PCT/JP2024/002595 WO2024190116A1 (ja) 2023-03-16 2024-01-29 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2024190116A1 true JPWO2024190116A1 (https=) 2024-09-19
JPWO2024190116A5 JPWO2024190116A5 (https=) 2025-12-01

Family

ID=92754751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025506537A Pending JPWO2024190116A1 (https=) 2023-03-16 2024-01-29

Country Status (4)

Country Link
US (1) US20260006828A1 (https=)
JP (1) JPWO2024190116A1 (https=)
CN (1) CN120753017A (https=)
WO (1) WO2024190116A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4869509B2 (ja) * 2001-07-17 2012-02-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2007294491A (ja) * 2006-04-20 2007-11-08 Mitsubishi Electric Corp 薄膜トランジスタ、及びその製造方法、並びに、アクティブマトリクス型表示装置及びその製造方法
US8247273B2 (en) * 2007-07-17 2012-08-21 Sharp Kabushiki Kaisha Semiconductor device provided with thin film transistor and method for manufacturing the semiconductor device
JP2009135448A (ja) * 2007-11-01 2009-06-18 Semiconductor Energy Lab Co Ltd 半導体基板の作製方法及び半導体装置の作製方法
JP2009123732A (ja) * 2007-11-12 2009-06-04 Seiko Epson Corp 半導体装置の製造方法、電気光学装置の製造方法
KR101806271B1 (ko) * 2010-05-14 2017-12-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
CN102760697B (zh) * 2011-04-27 2016-08-03 株式会社半导体能源研究所 半导体装置的制造方法
US9960280B2 (en) * 2013-12-26 2018-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2017107913A (ja) * 2015-12-07 2017-06-15 株式会社ジャパンディスプレイ 薄膜トランジスタ及び薄膜トランジスタの製造方法
WO2019166906A1 (ja) * 2018-02-28 2019-09-06 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法

Also Published As

Publication number Publication date
WO2024190116A1 (ja) 2024-09-19
CN120753017A (zh) 2025-10-03
US20260006828A1 (en) 2026-01-01

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

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Effective date: 20250919