CN1203373C - 用于深紫外线辐射的光刻胶组合物 - Google Patents
用于深紫外线辐射的光刻胶组合物 Download PDFInfo
- Publication number
- CN1203373C CN1203373C CNB008167796A CN00816779A CN1203373C CN 1203373 C CN1203373 C CN 1203373C CN B008167796 A CNB008167796 A CN B008167796A CN 00816779 A CN00816779 A CN 00816779A CN 1203373 C CN1203373 C CN 1203373C
- Authority
- CN
- China
- Prior art keywords
- photoresist
- alkali
- photoetching compositions
- acid
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/122—Sulfur compound containing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/455,872 | 1999-12-07 | ||
US09/455,872 US6365322B1 (en) | 1999-12-07 | 1999-12-07 | Photoresist composition for deep UV radiation |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1408077A CN1408077A (zh) | 2003-04-02 |
CN1203373C true CN1203373C (zh) | 2005-05-25 |
Family
ID=23810591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB008167796A Expired - Fee Related CN1203373C (zh) | 1999-12-07 | 2000-11-18 | 用于深紫外线辐射的光刻胶组合物 |
Country Status (10)
Country | Link |
---|---|
US (1) | US6365322B1 (zh) |
EP (1) | EP1240553B1 (zh) |
JP (1) | JP4629944B2 (zh) |
KR (1) | KR100705373B1 (zh) |
CN (1) | CN1203373C (zh) |
AT (1) | ATE434202T1 (zh) |
DE (1) | DE60042422D1 (zh) |
MY (1) | MY125946A (zh) |
TW (1) | TW573213B (zh) |
WO (1) | WO2001042853A2 (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3509760B2 (ja) * | 2001-02-08 | 2004-03-22 | 株式会社半導体先端テクノロジーズ | 半導体装置の製造方法 |
US6586560B1 (en) * | 2001-09-18 | 2003-07-01 | Microchem Corp. | Alkaline soluble maleimide-containing polymers |
US20030215736A1 (en) * | 2002-01-09 | 2003-11-20 | Oberlander Joseph E. | Negative-working photoimageable bottom antireflective coating |
US7070914B2 (en) * | 2002-01-09 | 2006-07-04 | Az Electronic Materials Usa Corp. | Process for producing an image using a first minimum bottom antireflective coating composition |
US7214465B2 (en) | 2002-01-10 | 2007-05-08 | Fujifilm Corporation | Positive photosensitive composition |
JP2005518476A (ja) * | 2002-02-21 | 2005-06-23 | ハネウェル・インターナショナル・インコーポレーテッド | フッ素化された分子並びに、その製造及び使用法 |
WO2003095505A1 (en) * | 2002-05-07 | 2003-11-20 | Honeywell International Inc. | Fluorinated polymers |
US7208249B2 (en) * | 2002-09-30 | 2007-04-24 | Applied Materials, Inc. | Method of producing a patterned photoresist used to prepare high performance photomasks |
US20040091813A1 (en) * | 2002-11-05 | 2004-05-13 | Honeywell International Inc. | Fluorinated polymers |
US7358408B2 (en) * | 2003-05-16 | 2008-04-15 | Az Electronic Materials Usa Corp. | Photoactive compounds |
KR100586165B1 (ko) * | 2003-12-30 | 2006-06-07 | 동부일렉트로닉스 주식회사 | 바닥 반사 방지 코팅 방법 |
US7473512B2 (en) * | 2004-03-09 | 2009-01-06 | Az Electronic Materials Usa Corp. | Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof |
KR100887202B1 (ko) * | 2004-04-27 | 2009-03-06 | 도오꾜오까고오교 가부시끼가이샤 | 액침 노광 프로세스용 레지스트 보호막 형성용 재료, 및 이보호막을 이용한 레지스트 패턴 형성 방법 |
US20060008731A1 (en) * | 2004-07-09 | 2006-01-12 | Michael Van Der Puy | Novel photoresist monomers and polymers |
US20060008730A1 (en) * | 2004-07-09 | 2006-01-12 | Puy Michael V D | Monomers for photoresists bearing acid-labile groups of reduced optical density |
JP4368267B2 (ja) * | 2004-07-30 | 2009-11-18 | 東京応化工業株式会社 | レジスト保護膜形成用材料、およびこれを用いたレジストパターン形成方法 |
US7595141B2 (en) * | 2004-10-26 | 2009-09-29 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern |
JP4830442B2 (ja) * | 2005-10-19 | 2011-12-07 | Jsr株式会社 | ポジ型感放射線性樹脂組成物 |
JP4890153B2 (ja) * | 2006-08-11 | 2012-03-07 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
US7923200B2 (en) * | 2007-04-09 | 2011-04-12 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern comprising a lactam |
JP5069494B2 (ja) * | 2007-05-01 | 2012-11-07 | AzエレクトロニックマテリアルズIp株式会社 | 微細化パターン形成用水溶性樹脂組成物およびこれを用いた微細パターン形成方法 |
JP5401051B2 (ja) * | 2008-05-12 | 2014-01-29 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法および新規な化合物 |
US7745077B2 (en) | 2008-06-18 | 2010-06-29 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern |
US20100136477A1 (en) * | 2008-12-01 | 2010-06-03 | Ng Edward W | Photosensitive Composition |
US8614047B2 (en) | 2011-08-26 | 2013-12-24 | International Business Machines Corporation | Photodecomposable bases and photoresist compositions |
CN103012227A (zh) * | 2013-01-04 | 2013-04-03 | 同济大学 | 一种高光生酸量子产率硫鎓盐类光生酸剂、制备方法及其应用 |
CN113717314B (zh) * | 2021-08-26 | 2023-09-22 | 江苏集萃光敏电子材料研究所有限公司 | 一种光敏成膜树脂、光刻胶组合物及其制备方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4491628A (en) | 1982-08-23 | 1985-01-01 | International Business Machines Corporation | Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone |
EP0440374B1 (en) | 1990-01-30 | 1997-04-16 | Wako Pure Chemical Industries Ltd | Chemical amplified resist material |
KR100355254B1 (en) | 1993-02-15 | 2003-03-31 | Clariant Finance Bvi Ltd | Positive type radiation-sensitive mixture |
US5663035A (en) | 1994-04-13 | 1997-09-02 | Hoechst Japan Limited | Radiation-sensitive mixture comprising a basic iodonium compound |
US5466653A (en) * | 1994-06-29 | 1995-11-14 | E. I. Du Pont De Nemours And Company | Method for preparing negative-working wash-off relief images and non-photosensitive elements for use therein |
US5523453A (en) | 1995-03-22 | 1996-06-04 | E. I. Du Pont De Nemours And Company | Process for hydrocyanation |
JPH08262720A (ja) | 1995-03-28 | 1996-10-11 | Hoechst Ind Kk | 可塑剤を含む放射線感応性組成物 |
JP3804138B2 (ja) | 1996-02-09 | 2006-08-02 | Jsr株式会社 | ArFエキシマレーザー照射用感放射線性樹脂組成物 |
WO1997033198A1 (en) | 1996-03-07 | 1997-09-12 | The B.F. Goodrich Company | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
US5879857A (en) | 1997-02-21 | 1999-03-09 | Lucent Technologies Inc. | Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material |
US5843624A (en) | 1996-03-08 | 1998-12-01 | Lucent Technologies Inc. | Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material |
JP3808140B2 (ja) * | 1996-09-10 | 2006-08-09 | Azエレクトロニックマテリアルズ株式会社 | 新規酸感応性基で保護されたヒドロキシスチレン重合体およびこれらを含む放射線感応性材料 |
KR100265597B1 (ko) | 1996-12-30 | 2000-09-15 | 김영환 | Arf 감광막 수지 및 그 제조방법 |
KR100551653B1 (ko) | 1997-08-18 | 2006-05-25 | 제이에스알 가부시끼가이샤 | 감방사선성수지조성물 |
JP3676918B2 (ja) * | 1997-10-09 | 2005-07-27 | 富士通株式会社 | レジスト材料及びレジストパターンの形成方法 |
KR100321080B1 (ko) | 1997-12-29 | 2002-11-22 | 주식회사 하이닉스반도체 | 공중합체수지와이의제조방법및이수지를이용한포토레지스트 |
KR100292406B1 (ko) * | 1998-06-11 | 2001-07-12 | 윤종용 | 감광성중합체,용해억제제및이들을포함하는화학증폭형포토레지스트조성물 |
KR100271419B1 (ko) * | 1998-09-23 | 2001-03-02 | 박찬구 | 화학증폭형 레지스트 제조용 중합체 및 이를 함유하는 레지스트조성물 |
NL1010155C1 (nl) | 1998-09-23 | 2000-03-24 | Albertus Wolbers | Raambedekking. |
-
1999
- 1999-12-07 US US09/455,872 patent/US6365322B1/en not_active Expired - Lifetime
-
2000
- 2000-11-18 DE DE60042422T patent/DE60042422D1/de not_active Expired - Lifetime
- 2000-11-18 WO PCT/EP2000/011495 patent/WO2001042853A2/en active Search and Examination
- 2000-11-18 KR KR1020027007254A patent/KR100705373B1/ko not_active IP Right Cessation
- 2000-11-18 AT AT00981273T patent/ATE434202T1/de not_active IP Right Cessation
- 2000-11-18 JP JP2001544083A patent/JP4629944B2/ja not_active Expired - Fee Related
- 2000-11-18 EP EP00981273A patent/EP1240553B1/en not_active Expired - Lifetime
- 2000-11-18 CN CNB008167796A patent/CN1203373C/zh not_active Expired - Fee Related
- 2000-11-22 TW TW89124774A patent/TW573213B/zh not_active IP Right Cessation
- 2000-12-05 MY MYPI20005711A patent/MY125946A/en unknown
Also Published As
Publication number | Publication date |
---|---|
US6365322B1 (en) | 2002-04-02 |
WO2001042853A2 (en) | 2001-06-14 |
KR20030023604A (ko) | 2003-03-19 |
EP1240553A2 (en) | 2002-09-18 |
ATE434202T1 (de) | 2009-07-15 |
TW573213B (en) | 2004-01-21 |
MY125946A (en) | 2006-09-29 |
CN1408077A (zh) | 2003-04-02 |
KR100705373B1 (ko) | 2007-04-11 |
WO2001042853A3 (en) | 2002-05-02 |
JP4629944B2 (ja) | 2011-02-09 |
JP2003524799A (ja) | 2003-08-19 |
EP1240553B1 (en) | 2009-06-17 |
DE60042422D1 (de) | 2009-07-30 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: AZ ELECTRONIC MATERIALS JAPAN Free format text: FORMER OWNER: CLARIANT FINANCE (BVI) LTD. Effective date: 20050513 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20050513 Address after: Tokyo, Japan Patentee after: AZ Electronic Materials Japan Co., Ltd. Address before: The British Virgin Islands of Tortola Patentee before: Clariant Finance (BVI) Ltd. |
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Owner name: AZ ELECTRONIC MATERIALS IP CO., LTD. Free format text: FORMER OWNER: AZ ELECTRONIC MATERIALS JAPAN CO., LTD. Effective date: 20120926 |
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Effective date of registration: 20120926 Address after: Tokyo, Japan Patentee after: AZ Electronic Materials IP Co., Ltd. Address before: Tokyo, Japan Patentee before: AZ Electronic Materials Japan Co., Ltd. |
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Owner name: MERCK PATENT GMBH Free format text: FORMER OWNER: AZ ELECTRONIC MATERIALS IP CO., LTD. Effective date: 20150414 |
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Effective date of registration: 20150414 Address after: Darmstadt Patentee after: Merck Patent GmbH Address before: Tokyo, Japan Patentee before: AZ Electronic Materials IP Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050525 Termination date: 20171118 |
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CF01 | Termination of patent right due to non-payment of annual fee |