CN120225576A - 共聚物、其制造方法及包含共聚物的固化体 - Google Patents

共聚物、其制造方法及包含共聚物的固化体 Download PDF

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Publication number
CN120225576A
CN120225576A CN202380078520.1A CN202380078520A CN120225576A CN 120225576 A CN120225576 A CN 120225576A CN 202380078520 A CN202380078520 A CN 202380078520A CN 120225576 A CN120225576 A CN 120225576A
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CN
China
Prior art keywords
copolymer
less
olefin
unit
aromatic
Prior art date
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Pending
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CN202380078520.1A
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English (en)
Chinese (zh)
Inventor
荒井亨
前田雄大
菅藤谅介
中野辰哉
石垣雄平
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Denka Co Ltd
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Denka Co Ltd
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Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN120225576A publication Critical patent/CN120225576A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/448—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from other vinyl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
    • C08F4/44—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
    • C08F4/60—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides together with refractory metals, iron group metals, platinum group metals, manganese, rhenium technetium or compounds thereof
    • C08F4/62—Refractory metals or compounds thereof
    • C08F4/64—Titanium, zirconium, hafnium or compounds thereof
    • C08F4/659—Component covered by group C08F4/64 containing a transition metal-carbon bond
    • C08F4/6592—Component covered by group C08F4/64 containing a transition metal-carbon bond containing at least one cyclopentadienyl ring, condensed or not, e.g. an indenyl or a fluorenyl ring
    • C08F4/65922—Component covered by group C08F4/64 containing a transition metal-carbon bond containing at least one cyclopentadienyl ring, condensed or not, e.g. an indenyl or a fluorenyl ring containing at least two cyclopentadienyl rings, fused or not
    • C08F4/65927—Component covered by group C08F4/64 containing a transition metal-carbon bond containing at least one cyclopentadienyl ring, condensed or not, e.g. an indenyl or a fluorenyl ring containing at least two cyclopentadienyl rings, fused or not two cyclopentadienyl rings being mutually bridged
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
    • C08F4/44—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
    • C08F4/60—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides together with refractory metals, iron group metals, platinum group metals, manganese, rhenium technetium or compounds thereof
    • C08F4/62—Refractory metals or compounds thereof
    • C08F4/64—Titanium, zirconium, hafnium or compounds thereof
    • C08F4/659—Component covered by group C08F4/64 containing a transition metal-carbon bond
    • C08F4/65908—Component covered by group C08F4/64 containing a transition metal-carbon bond in combination with an ionising compound other than alumoxane, e.g. (C6F5)4B-X+
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
    • C08F4/44—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
    • C08F4/60—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides together with refractory metals, iron group metals, platinum group metals, manganese, rhenium technetium or compounds thereof
    • C08F4/62—Refractory metals or compounds thereof
    • C08F4/64—Titanium, zirconium, hafnium or compounds thereof
    • C08F4/659—Component covered by group C08F4/64 containing a transition metal-carbon bond
    • C08F4/65912—Component covered by group C08F4/64 containing a transition metal-carbon bond in combination with an organoaluminium compound

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN202380078520.1A 2022-12-27 2023-12-27 共聚物、其制造方法及包含共聚物的固化体 Pending CN120225576A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022210778 2022-12-27
JP2022-210778 2022-12-27
JP2023125660 2023-08-01
JP2023-125660 2023-08-01
PCT/JP2023/047110 WO2024143509A1 (ja) 2022-12-27 2023-12-27 共重合体、その製造方法及び共重合体を含む硬化体

Publications (1)

Publication Number Publication Date
CN120225576A true CN120225576A (zh) 2025-06-27

Family

ID=91717872

Family Applications (1)

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CN202380078520.1A Pending CN120225576A (zh) 2022-12-27 2023-12-27 共聚物、其制造方法及包含共聚物的固化体

Country Status (6)

Country Link
EP (1) EP4644439A4 (https=)
JP (2) JP7652996B2 (https=)
KR (1) KR20250103771A (https=)
CN (1) CN120225576A (https=)
TW (1) TW202444769A (https=)
WO (1) WO2024143509A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026009902A1 (ja) * 2024-07-03 2026-01-08 デンカ株式会社 低誘電放熱材
JP2026008903A (ja) * 2024-07-03 2026-01-19 デンカ株式会社 共重合体、共重合体を含む組成物およびその硬化体

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2746277B2 (ja) * 1989-09-07 1998-05-06 三井化学株式会社 環状オレフィン系重合体の接着方法
DE59206948D1 (de) 1991-11-30 1996-09-26 Hoechst Ag Metallocene mit benzokondensierten Indenylderivaten als Liganden, Verfahren zu ihrer Herstellung und ihre Verwendung als Katalysatoren
JP2716639B2 (ja) 1992-12-24 1998-02-18 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
JPH08183813A (ja) * 1994-12-28 1996-07-16 Mitsubishi Chem Corp エチレン系共重合体の製造法
JP3659760B2 (ja) 1996-03-19 2005-06-15 電気化学工業株式会社 エチレン−芳香族ビニル化合物共重合体及びその製造方法
US6200894B1 (en) 1996-06-10 2001-03-13 International Business Machines Corporation Method for enhancing aluminum interconnect properties
JPH11130808A (ja) 1997-04-17 1999-05-18 Denki Kagaku Kogyo Kk 重合用遷移金属触媒成分、それを用いた立体規則性を有する芳香族ビニル化合物系重合体及びその製造方法
US6235855B1 (en) 1997-04-17 2001-05-22 Denki Kagaku Kogyo Kabushiki Kaisha Transition metal compound as catalyst component in method for producing aromatic vinyl compound polymer or aromatic vinyl compound-olefin copolymer having stereoregularity
US6713154B1 (en) 1997-06-06 2004-03-30 Nippon Zeon Co., Ltd. Insulating material containing cycloolefin polymer
EP0985689A1 (en) 1998-09-07 2000-03-15 Denki Kagaku Kogyo Kabushiki Kaisha Aromatic vinyl compound-ethylene copolymer and method for producing the same
WO2000020426A1 (en) 1998-10-08 2000-04-13 The Dow Chemical Company Bridged metal complexes
WO2000037517A1 (en) 1998-12-22 2000-06-29 Denki Kagaku Kogyo Kabushiki Kaisha Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof
JP2003026730A (ja) * 2001-07-18 2003-01-29 Denki Kagaku Kogyo Kk メタジビニルベンゼン含有共重合体およびその製造方法
JP3938500B2 (ja) 2002-01-21 2007-06-27 株式会社日立製作所 低誘電正接化方法及びそれを用いた低誘電正接樹脂組成物及び電気部品
JP3985633B2 (ja) 2002-08-26 2007-10-03 株式会社日立製作所 低誘電正接絶縁材料を用いた高周波用電子部品
KR100501398B1 (ko) * 2003-01-15 2005-07-18 삼성토탈 주식회사 긴가지를 갖는 α-올레핀/환상올레핀/디엔 공중합체 및 그제조방법
JP4587679B2 (ja) 2004-02-27 2010-11-24 丸善石油化学株式会社 芳香族含有環状オレフィン共重合体の製造方法
JP2006192392A (ja) 2005-01-14 2006-07-27 Honda Motor Co Ltd ウインドガラス接着剤塗布の前処理装置及びその方法
JP4870072B2 (ja) 2005-04-28 2012-02-08 三井化学株式会社 α−オレフィン・環状オレフィン・ポリエン共重合体およびその製造方法
JP2009161743A (ja) 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP5481098B2 (ja) * 2009-06-03 2014-04-23 電気化学工業株式会社 後硬化性樹脂組成物及びそれを用いた電気絶縁材料
JP6668012B2 (ja) 2014-08-08 2020-03-18 ポリプラスチックス株式会社 金属樹脂積層体及び高周波用配線基板
US10434750B2 (en) 2015-01-13 2019-10-08 Hitachi Chemical Company, Ltd. Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board
JP6995534B2 (ja) 2016-08-31 2022-01-14 日鉄ケミカル＆マテリアル株式会社 可溶性多官能ビニル芳香族共重合体、その製造方法、硬化性樹脂組成物及びその硬化物
CN110461891B (zh) 2017-03-30 2022-08-30 日铁化学材料株式会社 可溶性多官能乙烯基芳香族共聚合物、其制造方法以及硬化性树脂组合物及其应用
CN111247177A (zh) 2017-10-20 2020-06-05 株式会社普利司通 多元共聚物、橡胶组合物、交联橡胶组合物、橡胶制品和轮胎
CN119161537A (zh) 2019-12-03 2024-12-20 电化株式会社 共聚物及含有其的层叠体
JP7347224B2 (ja) 2020-01-15 2023-09-20 株式会社デンソー 通信システム
JP7294155B2 (ja) 2020-01-15 2023-06-20 株式会社デンソー 制御装置
CN118599041A (zh) * 2020-07-15 2024-09-06 电化株式会社 组合物及固化体
CN111909317B (zh) * 2020-07-24 2021-05-07 四川大学 一种具有高吸油性能的改性橡胶及其制备工艺

Also Published As

Publication number Publication date
JP2025130669A (ja) 2025-09-08
JP7849435B2 (ja) 2026-04-21
KR20250103771A (ko) 2025-07-07
EP4644439A4 (en) 2026-04-22
JP7652996B2 (ja) 2025-03-27
WO2024143509A1 (ja) 2024-07-04
JPWO2024143509A1 (https=) 2024-07-04
EP4644439A1 (en) 2025-11-05
TW202444769A (zh) 2024-11-16

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