CN120188598A - 复合基板 - Google Patents

复合基板 Download PDF

Info

Publication number
CN120188598A
CN120188598A CN202380072934.3A CN202380072934A CN120188598A CN 120188598 A CN120188598 A CN 120188598A CN 202380072934 A CN202380072934 A CN 202380072934A CN 120188598 A CN120188598 A CN 120188598A
Authority
CN
China
Prior art keywords
piezoelectric layer
layer
piezoelectric
composite substrate
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380072934.3A
Other languages
English (en)
Chinese (zh)
Inventor
鹈野雄大
多井知义
滑川政彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN120188598A publication Critical patent/CN120188598A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H10N30/097—Forming inorganic materials by sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
CN202380072934.3A 2022-11-18 2023-11-17 复合基板 Pending CN120188598A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022185043 2022-11-18
JP2022-185043 2022-11-18
PCT/JP2023/041547 WO2024106543A1 (ja) 2022-11-18 2023-11-17 複合基板

Publications (1)

Publication Number Publication Date
CN120188598A true CN120188598A (zh) 2025-06-20

Family

ID=91084683

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380072934.3A Pending CN120188598A (zh) 2022-11-18 2023-11-17 复合基板

Country Status (5)

Country Link
US (1) US20250268107A1 (https=)
JP (1) JP7834197B2 (https=)
CN (1) CN120188598A (https=)
DE (1) DE112023003487T5 (https=)
WO (1) WO2024106543A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744030Y2 (ja) * 1987-03-10 1995-10-09 東陶機器株式会社 モノモルフ型アクチュエ−タ−
JPH0587514A (ja) * 1991-09-30 1993-04-06 Canon Inc カンチレバー状変位素子、カンチレバー型プローブ及びそれを用いた情報処理装置と走査型トンネル顕微鏡
JPH0738360A (ja) * 1993-07-19 1995-02-07 Matsushita Electric Ind Co Ltd 圧電複合基板の製造方法
JPH1051262A (ja) * 1996-04-16 1998-02-20 Matsushita Electric Ind Co Ltd 圧電振動子とその製造方法
JP5836755B2 (ja) * 2011-10-04 2015-12-24 富士フイルム株式会社 圧電体素子及び液体吐出ヘッド
JP7199195B2 (ja) 2018-10-17 2023-01-05 太陽誘電株式会社 弾性波デバイスおよび複合基板
JP7269719B2 (ja) 2018-12-05 2023-05-09 太陽誘電株式会社 圧電膜およびその製造方法、圧電デバイス、共振器、フィルタ並びにマルチプレクサ
WO2022210182A1 (ja) 2021-03-30 2022-10-06 日東電工株式会社 圧電体膜の製造方法、圧電素子の製造方法及び圧電デバイスの製造方法

Also Published As

Publication number Publication date
WO2024106543A1 (ja) 2024-05-23
US20250268107A1 (en) 2025-08-21
DE112023003487T5 (de) 2025-07-03
JPWO2024106543A1 (https=) 2024-05-23
JP7834197B2 (ja) 2026-03-23

Similar Documents

Publication Publication Date Title
CN111244263B (zh) 压电薄膜元件
CN103283051B (zh) 压电元件、液体排出头、超声马达和灰尘去除装置
US8269402B2 (en) BNT-BKT-BT piezoelectric composition, element and methods of manufacturing
CN103261119B (zh) 压电陶瓷、其制造方法、压电元件、排液头、超声波马达和除尘装置
US20170345992A1 (en) Stacked film, electronic device substrate, electronic device, and method of fabricating stacked film
US20240251682A1 (en) Composite substrate and method for producing composite substrate
JP7588007B2 (ja) 圧電薄膜、圧電薄膜素子及び圧電トランスデューサ
KR102590568B1 (ko) 이종 접합 반도체 기판, 그의 제조방법 및 그를 이용한 전자소자
CN120188598A (zh) 复合基板
JP2011251866A (ja) 圧電／電歪セラミックス焼結体及び圧電／電歪素子
TWI914558B (zh) 複合基板、壓電元件及複合基板之製造方法
KR101006958B1 (ko) 유기물을 함유하는 센서용 압전 후막 및 이의 제조방법
CN121264198A (zh) 复合基板及复合基板的制造方法
KR20240080377A (ko) 유전특성이 우수한 이종 접합 반도체 기판, 그의 제조방법 및 그를 이용한 전자소자
CN121176190A (zh) 层叠构造体及其使用和制造装置
JP7713272B1 (ja) 薄膜圧電デバイス
JP7711996B1 (ja) 積層構造体及びその製造方法
JP7832814B2 (ja) 圧電薄膜及び圧電薄膜素子
KR100805304B1 (ko) 과량의 산화납을 첨가하여 제작된 ｐｚｔ계 후막의제조방법
CN121176191A (zh) 层叠构造体及其使用和制造装置
WO2025182412A1 (ja) 圧電薄膜、及び圧電薄膜素子
CN119451541A (zh) 压电薄膜、压电薄膜元件及压电换能器
CN112687790A (zh) 压电陶瓷及其制造方法以及压电元件

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination