DE112023003487T5 - Verbundsubstrat - Google Patents

Verbundsubstrat Download PDF

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Publication number
DE112023003487T5
DE112023003487T5 DE112023003487.7T DE112023003487T DE112023003487T5 DE 112023003487 T5 DE112023003487 T5 DE 112023003487T5 DE 112023003487 T DE112023003487 T DE 112023003487T DE 112023003487 T5 DE112023003487 T5 DE 112023003487T5
Authority
DE
Germany
Prior art keywords
piezoelectric layer
layer
piezoelectric
composite substrate
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023003487.7T
Other languages
German (de)
English (en)
Inventor
Yudai Uno
Tomoyoshi Tai
Masahiko Namerikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of DE112023003487T5 publication Critical patent/DE112023003487T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H10N30/097—Forming inorganic materials by sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
DE112023003487.7T 2022-11-18 2023-11-17 Verbundsubstrat Pending DE112023003487T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022185043 2022-11-18
JP2022-185043 2022-11-18
PCT/JP2023/041547 WO2024106543A1 (ja) 2022-11-18 2023-11-17 複合基板

Publications (1)

Publication Number Publication Date
DE112023003487T5 true DE112023003487T5 (de) 2025-07-03

Family

ID=91084683

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023003487.7T Pending DE112023003487T5 (de) 2022-11-18 2023-11-17 Verbundsubstrat

Country Status (5)

Country Link
US (1) US20250268107A1 (https=)
JP (1) JP7834197B2 (https=)
CN (1) CN120188598A (https=)
DE (1) DE112023003487T5 (https=)
WO (1) WO2024106543A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744030Y2 (ja) * 1987-03-10 1995-10-09 東陶機器株式会社 モノモルフ型アクチュエ−タ−
JPH0587514A (ja) * 1991-09-30 1993-04-06 Canon Inc カンチレバー状変位素子、カンチレバー型プローブ及びそれを用いた情報処理装置と走査型トンネル顕微鏡
JPH0738360A (ja) * 1993-07-19 1995-02-07 Matsushita Electric Ind Co Ltd 圧電複合基板の製造方法
JPH1051262A (ja) * 1996-04-16 1998-02-20 Matsushita Electric Ind Co Ltd 圧電振動子とその製造方法
JP5836755B2 (ja) * 2011-10-04 2015-12-24 富士フイルム株式会社 圧電体素子及び液体吐出ヘッド
JP7199195B2 (ja) 2018-10-17 2023-01-05 太陽誘電株式会社 弾性波デバイスおよび複合基板
JP7269719B2 (ja) 2018-12-05 2023-05-09 太陽誘電株式会社 圧電膜およびその製造方法、圧電デバイス、共振器、フィルタ並びにマルチプレクサ
WO2022210182A1 (ja) 2021-03-30 2022-10-06 日東電工株式会社 圧電体膜の製造方法、圧電素子の製造方法及び圧電デバイスの製造方法

Also Published As

Publication number Publication date
WO2024106543A1 (ja) 2024-05-23
US20250268107A1 (en) 2025-08-21
JPWO2024106543A1 (https=) 2024-05-23
JP7834197B2 (ja) 2026-03-23
CN120188598A (zh) 2025-06-20

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