JPWO2024106543A1 - - Google Patents
Info
- Publication number
- JPWO2024106543A1 JPWO2024106543A1 JP2024558962A JP2024558962A JPWO2024106543A1 JP WO2024106543 A1 JPWO2024106543 A1 JP WO2024106543A1 JP 2024558962 A JP2024558962 A JP 2024558962A JP 2024558962 A JP2024558962 A JP 2024558962A JP WO2024106543 A1 JPWO2024106543 A1 JP WO2024106543A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022185043 | 2022-11-18 | ||
| JP2022185043 | 2022-11-18 | ||
| PCT/JP2023/041547 WO2024106543A1 (ja) | 2022-11-18 | 2023-11-17 | 複合基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024106543A1 true JPWO2024106543A1 (https=) | 2024-05-23 |
| JPWO2024106543A5 JPWO2024106543A5 (https=) | 2025-06-02 |
| JP7834197B2 JP7834197B2 (ja) | 2026-03-23 |
Family
ID=91084683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024558962A Active JP7834197B2 (ja) | 2022-11-18 | 2023-11-17 | 複合基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250268107A1 (https=) |
| JP (1) | JP7834197B2 (https=) |
| CN (1) | CN120188598A (https=) |
| DE (1) | DE112023003487T5 (https=) |
| WO (1) | WO2024106543A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63142863U (https=) * | 1987-03-10 | 1988-09-20 | ||
| JPH0587514A (ja) * | 1991-09-30 | 1993-04-06 | Canon Inc | カンチレバー状変位素子、カンチレバー型プローブ及びそれを用いた情報処理装置と走査型トンネル顕微鏡 |
| JPH0738360A (ja) * | 1993-07-19 | 1995-02-07 | Matsushita Electric Ind Co Ltd | 圧電複合基板の製造方法 |
| JPH1051262A (ja) * | 1996-04-16 | 1998-02-20 | Matsushita Electric Ind Co Ltd | 圧電振動子とその製造方法 |
| JP2013080887A (ja) * | 2011-10-04 | 2013-05-02 | Fujifilm Corp | 圧電体素子及びその製造方法、並びに液体吐出ヘッド |
| JP2020065158A (ja) * | 2018-10-17 | 2020-04-23 | 太陽誘電株式会社 | 弾性波デバイスおよび複合基板 |
| JP2020092322A (ja) * | 2018-12-05 | 2020-06-11 | 太陽誘電株式会社 | 圧電膜およびその製造方法、圧電デバイス、共振器、フィルタ並びにマルチプレクサ |
| WO2022210182A1 (ja) * | 2021-03-30 | 2022-10-06 | 日東電工株式会社 | 圧電体膜の製造方法、圧電素子の製造方法及び圧電デバイスの製造方法 |
-
2023
- 2023-11-17 DE DE112023003487.7T patent/DE112023003487T5/de active Pending
- 2023-11-17 JP JP2024558962A patent/JP7834197B2/ja active Active
- 2023-11-17 CN CN202380072934.3A patent/CN120188598A/zh active Pending
- 2023-11-17 WO PCT/JP2023/041547 patent/WO2024106543A1/ja not_active Ceased
-
2025
- 2025-05-05 US US19/198,423 patent/US20250268107A1/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63142863U (https=) * | 1987-03-10 | 1988-09-20 | ||
| JPH0587514A (ja) * | 1991-09-30 | 1993-04-06 | Canon Inc | カンチレバー状変位素子、カンチレバー型プローブ及びそれを用いた情報処理装置と走査型トンネル顕微鏡 |
| JPH0738360A (ja) * | 1993-07-19 | 1995-02-07 | Matsushita Electric Ind Co Ltd | 圧電複合基板の製造方法 |
| JPH1051262A (ja) * | 1996-04-16 | 1998-02-20 | Matsushita Electric Ind Co Ltd | 圧電振動子とその製造方法 |
| JP2013080887A (ja) * | 2011-10-04 | 2013-05-02 | Fujifilm Corp | 圧電体素子及びその製造方法、並びに液体吐出ヘッド |
| JP2020065158A (ja) * | 2018-10-17 | 2020-04-23 | 太陽誘電株式会社 | 弾性波デバイスおよび複合基板 |
| JP2020092322A (ja) * | 2018-12-05 | 2020-06-11 | 太陽誘電株式会社 | 圧電膜およびその製造方法、圧電デバイス、共振器、フィルタ並びにマルチプレクサ |
| WO2022210182A1 (ja) * | 2021-03-30 | 2022-10-06 | 日東電工株式会社 | 圧電体膜の製造方法、圧電素子の製造方法及び圧電デバイスの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024106543A1 (ja) | 2024-05-23 |
| US20250268107A1 (en) | 2025-08-21 |
| DE112023003487T5 (de) | 2025-07-03 |
| JP7834197B2 (ja) | 2026-03-23 |
| CN120188598A (zh) | 2025-06-20 |
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