CN120077107A - 绝缘性树脂组合物、其固化物和电子部件 - Google Patents

绝缘性树脂组合物、其固化物和电子部件 Download PDF

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Publication number
CN120077107A
CN120077107A CN202380074190.9A CN202380074190A CN120077107A CN 120077107 A CN120077107 A CN 120077107A CN 202380074190 A CN202380074190 A CN 202380074190A CN 120077107 A CN120077107 A CN 120077107A
Authority
CN
China
Prior art keywords
resin composition
insulating resin
acrylate
meth
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380074190.9A
Other languages
English (en)
Chinese (zh)
Inventor
五十岚广龙
佐藤敏行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN120077107A publication Critical patent/CN120077107A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
CN202380074190.9A 2022-11-24 2023-10-25 绝缘性树脂组合物、其固化物和电子部件 Pending CN120077107A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022187282 2022-11-24
JP2022-187282 2022-11-24
PCT/JP2023/038447 WO2024111333A1 (ja) 2022-11-24 2023-10-25 絶縁性樹脂組成物、その硬化物及び電子部品

Publications (1)

Publication Number Publication Date
CN120077107A true CN120077107A (zh) 2025-05-30

Family

ID=91195481

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380074190.9A Pending CN120077107A (zh) 2022-11-24 2023-10-25 绝缘性树脂组合物、其固化物和电子部件

Country Status (4)

Country Link
JP (1) JPWO2024111333A1 (https=)
CN (1) CN120077107A (https=)
TW (1) TW202440776A (https=)
WO (1) WO2024111333A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007045989A (ja) * 2005-08-12 2007-02-22 Seiko Epson Corp インク組成物
JP6250458B2 (ja) * 2014-03-31 2017-12-20 アイカ工業株式会社 硬化性接着樹脂組成物および接着方法
KR20160115611A (ko) * 2015-03-27 2016-10-06 동우 화인켐 주식회사 하드코팅 형성용 조성물, 이를 이용한 광학 필름 및 화상 표시 장치
US20200102468A1 (en) * 2018-10-02 2020-04-02 Xerox Corporation Dielectric ink composition
US11085833B2 (en) * 2018-10-31 2021-08-10 Xerox Corporation Temperature sensor ink composition with metal oxide nanoparticles
US11932769B2 (en) * 2019-12-20 2024-03-19 Xerox Corporation Printable flexible overcoat ink compositions

Also Published As

Publication number Publication date
JPWO2024111333A1 (https=) 2024-05-30
WO2024111333A1 (ja) 2024-05-30
TW202440776A (zh) 2024-10-16

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