JPWO2024111333A1 - - Google Patents

Info

Publication number
JPWO2024111333A1
JPWO2024111333A1 JP2024560025A JP2024560025A JPWO2024111333A1 JP WO2024111333 A1 JPWO2024111333 A1 JP WO2024111333A1 JP 2024560025 A JP2024560025 A JP 2024560025A JP 2024560025 A JP2024560025 A JP 2024560025A JP WO2024111333 A1 JPWO2024111333 A1 JP WO2024111333A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024560025A
Other languages
Japanese (ja)
Other versions
JPWO2024111333A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024111333A1 publication Critical patent/JPWO2024111333A1/ja
Publication of JPWO2024111333A5 publication Critical patent/JPWO2024111333A5/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/02Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
JP2024560025A 2022-11-24 2023-10-25 Pending JPWO2024111333A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022187282 2022-11-24
PCT/JP2023/038447 WO2024111333A1 (ja) 2022-11-24 2023-10-25 絶縁性樹脂組成物、その硬化物及び電子部品

Publications (2)

Publication Number Publication Date
JPWO2024111333A1 true JPWO2024111333A1 (https=) 2024-05-30
JPWO2024111333A5 JPWO2024111333A5 (https=) 2026-05-01

Family

ID=91195481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024560025A Pending JPWO2024111333A1 (https=) 2022-11-24 2023-10-25

Country Status (4)

Country Link
JP (1) JPWO2024111333A1 (https=)
CN (1) CN120077107A (https=)
TW (1) TW202440776A (https=)
WO (1) WO2024111333A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007045989A (ja) * 2005-08-12 2007-02-22 Seiko Epson Corp インク組成物
JP6250458B2 (ja) * 2014-03-31 2017-12-20 アイカ工業株式会社 硬化性接着樹脂組成物および接着方法
KR20160115611A (ko) * 2015-03-27 2016-10-06 동우 화인켐 주식회사 하드코팅 형성용 조성물, 이를 이용한 광학 필름 및 화상 표시 장치
US20200102468A1 (en) * 2018-10-02 2020-04-02 Xerox Corporation Dielectric ink composition
US11085833B2 (en) * 2018-10-31 2021-08-10 Xerox Corporation Temperature sensor ink composition with metal oxide nanoparticles
US11932769B2 (en) * 2019-12-20 2024-03-19 Xerox Corporation Printable flexible overcoat ink compositions

Also Published As

Publication number Publication date
WO2024111333A1 (ja) 2024-05-30
CN120077107A (zh) 2025-05-30
TW202440776A (zh) 2024-10-16

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