TW202440776A - 絕緣性樹脂組成物、其硬化物及電子零件 - Google Patents

絕緣性樹脂組成物、其硬化物及電子零件 Download PDF

Info

Publication number
TW202440776A
TW202440776A TW112140906A TW112140906A TW202440776A TW 202440776 A TW202440776 A TW 202440776A TW 112140906 A TW112140906 A TW 112140906A TW 112140906 A TW112140906 A TW 112140906A TW 202440776 A TW202440776 A TW 202440776A
Authority
TW
Taiwan
Prior art keywords
resin composition
insulating resin
meth
acrylate
multifunctional
Prior art date
Application number
TW112140906A
Other languages
English (en)
Chinese (zh)
Inventor
五十嵐広龍
佐藤敏行
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202440776A publication Critical patent/TW202440776A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
TW112140906A 2022-11-24 2023-10-25 絕緣性樹脂組成物、其硬化物及電子零件 TW202440776A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022187282 2022-11-24
JP2022-187282 2022-11-24

Publications (1)

Publication Number Publication Date
TW202440776A true TW202440776A (zh) 2024-10-16

Family

ID=91195481

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112140906A TW202440776A (zh) 2022-11-24 2023-10-25 絕緣性樹脂組成物、其硬化物及電子零件

Country Status (4)

Country Link
JP (1) JPWO2024111333A1 (https=)
CN (1) CN120077107A (https=)
TW (1) TW202440776A (https=)
WO (1) WO2024111333A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007045989A (ja) * 2005-08-12 2007-02-22 Seiko Epson Corp インク組成物
JP6250458B2 (ja) * 2014-03-31 2017-12-20 アイカ工業株式会社 硬化性接着樹脂組成物および接着方法
KR20160115611A (ko) * 2015-03-27 2016-10-06 동우 화인켐 주식회사 하드코팅 형성용 조성물, 이를 이용한 광학 필름 및 화상 표시 장치
US20200102468A1 (en) * 2018-10-02 2020-04-02 Xerox Corporation Dielectric ink composition
US11085833B2 (en) * 2018-10-31 2021-08-10 Xerox Corporation Temperature sensor ink composition with metal oxide nanoparticles
US11932769B2 (en) * 2019-12-20 2024-03-19 Xerox Corporation Printable flexible overcoat ink compositions

Also Published As

Publication number Publication date
JPWO2024111333A1 (https=) 2024-05-30
WO2024111333A1 (ja) 2024-05-30
CN120077107A (zh) 2025-05-30

Similar Documents

Publication Publication Date Title
US10961411B2 (en) Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
JP5927177B2 (ja) ダイボンディング剤
CN107207835B (zh) 导电性树脂组合物以及半导体装置
CN102484326A (zh) 各向异性导电材料、连接结构体及连接结构体的制造方法
CN1359410A (zh) 液状热固性树脂组合物及使用其永久性填孔印刷线路板的方法
CN101077956A (zh) 挠性基板用阻焊剂组合物、挠性基板及挠性基板制造方法
JP7185289B2 (ja) 電磁波シールド用スプレー塗布剤
JP2024051882A (ja) エポキシ樹脂組成物、硬化物、及び半導体装置
JP5742219B2 (ja) （メタ）アクリレート系重合体、樹脂組成物及び成形体
JP5997697B2 (ja) 導電性樹脂組成物及びそれを使用した硬化体
JP7332129B2 (ja) 導電性組成物および導電性接着剤
CN102482547B (zh) 烃系粘着剂组合物以及使用该组合物的基板的表面处理方法
TW202440776A (zh) 絕緣性樹脂組成物、其硬化物及電子零件
TWI775798B (zh) 噴墨用樹脂組成物、電子零件及電子零件的製造方法
JP5970859B2 (ja) 三次元集積回路用の層間充填材組成物、塗布液及び三次元集積回路の製造方法
US20240117120A1 (en) Curable resin composition for bonding film, bonding film, and printed-wiring board
JP2019167435A (ja) 樹脂組成物、半導体装置及び半導体装置の製造方法
JP2018021156A (ja) 樹脂組成物、並びにこれを用いた硬化成形物、接着シート、並びに基板
JP5663780B2 (ja) アクリレート系共重合体、およびそれを含む樹脂組成物、ならびにそれをコーティングした受容層付き基板
JP2024074518A (ja) エポキシ樹脂組成物
JP7124819B2 (ja) 封止用フィルム、封止構造体及び封止構造体の製造方法
JP2014175462A (ja) 三次元集積回路の製造方法
TWI663608B (zh) 導電性樹脂組合物及半導體裝置
JP7164181B2 (ja) 電磁波シールド用スプレー塗布剤
JP2025063468A (ja) 重合体、硬化性樹脂組成物及び樹脂硬化物