CN119948582A - 层叠陶瓷电容器 - Google Patents
层叠陶瓷电容器 Download PDFInfo
- Publication number
- CN119948582A CN119948582A CN202380068714.3A CN202380068714A CN119948582A CN 119948582 A CN119948582 A CN 119948582A CN 202380068714 A CN202380068714 A CN 202380068714A CN 119948582 A CN119948582 A CN 119948582A
- Authority
- CN
- China
- Prior art keywords
- external electrode
- main surface
- ceramic capacitor
- electrode layer
- laminated ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-160614 | 2022-10-04 | ||
| JP2022160614 | 2022-10-04 | ||
| PCT/JP2023/030833 WO2024075428A1 (ja) | 2022-10-04 | 2023-08-27 | 積層セラミックコンデンサ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119948582A true CN119948582A (zh) | 2025-05-06 |
Family
ID=90607992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380068714.3A Pending CN119948582A (zh) | 2022-10-04 | 2023-08-27 | 层叠陶瓷电容器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240395464A1 (https=) |
| JP (1) | JPWO2024075428A1 (https=) |
| KR (1) | KR20250052442A (https=) |
| CN (1) | CN119948582A (https=) |
| WO (1) | WO2024075428A1 (https=) |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6418722U (https=) * | 1987-07-22 | 1989-01-30 | ||
| JPH0270402U (https=) * | 1988-11-17 | 1990-05-29 | ||
| JPH04352309A (ja) * | 1991-05-29 | 1992-12-07 | Rohm Co Ltd | 積層セラミックコンデンサにおける端子電極の構造及び端子電極の形成方法 |
| JP3427680B2 (ja) * | 1997-07-15 | 2003-07-22 | 株式会社村田製作所 | 電子部品 |
| JP2000100647A (ja) | 1998-09-24 | 2000-04-07 | Kyocera Corp | 積層セラミックコンデンサおよびその製造方法 |
| US7576968B2 (en) * | 2002-04-15 | 2009-08-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
| JP2004153098A (ja) * | 2002-10-31 | 2004-05-27 | Nec Tokin Corp | 積層セラミックコンデンサおよびその製造方法 |
| JP5526908B2 (ja) * | 2010-03-24 | 2014-06-18 | 株式会社村田製作所 | 積層型電子部品 |
| JP2012043841A (ja) * | 2010-08-13 | 2012-03-01 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法 |
| JP2012164966A (ja) * | 2011-01-21 | 2012-08-30 | Murata Mfg Co Ltd | セラミック電子部品 |
| JP2012160586A (ja) * | 2011-02-01 | 2012-08-23 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
| KR20130123661A (ko) * | 2012-05-03 | 2013-11-13 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조 방법 |
| KR101422938B1 (ko) * | 2012-12-04 | 2014-07-23 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 이의 제조방법, 기판 내장용 적층 세라믹 전자부품을 구비하는 인쇄회로기판 |
| JP2016072279A (ja) * | 2014-09-26 | 2016-05-09 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| CN205248112U (zh) * | 2015-12-04 | 2016-05-18 | 东莞市平尚电子科技有限公司 | 贴片高压电容 |
| KR102466203B1 (ko) * | 2016-03-22 | 2022-11-11 | 삼성전기주식회사 | 커패시터 및 그 제조방법 |
| JP7017893B2 (ja) * | 2017-09-25 | 2022-02-09 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| JP7131897B2 (ja) * | 2017-09-27 | 2022-09-06 | 太陽誘電株式会社 | セラミック電子部品およびその製造方法 |
| JP7196732B2 (ja) * | 2019-03-28 | 2022-12-27 | 株式会社村田製作所 | 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法 |
| JP7421328B2 (ja) * | 2019-12-24 | 2024-01-24 | 太陽誘電株式会社 | セラミック電子部品 |
| JP7401320B2 (ja) * | 2020-01-24 | 2023-12-19 | 株式会社村田製作所 | 積層セラミック電子部品 |
| JP2021120977A (ja) * | 2020-01-30 | 2021-08-19 | 株式会社村田製作所 | 積層セラミック電子部品及び積層セラミック電子部品の実装構造 |
| JP2022085195A (ja) * | 2020-11-27 | 2022-06-08 | 太陽誘電株式会社 | セラミック電子部品、実装基板およびセラミック電子部品の製造方法 |
| JP7611683B2 (ja) * | 2020-12-07 | 2025-01-10 | 太陽誘電株式会社 | セラミック電子部品、実装基板およびセラミック電子部品の製造方法 |
| JP7400758B2 (ja) * | 2021-03-16 | 2023-12-19 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP2023158299A (ja) * | 2022-04-18 | 2023-10-30 | 太陽誘電株式会社 | 積層セラミック電子部品、回路基板及び積層セラミック電子部品の製造方法 |
-
2023
- 2023-08-27 WO PCT/JP2023/030833 patent/WO2024075428A1/ja not_active Ceased
- 2023-08-27 CN CN202380068714.3A patent/CN119948582A/zh active Pending
- 2023-08-27 KR KR1020257009474A patent/KR20250052442A/ko active Pending
- 2023-08-27 JP JP2024555660A patent/JPWO2024075428A1/ja active Pending
-
2024
- 2024-08-01 US US18/791,646 patent/US20240395464A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240395464A1 (en) | 2024-11-28 |
| KR20250052442A (ko) | 2025-04-18 |
| JPWO2024075428A1 (https=) | 2024-04-11 |
| WO2024075428A1 (ja) | 2024-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI759540B (zh) | 積層陶瓷電容器 | |
| JP7275951B2 (ja) | 積層セラミックコンデンサ | |
| KR101565651B1 (ko) | 적층 세라믹 커패시터 및 그 실장 기판 | |
| JP7207837B2 (ja) | 積層セラミック電子部品の製造方法及び積層セラミック電子部品 | |
| JP7103573B2 (ja) | キャパシタ及びその製造方法 | |
| KR101197787B1 (ko) | 적층형 세라믹 캐패시터 및 이의 제조방법 | |
| KR20140081360A (ko) | 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터가 실장된 회로기판 | |
| US20140318843A1 (en) | Multilayer ceramic electronic component and mounting board therefor | |
| JP2021166219A (ja) | 積層セラミックコンデンサおよび半導体装置 | |
| KR101434103B1 (ko) | 적층 세라믹 전자부품 및 적층 세라믹 전자부품의 실장 기판 | |
| JP2022125514A (ja) | セラミック電子部品、回路基板およびセラミック電子部品の製造方法 | |
| JP4463045B2 (ja) | セラミック電子部品及びコンデンサ | |
| US20150041194A1 (en) | Multilayer ceramic electronic component, manufacturing method thereof and board for mounting the same | |
| US12237111B2 (en) | Multilayer ceramic capacitor | |
| CN111755248B (zh) | 层叠陶瓷电容器 | |
| CN110189915B (zh) | 电子组件 | |
| CN119948582A (zh) | 层叠陶瓷电容器 | |
| KR20170065444A (ko) | 적층 세라믹 전자부품 | |
| CN120019457A (zh) | 层叠陶瓷电容器 | |
| JP2022166463A (ja) | セラミック電子部品および実装基板 | |
| CN222190484U (zh) | 层叠陶瓷电容器 | |
| KR102004809B1 (ko) | 적층 세라믹 커패시터, 및 그 제조방법 | |
| KR102514236B1 (ko) | 커패시터 및 그의 제조방법 | |
| JP2024143711A (ja) | 積層セラミックコンデンサ | |
| CN119895517A (zh) | 层叠陶瓷电容器 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |