CN119948582A - 层叠陶瓷电容器 - Google Patents

层叠陶瓷电容器 Download PDF

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Publication number
CN119948582A
CN119948582A CN202380068714.3A CN202380068714A CN119948582A CN 119948582 A CN119948582 A CN 119948582A CN 202380068714 A CN202380068714 A CN 202380068714A CN 119948582 A CN119948582 A CN 119948582A
Authority
CN
China
Prior art keywords
external electrode
main surface
ceramic capacitor
electrode layer
laminated ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380068714.3A
Other languages
English (en)
Chinese (zh)
Inventor
西村亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN119948582A publication Critical patent/CN119948582A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202380068714.3A 2022-10-04 2023-08-27 层叠陶瓷电容器 Pending CN119948582A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-160614 2022-10-04
JP2022160614 2022-10-04
PCT/JP2023/030833 WO2024075428A1 (ja) 2022-10-04 2023-08-27 積層セラミックコンデンサ

Publications (1)

Publication Number Publication Date
CN119948582A true CN119948582A (zh) 2025-05-06

Family

ID=90607992

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380068714.3A Pending CN119948582A (zh) 2022-10-04 2023-08-27 层叠陶瓷电容器

Country Status (5)

Country Link
US (1) US20240395464A1 (https=)
JP (1) JPWO2024075428A1 (https=)
KR (1) KR20250052442A (https=)
CN (1) CN119948582A (https=)
WO (1) WO2024075428A1 (https=)

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JPH0270402U (https=) * 1988-11-17 1990-05-29
JPH04352309A (ja) * 1991-05-29 1992-12-07 Rohm Co Ltd 積層セラミックコンデンサにおける端子電極の構造及び端子電極の形成方法
JP3427680B2 (ja) * 1997-07-15 2003-07-22 株式会社村田製作所 電子部品
JP2000100647A (ja) 1998-09-24 2000-04-07 Kyocera Corp 積層セラミックコンデンサおよびその製造方法
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
JP2004153098A (ja) * 2002-10-31 2004-05-27 Nec Tokin Corp 積層セラミックコンデンサおよびその製造方法
JP5526908B2 (ja) * 2010-03-24 2014-06-18 株式会社村田製作所 積層型電子部品
JP2012043841A (ja) * 2010-08-13 2012-03-01 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法
JP2012164966A (ja) * 2011-01-21 2012-08-30 Murata Mfg Co Ltd セラミック電子部品
JP2012160586A (ja) * 2011-02-01 2012-08-23 Murata Mfg Co Ltd 積層セラミック電子部品およびその製造方法
KR20130123661A (ko) * 2012-05-03 2013-11-13 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조 방법
KR101422938B1 (ko) * 2012-12-04 2014-07-23 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 이의 제조방법, 기판 내장용 적층 세라믹 전자부품을 구비하는 인쇄회로기판
JP2016072279A (ja) * 2014-09-26 2016-05-09 株式会社村田製作所 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体
CN205248112U (zh) * 2015-12-04 2016-05-18 东莞市平尚电子科技有限公司 贴片高压电容
KR102466203B1 (ko) * 2016-03-22 2022-11-11 삼성전기주식회사 커패시터 및 그 제조방법
JP7017893B2 (ja) * 2017-09-25 2022-02-09 太陽誘電株式会社 積層セラミックコンデンサ
JP7131897B2 (ja) * 2017-09-27 2022-09-06 太陽誘電株式会社 セラミック電子部品およびその製造方法
JP7196732B2 (ja) * 2019-03-28 2022-12-27 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP7421328B2 (ja) * 2019-12-24 2024-01-24 太陽誘電株式会社 セラミック電子部品
JP7401320B2 (ja) * 2020-01-24 2023-12-19 株式会社村田製作所 積層セラミック電子部品
JP2021120977A (ja) * 2020-01-30 2021-08-19 株式会社村田製作所 積層セラミック電子部品及び積層セラミック電子部品の実装構造
JP2022085195A (ja) * 2020-11-27 2022-06-08 太陽誘電株式会社 セラミック電子部品、実装基板およびセラミック電子部品の製造方法
JP7611683B2 (ja) * 2020-12-07 2025-01-10 太陽誘電株式会社 セラミック電子部品、実装基板およびセラミック電子部品の製造方法
JP7400758B2 (ja) * 2021-03-16 2023-12-19 株式会社村田製作所 積層セラミックコンデンサ
JP2023158299A (ja) * 2022-04-18 2023-10-30 太陽誘電株式会社 積層セラミック電子部品、回路基板及び積層セラミック電子部品の製造方法

Also Published As

Publication number Publication date
US20240395464A1 (en) 2024-11-28
KR20250052442A (ko) 2025-04-18
JPWO2024075428A1 (https=) 2024-04-11
WO2024075428A1 (ja) 2024-04-11

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