CN119585864A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN119585864A
CN119585864A CN202380055570.8A CN202380055570A CN119585864A CN 119585864 A CN119585864 A CN 119585864A CN 202380055570 A CN202380055570 A CN 202380055570A CN 119585864 A CN119585864 A CN 119585864A
Authority
CN
China
Prior art keywords
layer
conductive
semiconductor device
coating
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380055570.8A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤央至
谷川昂平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN119585864A publication Critical patent/CN119585864A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
CN202380055570.8A 2022-07-27 2023-06-27 半导体装置 Pending CN119585864A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-119652 2022-07-27
JP2022119652 2022-07-27
PCT/JP2023/023816 WO2024024371A1 (ja) 2022-07-27 2023-06-27 半導体装置

Publications (1)

Publication Number Publication Date
CN119585864A true CN119585864A (zh) 2025-03-07

Family

ID=89706044

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380055570.8A Pending CN119585864A (zh) 2022-07-27 2023-06-27 半导体装置

Country Status (4)

Country Link
US (1) US20250157913A1 (https=)
JP (1) JPWO2024024371A1 (https=)
CN (1) CN119585864A (https=)
WO (1) WO2024024371A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4234518B2 (ja) * 2003-07-25 2009-03-04 新光電気工業株式会社 半導体搭載用基板製造方法、半導体パッケージ製造方法、半導体搭載用基板及び半導体パッケージ
JP6327058B2 (ja) * 2014-08-18 2018-05-23 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、接合体の製造方法、パワーモジュール用基板の製造方法、及び、ヒートシンク付パワーモジュール用基板の製造方法
CN110476244B (zh) * 2017-03-31 2023-11-03 罗姆股份有限公司 功率模块及其制造方法
TWI787554B (zh) * 2018-10-31 2022-12-21 日商三菱綜合材料股份有限公司 附有金屬層之碳質構件，及熱傳導板

Also Published As

Publication number Publication date
JPWO2024024371A1 (https=) 2024-02-01
WO2024024371A1 (ja) 2024-02-01
US20250157913A1 (en) 2025-05-15

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