JPWO2024024371A1 - - Google Patents
Info
- Publication number
- JPWO2024024371A1 JPWO2024024371A1 JP2024536872A JP2024536872A JPWO2024024371A1 JP WO2024024371 A1 JPWO2024024371 A1 JP WO2024024371A1 JP 2024536872 A JP2024536872 A JP 2024536872A JP 2024536872 A JP2024536872 A JP 2024536872A JP WO2024024371 A1 JPWO2024024371 A1 JP WO2024024371A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/66—Conductive materials thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022119652 | 2022-07-27 | ||
| PCT/JP2023/023816 WO2024024371A1 (ja) | 2022-07-27 | 2023-06-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024024371A1 true JPWO2024024371A1 (https=) | 2024-02-01 |
| JPWO2024024371A5 JPWO2024024371A5 (https=) | 2025-04-03 |
Family
ID=89706044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024536872A Pending JPWO2024024371A1 (https=) | 2022-07-27 | 2023-06-27 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250157913A1 (https=) |
| JP (1) | JPWO2024024371A1 (https=) |
| CN (1) | CN119585864A (https=) |
| WO (1) | WO2024024371A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4234518B2 (ja) * | 2003-07-25 | 2009-03-04 | 新光電気工業株式会社 | 半導体搭載用基板製造方法、半導体パッケージ製造方法、半導体搭載用基板及び半導体パッケージ |
| JP6327058B2 (ja) * | 2014-08-18 | 2018-05-23 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板、接合体の製造方法、パワーモジュール用基板の製造方法、及び、ヒートシンク付パワーモジュール用基板の製造方法 |
| CN110476244B (zh) * | 2017-03-31 | 2023-11-03 | 罗姆股份有限公司 | 功率模块及其制造方法 |
| TWI787554B (zh) * | 2018-10-31 | 2022-12-21 | 日商三菱綜合材料股份有限公司 | 附有金屬層之碳質構件，及熱傳導板 |
-
2023
- 2023-06-27 JP JP2024536872A patent/JPWO2024024371A1/ja active Pending
- 2023-06-27 CN CN202380055570.8A patent/CN119585864A/zh active Pending
- 2023-06-27 WO PCT/JP2023/023816 patent/WO2024024371A1/ja not_active Ceased
-
2025
- 2025-01-17 US US19/027,589 patent/US20250157913A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024024371A1 (ja) | 2024-02-01 |
| US20250157913A1 (en) | 2025-05-15 |
| CN119585864A (zh) | 2025-03-07 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241226 |