CN1189937C - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN1189937C
CN1189937C CNB001342266A CN00134226A CN1189937C CN 1189937 C CN1189937 C CN 1189937C CN B001342266 A CNB001342266 A CN B001342266A CN 00134226 A CN00134226 A CN 00134226A CN 1189937 C CN1189937 C CN 1189937C
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China
Prior art keywords
fin
forms
radiator
ligule
heat
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Expired - Fee Related
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CNB001342266A
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English (en)
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CN1291788A (zh
Inventor
太田圭一郎
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Resonac Holdings Corp
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Showa Denko KK
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068—Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Body Structure For Vehicles (AREA)
  • Domestic Hot-Water Supply Systems And Details Of Heating Systems (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Floor Finish (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Resistance Heating (AREA)

Abstract

一种散热器，在散热基板的单面上至少按1列设置多个舌状散热片，各舌状散热片的前端形成为圆弧状，仅圆弧状前端部分整体内的中央部分向前方弯曲来形成卷曲部分，中央部分以外的两侧端部不弯曲而保存原来的弧状部分。

Description

散热器
技术领域
本发明涉及安装半导体元件等发热物或安装在装有发热物的电子装置上的用于散发发热物产生的热量的散热器。
通过说明书和权利要求，所谓‘铝’这样的用语包括纯铝、含有少量杂质的市场销售的铝和铝合金。此外，‘前’指散热片的图4的右侧。
背景技术
众所周知，以往，在散热基板的单面上至少设置一列有多个方形舌状散热片的散热器中，为了使散热片的高度在预定的公差范围内，和为了防止切手，使各散热片的前端部分整体向前方弯曲，形成卷曲状部分。
使用按向前方突出的状态安装卷曲状形成部件的切削工具来形成卷曲状部分，其中被切削并向上延伸的散热片前端碰到装有其下端有前倾面的刀具的前后滑动块的上端，被卷曲状形成部件引导，使得其前端部为向前方弯曲状。
可是，由于切削的散热片为方形，因而其水平直线状前端整体地同时撞到卷曲状形成部件下面。结果，散热片可能压曲变形，由于卷曲状部分的两侧端基部在散热片的两侧边缘角部，仍然存在时常切手的可能性，因而难以很好地保证安全性。
发明内容
本发明的目的在于提供一种散热器，在散热片的卷曲状部分形成时散热片不可能压曲变形，此外也不可能被散热片切手。
本发明的散热器，在散热基板的单面上至少按1列设置有多个舌状散热片，各舌状散热片的前端形成为凸圆弧状，并且凸圆弧状前端部分整体中，仅中央部分向前方弯曲来形成卷曲部分，中央部分以外的两侧端部不弯曲而保存原来的弧状部分，由此在卷曲状部分形成时不产生散热片的压曲变形，并且也不会出现时常切手那样的事情，可确保安全性。
附图说明
图1是表示本发明散热器的具体例的正面图。
图2是图1的散热器的透视图。
图3是用于制造本发明散热器的铝挤压成形材料制的散热器坯料的透视图。
图4是表示卷曲状部分的形成过程的局部纵剖面图。
图5是以往的散热器的透视图。
图6是用于制造以往的散热器的铝挤压成形材料制散热器坯料的透视图。
具体实施方式
下面，参照附图，一边与以往例进行比较，来说明本发明的具体例。
图1和图2所示的本发明的散热器(1)，在散热基板(2)的单面上按2列设置多个舌状散热片(3)，各舌状散热片(3)的前端(4)形成为圆弧状，圆弧状前端部分整体中，仅中央部分向前弯曲来形成卷曲部分(5)，中央部分以外的两侧端部不弯曲，而保存原来的弧状部分(6)。
制造上述散热器(1)的情况是，首先，如图3所示，成形铝挤压成形材料制的散热器坯料(10)，其中，在散热基板形成部分(7)的上面，有上面(8)的横截面为凸圆弧状并且与舌状散热片(3)的列数对应的2列散热片形成凸条(9)。
接着，如图4所示，使用按向前方突出的状态安装卷曲状形成部件(14)的切削工具(15)，从2个散热片形成凸条(9)的一端部开始，按一定间隔切削舌状散热片(3)，其中被切削并向上延伸的散热片前端撞到装有其下端有前倾面(11)的刀具(12)的前后滑动块(13)的上端，被卷曲状形成部件(14)引导，使得该前端部分呈向前方弯曲的形状。这种情况下，由于散热片形成凸条(9)的上面(8)的横截面为凸圆弧状，因而被切削并向上延伸的散热片(3)的前端必然成为圆弧形状。
另一方面，如图5所示，以往的散热器(21)，在散热基板(22)的单面上按2列设置多个方形舌状散热片(23)，各散热片(23)的前端部分整体向前方弯曲来形成卷曲部(24)。
如图6所示，上述以往的散热器(21)是这样的，成形铝挤压成形材料制的散热器坯料(28)，其中在散热基板形成部分(25)的上面，一体地设置上面(26)的横截面为水平直线且与舌状散热片(23)的列数对应的2列散热片形成凸条(27)，用切削工具(15)，从其一端侧按一定的间隔切削散热片形成凸条(27)，形成多个舌状散热片(23)。由于切削撬起的散热片(23)为方形，如前所述，因其水平直线状前端(29)整体地同时撞到卷曲状形成部件(14)下面，因而散热片(23)可能产生压曲变形，此外，由于卷曲状部分(24)的两侧端部(30)在散热片(23)的两侧边缘角部，因而不能保证安全性。
可是，按照本发明，由于切削撬起的舌状散热片(3)的前端为圆弧状，因而与切削工具(15)的卷曲状形成部件(14)最初点接触，然后逐渐扩大接触面，同时仅使中央部分弯曲，形成卷曲部分(5)。因而，散热片(3)不产生压曲变形。由于中央部以外的两侧端部不弯曲而保存原来的弧状部分(6)，因而在散热片(3)侧边缘线上不存在成为时常切手的原因的卷曲状部分的两端基部。

Claims (2)

1.一种散热器，在散热基板的单面上至少按1列设置多个舌状散热片，各舌状散热片的前端形成为凸圆弧状，凸圆弧状前端部分整体中，仅中央部分向前方弯曲来形成卷曲部分，中央部分以外的两侧端部不弯曲而保存原来的弧状部分。
2.如权利要求1的散热器，坯料是在散热基板形成部分的上面具有散热片形成凸条的铝挤压成形材料制的材料，所述散热片形成凸条，其上面的横截面为凸圆弧状且其数量与舌状散热片的列数对应。
CNB001342266A 1999-10-04 2000-09-30 散热器 Expired - Fee Related CN1189937C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28230799 1999-10-04
JP282307/1999 1999-10-04

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CN1291788A CN1291788A (zh) 2001-04-18
CN1189937C true CN1189937C (zh) 2005-02-16

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US (1) US6349762B2 (zh)
EP (1) EP1091403B1 (zh)
KR (1) KR100719859B1 (zh)
CN (1) CN1189937C (zh)
AT (1) ATE322082T1 (zh)
CA (1) CA2322077A1 (zh)
DE (1) DE60026913T2 (zh)
TW (1) TW473609B (zh)

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JP4793838B2 (ja) * 2004-01-28 2011-10-12 中村製作所株式会社 放熱器の製造方法
TW200536463A (en) * 2004-04-20 2005-11-01 Via Tech Inc A dissipating device and manufacturing method thereof
JP4888721B2 (ja) * 2007-07-24 2012-02-29 中村製作所株式会社 板状のフィンを有する放熱器の製造方法
CN101749980B (zh) * 2008-12-22 2012-12-26 富准精密工业(深圳)有限公司 散热鳍片、散热器及电子装置
CN101848622B (zh) * 2009-03-24 2013-07-03 富准精密工业(深圳)有限公司 散热器及电子装置
CN101995185A (zh) * 2010-11-02 2011-03-30 三花丹佛斯（杭州）微通道换热器有限公司 用于换热器的翅片以及具有该翅片的换热器
CN103874394B (zh) * 2012-12-18 2017-01-04 国网山东省电力公司德州供电公司 电子装置及其散热器模组
DE202014002060U1 (de) 2014-03-06 2015-04-08 HKR Seuffer Automotive GmbH & Co. KG Kühleinrichtung und Kühlanordnung mit der Kühleinrichtung
JP6239809B1 (ja) * 2016-07-01 2017-11-29 かがつう株式会社 ヒートシンク及び電子部品パッケージ
JP7343166B2 (ja) * 2019-11-13 2023-09-12 ナカムラマジック株式会社 ヒートシンクの製造方法及びヒートシンク

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Publication number Publication date
CA2322077A1 (en) 2001-04-04
US6349762B2 (en) 2002-02-26
EP1091403B1 (en) 2006-03-29
EP1091403A2 (en) 2001-04-11
CN1291788A (zh) 2001-04-18
US20020007942A1 (en) 2002-01-24
DE60026913D1 (de) 2006-05-18
EP1091403A3 (en) 2003-01-15
TW473609B (en) 2002-01-21
ATE322082T1 (de) 2006-04-15
KR100719859B1 (ko) 2007-05-21
KR20010070106A (ko) 2001-07-25
DE60026913T2 (de) 2006-08-31

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